X-On Electronics has gained recognition as a prominent supplier of BM92A20MWV-ZE2 USB Interface IC across the USA, India, Europe, Australia, and various other global locations. BM92A20MWV-ZE2 USB Interface IC are a product manufactured by ROHM. We provide cost-effective solutions for USB Interface IC, ensuring timely deliveries around the world.

BM92A20MWV-ZE2 ROHM

Name: BM92A20MWV-ZE2
Brand: ROHM
SKU: BM92A20MWVZE2_ROHM
Availability: InStock
Rating: 5 (11 reviews)

BM92A20MWV-ZE2 electronic component of ROHM

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Part No.	BM92A20MWV-ZE2
Manufacturer:	ROHM
Category:	USB Interface IC
Description:	USB Interface IC Provider, DFP Pwr Sply USB Type-C
Datasheet:	BM92A20MWV-ZE2 Datasheet (PDF)
	Large This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges

Price (USD)

9: USD 3.679 ea
Line Total: USD 33.11

Availability - 48
Ship by Fri. 27 Dec to Thu. 02 Jan

MOQ: 9 Multiples: 1
Pack Size: 1

BM92A20MWV-ZE2 More Buying Options & Price Grid(s)

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Availability Price Buy Price Quantity

48

Ship by Fri. 27 Dec to Thu. 02 Jan

MOQ : 9
Multiples : 1

9 : USD 3.679
15 : USD 3.341
75 : USD 3.146
250 : USD 3.003
1250 : USD 2.808

We are delighted to provide the BM92A20MWV-ZE2 from our USB Interface IC category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the BM92A20MWV-ZE2 and other electronic components in the USB Interface IC category and beyond.

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Additional Infomation About Product

