X-On Electronics has gained recognition as a prominent supplier of BM92A30MWV-ZE2 USB Interface IC across the USA, India, Europe, Australia, and various other global locations. BM92A30MWV-ZE2 USB Interface IC are a product manufactured by ROHM. We provide cost-effective solutions for USB Interface IC, ensuring timely deliveries around the world.

BM92A30MWV-ZE2 ROHM

Name: BM92A30MWV-ZE2
Brand: ROHM
SKU: BM92A30MWVZE2_ROHM
Availability: InStock
Rating: 5 (11 reviews)

BM92A30MWV-ZE2 electronic component of ROHM

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See Product Specifications

Part No.	BM92A30MWV-ZE2
Manufacturer:	ROHM
Category:	USB Interface IC
Description:	USB Interface IC Provider/Consmer DRP Srce/Sink USB Type-C
Datasheet:	BM92A30MWV-ZE2 Datasheet (PDF)
	Large This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges

Price (USD)

1: USD 3.168 ea
Line Total: USD 3.17

Availability - 4737
Ship by Wed. 08 Jan to Fri. 10 Jan

MOQ: 1 Multiples: 1
Pack Size: 1

BM92A30MWV-ZE2 More Buying Options & Price Grid(s)

Please wait...

Availability Price Buy Price Quantity

4737

Ship by Wed. 08 Jan to Fri. 10 Jan

MOQ : 1
Multiples : 1

1 : USD 3.168
10 : USD 2.618
100 : USD 2.255
250 : USD 2.057
500 : USD 1.947
1000 : USD 1.826
2500 : USD 1.727
10000 : USD 1.716

Specifications

Manufacturer

ROHM ROHM

Product Category

USB Interface IC USB Interface IC

RoHS - XON

Y Y

Product

Usb Type - C Controllers Usb Type - C Controllers

Type

Type - C Power Delivery Controller Type - C Power Delivery Controller

Mounting Style

Smd/Smt Smd/Smt

Package / Case

Uqfn40v5050a Uqfn40v5050a

Standard

Usb - C 1.1 Usb - C 1.1

Speed

- -

Data Rate

- -

Supply Voltage - Min

4.75 V 4.75 V

Supply Voltage - Max

20 V 20 V

Operating Supply Current

- -

Minimum Operating Temperature

- 30 C - 30 C

Maximum Operating Temperature

+ 105 C + 105 C

Packaging

Cut Tape Cut Tape

Brand

Rohm Semiconductor Rohm Semiconductor

Interface Type

Smbus Smbus

Operating Supply Voltage

4.75 v to 20 V 4.75 v to 20 V

Product Type

Usb Interface Ic Usb Interface Ic

Factory Pack Quantity :

2500 2500

Subcategory

Interface Ics Interface Ics

Cnhts

8542319000 8542319000

Hts Code

8542310001 8542310001

Mxhts

85423901 85423901

Taric

8542399000 8542399000

Notes:- Show Stocked Products With Similar Attributes.

BM92A30MWV-ZE2 Alternative Parts

We are delighted to provide the BM92A30MWV-ZE2 from our USB Interface IC category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the BM92A30MWV-ZE2 and other electronic components in the USB Interface IC category and beyond.

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Additional Infomation About Product

