Datasheet USB Type-C Power Delivery Controller BM92A30MWV-Z General Description Key Specifications BM92A30MWV-Z is a full function USB Type-C Power VBUS Voltage Range: 4.75 V to 20 V Delivery (PD) controller that supports USB Power Power Consumption at Sleep Power: 0.4 mW (Typ) Delivery using baseband communication. Operating Temperature Range: -30 C to +105 C BM92A30MWV-Z includes support for the PD policy engine and communicates with an Embedded Controller Applications or the SoC via host interface. It supports SOP, SOP and Consumer Applications: Laptop PCs, Tablet PCs SOP signaling, allowing it to communicate with cable marker ICs, support alternate modes. Package W(Typ) x D(Typ) x H(Max) UQFN40V5050A 5.00 mm x 5.00 mm x 1.00 mm Features USB Type-C Specification Compatible USB PD Specification Compatible (BMC-PHY) Supports Display Port Control Automatic Mode without Ext-MCU Two Power Path Control using N-ch MOSFET Drivers with Back Flow Prevention Type-C Cable Orientation Detection Built-in VCONN Switch and VCONN Controller Direct VBUS Powered Operation Supports DFP/UFP/DRP Mode Supports Dead Battery Operation SMBus Interface for Host Communication Typical Application Circuit Sink Path VBUS Charger Power Hi-side Power Supply Source Path Switch For Prov (5 V) EN VSVR (3.3 V to 5 V) VDDIO (1.8 V to 5 V) VDDIO VCONN (5 V) VCONN IN D 1 SMDATA Optional CC1 CC1 SMCLK Ext-MCU VDDIO CC2 CC2 GPIO0(HPD OUT) GPIO1(ALERT ) USB Type-C GPO2/VDIV(BST EN) Receptacle GPO3/FB(HSSWEN) USB3.x-SS/ XCLPOFF1 DP-MUX BM92A30MWV-Z XCLPOFF2 Control GPIO7(MSEL1) N-ch UQFN40V5050A Open GPIO6(MSEL0) Drain GPIO5(ORIENT) GPIO4 DP HPD OUT USB-PHY D+ DBGMODDT VCCIN VDDIO D- DBGRSTCK IDSEL/ATST1 USB 3.x SS VSTR/ATST2 MUX RX1+, RX1- RX2+, RX2- XRST TX1+, TX1- Reset TX2+, TX2- VCCIN GND GND Product structure : Silicon monolithic integrated circuit This product has no designed protection against radioactive rays www.rohm.com TSZ02201-0232AA000660-1-2 2016 ROHM Co., Ltd. All rights reserved. 1/27 TSZ22111 14 001 19.Jan.2018 Rev.003 EXP-PAD DSCHG VB GND GND S2 DRV G1 GND S2 DRV SRC LDO15DCAP S2 DRV G2 LDO28CAP S1 DRV G1 LDO15ACAP S1 DRV SRC VCCIN S1 DRV G2 CSENSEP VEX CSENSEN VSVRBM92A30MWV-Z Contents General Description ........................................................................................................................................................................ 1 Features.......................................................................................................................................................................................... 1 Key Specifications ........................................................................................................................................................................... 1 Applications .................................................................................................................................................................................... 1 Package W (Typ) x D(Typ) x H(Max) ..................................................................................................................................... 1 Typical Application Circuit ............................................................................................................................................................... 1 Contents ......................................................................................................................................................................................... 2 Notation .......................................................................................................................................................................................... 3 Reference ....................................................................................................................................................................................... 3 Pin Configuration ............................................................................................................................................................................ 4 Pin Descriptions .............................................................................................................................................................................. 5 Block Diagram ................................................................................................................................................................................ 6 Absolute Maximum Ratings (Ta=25 C) .......................................................................................................................................... 7 (Note 3) Thermal Resistance ............................................................................................................................................................... 7 Recommended Operating Conditions ............................................................................................................................................. 8 Electrical Characteristics................................................................................................................................................................. 8 1. Internal Memory Cell Characteristics .............................................................................................................................. 8 2. Circuit Power Characteristics .......................................................................................................................................... 8 3. Digital Pin DC Characteristics ......................................................................................................................................... 9 4. Power Supply Management .......................................................................................................................................... 10 5. CC PHY ....................................................................................................................................................................... 12 6. Voltage Detection .......................................................................................................................................................... 14 7. VBUS Discharge ........................................................................................................................................................... 14 8. Power FET Gate Driver ................................................................................................................................................. 15 Timing Chart ................................................................................................................................................................................. 16 1. Power On Sequence (Non Dead Battery Operation)..................................................................................................... 16 2. Power On Sequence (Dead Battery Operation) ............................................................................................................ 16 3. Reset Timing ................................................................................................................................................................. 17 4. Power Off Sequence ..................................................................................................................................................... 17 Application Example ..................................................................................................................................................................... 18 Selection of Components Externally Connected ........................................................................................................................... 18 I/O Equivalence Circuit ................................................................................................................................................................. 19 Operational Notes ......................................................................................................................................................................... 23 1. Reverse Connection of Power Supply ........................................................................................................................... 23 2. Power Supply Lines ...................................................................................................................................................... 23 3. Ground Voltage ............................................................................................................................................................. 23 4. Ground Wiring Pattern .................................................................................................................................................. 23 5. Recommended Operating Conditions ........................................................................................................................... 23 6. Inrush Current ............................................................................................................................................................... 23 7. Operation Under Strong Electromagnetic Field ............................................................................................................. 23 8. Testing on Application Boards ....................................................................................................................................... 23 9. Inter-pin Short and Mounting Errors .............................................................................................................................. 24 10. Unused Input Pins ......................................................................................................................................................... 24 11. Regarding the Input Pin of the IC .................................................................................................................................. 24 12. Ceramic Capacitor ........................................................................................................................................................ 24 13. Area of Safe Operation (ASO) ...................................................................................................................................... 24 14. Over Current Protection Circuit (OCP) .......................................................................................................................... 24 Ordering Information ..................................................................................................................................................................... 25 Marking Diagrams ......................................................................................................................................................................... 25 Physical Dimension and Packing Information ............................................................................................................................... 26 Revision History ............................................................................................................................................................................ 27 www.rohm.com TSZ02201-0232AA000660-1-2 2016 ROHM Co., Ltd. All rights reserved. 2/27 TSZ22111 15 001 19.Jan.2018 Rev.003