IFB Datasheet USB Type-C Power Delivery Controller BM92A20MWV-Z General Description Key Specifications BM92A20MWV-Z is a full function USB Type-C Power VBUS Voltage Range: 4.75 V to 20 V Delivery (PD) controller that supports USB Power Power Consumption at Sleep Power: 0.4 mW (Typ) Delivery using baseband communication. Operating Temperature Range: -30 C to +105 C BM92A20MWV-Z includes PD policy engine support and operates independently. In addition, this IC has the error Applications amplifier of the secondary side for variable output PD AC Consumer Applications: AC Adapters, Chargers adapter systems. Package W(Typ) x D(Typ) x H(Max) Features UQFN40V5050A 5.00 mm x 5.00 mm x 1.00 mm USB Type-C Specification Compatible USB PD Specification Compatible (BMC-PHY) Two Power Path Control using N-ch MOSFET Drivers with Back Flow Prevention Type-C Cable Orientation Detection Supports DFP-Source mode Integrated Secondary Side of AC-Adapter System EC-less Operation (Auto mode) Typical Application Circuit Vo VBUS + IFB ACDC Primary Side VCCIN VDDIO VCONN IN Open SMDATA (or 5 V Source) SMCLK CC1 CC1 VDDIO CC2 CC2 GPIO0 GPIO1 USB Type-C VSVR XCLPOFF1 Receptacle BM92A20MWV-Z or XCLPOFF2 Captive Cable GPIO7 GPIO6 UQFN40V5050A GPIO5 GPIO4 For D+ DBGMODDT BC1.2 VCCIN VDDIO DCP D- DBGRSTCK IDSEL/ATST1 VSTR/ATST2 XRST VCCIN GND Product structure : Silicon monolithic integrated circuit This product has no designed protection against radioactive rays www.rohm.com TSZ02201-0232AA000650-1-2 2016 ROHM Co., Ltd. All rights reserved. 1/27 TSZ22111 14 001 19.Jan.2018 Rev.003 S2 DRV G2 CSENSEN S2 DRV SRC S2 DRV G1 CSENSEP GPO3/FB VCCIN GPO2/VDIV LDO15ACAP VEX LDO28CAP S1 DRV G2 LDO15DCAP S1 DRV SRC GND S1 DRV G1 GND GND VB EXP-PAD DSCHGBM92A20MWV-Z Contents General Description ........................................................................................................................................................................ 1 Features.......................................................................................................................................................................................... 1 Key Specifications ........................................................................................................................................................................... 1 Applications .................................................................................................................................................................................... 1 Package W (Typ) x D(Typ) x H(Max) ..................................................................................................................................... 1 Typical Application Circuit ............................................................................................................................................................... 1 Contents ......................................................................................................................................................................................... 2 Notation .......................................................................................................................................................................................... 3 Reference ....................................................................................................................................................................................... 3 Pin Configuration ............................................................................................................................................................................ 4 Pin Descriptions .............................................................................................................................................................................. 5 Block Diagram ................................................................................................................................................................................ 6 Absolute Maximum Ratings (Ta=25 C) .......................................................................................................................................... 7 (Note 3) Thermal Resistance ............................................................................................................................................................... 7 Recommended Operating Conditions ............................................................................................................................................. 8 Electrical Characteristics................................................................................................................................................................. 8 1. Internal Memory Cell Characteristics .............................................................................................................................. 8 2. Circuit Power Characteristics .......................................................................................................................................... 8 3. Digital Pin DC Characteristics ......................................................................................................................................... 9 4. Power Supply Management .......................................................................................................................................... 10 5. CC PHY ....................................................................................................................................................................... 12 6. Voltage Detection .......................................................................................................................................................... 14 7. VBUS Discharge ........................................................................................................................................................... 14 8. Power FET Gate Driver ................................................................................................................................................. 15 9. ACDC Bridge ................................................................................................................................................................ 16 Timing Chart ................................................................................................................................................................................. 17 1. Power On Sequence ..................................................................................................................................................... 17 2. Reset Timing ................................................................................................................................................................. 17 3. Power Off Sequence ..................................................................................................................................................... 17 Application Example ..................................................................................................................................................................... 18 Selection of Components Externally Connected ........................................................................................................................... 18 I/O Equivalence Circuit ................................................................................................................................................................. 19 Operational Notes ......................................................................................................................................................................... 23 1. Reverse Connection of Power Supply ........................................................................................................................... 23 2. Power Supply Lines ...................................................................................................................................................... 23 3. Ground Voltage ............................................................................................................................................................. 23 4. Ground Wiring Pattern .................................................................................................................................................. 23 5. Recommended Operating Conditions ........................................................................................................................... 23 6. Inrush Current ............................................................................................................................................................... 23 7. Operation Under Strong Electromagnetic Field ............................................................................................................. 23 8. Testing on Application Boards ....................................................................................................................................... 23 9. Inter-pin Short and Mounting Errors .............................................................................................................................. 24 10. Unused Input Pins ......................................................................................................................................................... 24 11. Regarding the Input Pin of the IC .................................................................................................................................. 24 12. Ceramic Capacitor ........................................................................................................................................................ 24 13. Area of Safe Operation (ASO) ...................................................................................................................................... 24 14. Over Current Protection Circuit (OCP) .......................................................................................................................... 24 Ordering Information ..................................................................................................................................................................... 25 Marking Diagrams ......................................................................................................................................................................... 25 Physical Dimension and Packing Information ............................................................................................................................... 26 Revision History ............................................................................................................................................................................ 27 www.rohm.com TSZ02201-0232AA000650-1-2 2016 ROHM Co., Ltd. All rights reserved. 2/27 TSZ22111 15 001 19.Jan.2018 Rev.003

HS Compliance

Tariff Desc

8542.39.23 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products Free

Electronic integrated circuits- Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits

LAPIS Semiconductor may also be referenced as

RHE
RHM
ROHM Semicon
ROHM Semiconductor

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BM92A20MWV-ZE2 ROHM

BM92A20MWV-ZE2 More Buying Options & Price Grid(s)

Specifications

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Availability	Price	Buy Price	Quantity
48 Ship by Fri. 27 Dec to Thu. 02 Jan MOQ : 9 Multiples : 1	9 : USD 3.679 15 : USD 3.341 75 : USD 3.146 250 : USD 3.003 1250 : USD 2.808

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