Datasheet USB Type-C Power Delivery Controller BM92A30MWV-Z General Description Key Specifications BM92A30MWV-Z is a full function USB Type-C Power VBUS Voltage Range: 4.75 V to 20 V Delivery (PD) controller that supports USB Power Power Consumption at Sleep Power: 0.4 mW (Typ) Delivery using baseband communication. Operating Temperature Range: -30 C to +105 C BM92A30MWV-Z includes support for the PD policy engine and communicates with an Embedded Controller Applications or the SoC via host interface. It supports SOP, SOP and Consumer Applications: Laptop PCs, Tablet PCs SOP signaling, allowing it to communicate with cable marker ICs, support alternate modes. Package W(Typ) x D(Typ) x H(Max) UQFN40V5050A 5.00 mm x 5.00 mm x 1.00 mm Features USB Type-C Specification Compatible USB PD Specification Compatible (BMC-PHY) Supports Display Port Control Automatic Mode without Ext-MCU Two Power Path Control using N-ch MOSFET Drivers with Back Flow Prevention Type-C Cable Orientation Detection Built-in VCONN Switch and VCONN Controller Direct VBUS Powered Operation Supports DFP/UFP/DRP Mode Supports Dead Battery Operation SMBus Interface for Host Communication Typical Application Circuit Sink Path VBUS Charger Power Hi-side Power Supply Source Path Switch For Prov (5 V) EN VSVR (3.3 V to 5 V) VDDIO (1.8 V to 5 V) VDDIO VCONN (5 V) VCONN IN D 1 SMDATA Optional CC1 CC1 SMCLK Ext-MCU VDDIO CC2 CC2 GPIO0(HPD OUT) GPIO1(ALERT ) USB Type-C GPO2/VDIV(BST EN) Receptacle GPO3/FB(HSSWEN) USB3.x-SS/ XCLPOFF1 DP-MUX BM92A30MWV-Z XCLPOFF2 Control GPIO7(MSEL1) N-ch UQFN40V5050A Open GPIO6(MSEL0) Drain GPIO5(ORIENT) GPIO4 DP HPD OUT USB-PHY D+ DBGMODDT VCCIN VDDIO D- DBGRSTCK IDSEL/ATST1 USB 3.x SS VSTR/ATST2 MUX RX1+, RX1- RX2+, RX2- XRST TX1+, TX1- Reset TX2+, TX2- VCCIN GND GND Product structure : Silicon monolithic integrated circuit This product has no designed protection against radioactive rays www.rohm.com TSZ02201-0232AA000660-1-2 2016 ROHM Co., Ltd. All rights reserved. 1/27 TSZ22111 14 001 19.Jan.2018 Rev.003 EXP-PAD DSCHG VB GND GND S2 DRV G1 GND S2 DRV SRC LDO15DCAP S2 DRV G2 LDO28CAP S1 DRV G1 LDO15ACAP S1 DRV SRC VCCIN S1 DRV G2 CSENSEP VEX CSENSEN VSVRBM92A30MWV-Z Contents General Description ........................................................................................................................................................................ 1 Features.......................................................................................................................................................................................... 1 Key Specifications ........................................................................................................................................................................... 1 Applications .................................................................................................................................................................................... 1 Package W (Typ) x D(Typ) x H(Max) ..................................................................................................................................... 1 Typical Application Circuit ............................................................................................................................................................... 1 Contents ......................................................................................................................................................................................... 2 Notation .......................................................................................................................................................................................... 3 Reference ....................................................................................................................................................................................... 3 Pin Configuration ............................................................................................................................................................................ 4 Pin Descriptions .............................................................................................................................................................................. 5 Block Diagram ................................................................................................................................................................................ 6 Absolute Maximum Ratings (Ta=25 C) .......................................................................................................................................... 7 (Note 3) Thermal Resistance ............................................................................................................................................................... 7 Recommended Operating Conditions ............................................................................................................................................. 8 Electrical Characteristics................................................................................................................................................................. 8 1. Internal Memory Cell Characteristics .............................................................................................................................. 8 2. Circuit Power Characteristics .......................................................................................................................................... 8 3. Digital Pin DC Characteristics ......................................................................................................................................... 9 4. Power Supply Management .......................................................................................................................................... 10 5. CC PHY ....................................................................................................................................................................... 12 6. Voltage Detection .......................................................................................................................................................... 14 7. VBUS Discharge ........................................................................................................................................................... 14 8. Power FET Gate Driver ................................................................................................................................................. 15 Timing Chart ................................................................................................................................................................................. 16 1. Power On Sequence (Non Dead Battery Operation)..................................................................................................... 16 2. Power On Sequence (Dead Battery Operation) ............................................................................................................ 16 3. Reset Timing ................................................................................................................................................................. 17 4. Power Off Sequence ..................................................................................................................................................... 17 Application Example ..................................................................................................................................................................... 18 Selection of Components Externally Connected ........................................................................................................................... 18 I/O Equivalence Circuit ................................................................................................................................................................. 19 Operational Notes ......................................................................................................................................................................... 23 1. Reverse Connection of Power Supply ........................................................................................................................... 23 2. Power Supply Lines ...................................................................................................................................................... 23 3. Ground Voltage ............................................................................................................................................................. 23 4. Ground Wiring Pattern .................................................................................................................................................. 23 5. Recommended Operating Conditions ........................................................................................................................... 23 6. Inrush Current ............................................................................................................................................................... 23 7. Operation Under Strong Electromagnetic Field ............................................................................................................. 23 8. Testing on Application Boards ....................................................................................................................................... 23 9. Inter-pin Short and Mounting Errors .............................................................................................................................. 24 10. Unused Input Pins ......................................................................................................................................................... 24 11. Regarding the Input Pin of the IC .................................................................................................................................. 24 12. Ceramic Capacitor ........................................................................................................................................................ 24 13. Area of Safe Operation (ASO) ...................................................................................................................................... 24 14. Over Current Protection Circuit (OCP) .......................................................................................................................... 24 Ordering Information ..................................................................................................................................................................... 25 Marking Diagrams ......................................................................................................................................................................... 25 Physical Dimension and Packing Information ............................................................................................................................... 26 Revision History ............................................................................................................................................................................ 27 www.rohm.com TSZ02201-0232AA000660-1-2 2016 ROHM Co., Ltd. All rights reserved. 2/27 TSZ22111 15 001 19.Jan.2018 Rev.003

HS Compliance

Tariff Desc

8542.39.23 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products Free

Electronic integrated circuits- Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits

LAPIS Semiconductor may also be referenced as

RHE
RHM
ROHM Semicon
ROHM Semiconductor

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Availability	Price	Buy Price	Quantity
4737 Ship by Wed. 08 Jan to Fri. 10 Jan MOQ : 1 Multiples : 1	1 : USD 3.168 10 : USD 2.618 100 : USD 2.255 250 : USD 2.057 500 : USD 1.947 1000 : USD 1.826 2500 : USD 1.727 10000 : USD 1.716

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