H7 RSB27VFH FHDiodes AEC-Q101 Qualified Bi-Directional Zener Diodes RSB27VFH z Dimensions (Unit : mm) z Outline RSB27VFHRSB27V is a bi-directional zener diode having two zeners confronted in one package, aimed to absorb the +0.2 1.25 0.1 0.7 -0.1 surge in plus and minus directions arising from the signal line in mobile phone, consumer electronics such as PC, and automotive applications. In general, two pieces of zener diodes are used as ESD protector to absorb the surge in +/ - directions. Paying attention to this point and using its original technology, ROHM succeeded to incorporate 2 zeners in one die / +0.1 0.3 0.05 0.1 package for benefit of space-saving on the circuit board. -0.05 z Features 1) Absorption of plus & minus surge with one package. z Structure 2) Decrease of components and space-saving on the circuit board. z Absolute maximum ratings (Ta=25C) Parameter Limits Symbol Unit Power dissipation 200 Pd mW Junction temperature Tj 150 Operation temperature range -55 to +150 Tstg z Electrical characteristics (Ta=25C) Parameter Conditions Symbol Min. Max. Unit Zener voltage V 26.2 32.0 V I =1mA z F Reverse current I - 0.1 A V =24V R R Capacitance between terminals Ct - 30 pF V =0V , f=1MHz R Zener voltage to be measured at 40ms after current starting to apply. 1/1 1.7 0.1 2.5 0.2DatasheetDatasheet Notice Precaution on using ROHM Products (Note 1) 1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment , aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (Specific Applications), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHMs Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASS CLASSb CLASS CLASS CLASS CLASS 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: a Installation of protection circuits or other protective devices to improve system safety b Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHMs Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: a Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents b Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust c Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 d Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves e Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items f Sealing or coating our Products with resin or other coating materials g Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended) or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering h Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PAA-E Rev.001 2015 ROHM Co., Ltd. All rights reserved.