Ver. 201306
Multilayer Power Inductor
CIG22H Series (2520/ EIA 1008)
APPLICATION
Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter
FEATURES RECOMMENDED LAND PATTERN
High Current Type
Low DC resistance
Magnetically shielded structure
Free of all RoHS-regulated substances
Monolithic structure for high reliability
DIMENSION
Dimension [mm]
TYPE
L W T D
22 2.50.2 2.00.2 1.10.1 0.550.25
DESCRIPTION
2
1
Rated Current (A)
Size Inductance DC Rated Current (A)
Part no.
inch/mm) uH)@1MHz Resistance( Typ.
( ( )
Max. Typ.
CIG22H1R0MNE 1008/2520 1.0 20 % 0.08025 % 3.3 1.5 2.0
CIG22H1R2MNE 1008/2520 1.2 20 % 0.09420 % 2.8 1.5 1.9
CIG22H1R5MNE 1008/2520 1.5 20 % 0.10420 % 2.4 1.5 1.6
CIG22H2R2MNE 1008/2520 2.2 20 % 0.11620 % 1.8 1.2 1.6
CIG22H3R3MNE 1008/2520 3.3 20 % 0.13320 % 1.0 1.0 1.5
CIG22H4R7MNE 1008/2520 4.7 20 % 0.23320 % 0.95 0.8 1.0
1
Rated Current (A) : DC current value when Inductance drops to 30% of nominal Inductance value (ONLY REFERENCE)
2
Rated Current (A) : DC current value when the self-generation of heat rises to 40 (Reference ambient temperature:25 )
Operating temperature range: 40 to +125C ( Including self-temperature rise)
Test equipment: Agilent :E4991A+16092A
CHARACTERISTIC DATA
Frequency characteristics Typ.) DC Bias characteristics Typ.)
1) ( 2) (Ver. 201306
PRODUCT IDENTIFICATION
CI G 22 H 1R0 M N E
(1) (2) (3) (4) (5) (6) (7) (8)
Chip Inductor Power Inductor
(1) (2)
Dimension Product Series H:High Current Type)
(3) (4) (
Inductance R0:1.0uH) Tolerance M:
(5) (1 (6) ( 20%)
Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard)
(7)
Packaging(C:paper tape, E:embossed tape)
(8)
RECOMMENDED SOLDERING CONDITION
FLOW SOLDERING
REFLOW SOLDERING
PACKAGING
Packaging Style Quantity(pcs/reel)
Embossed Taping
2,500
Any data in this sheet are subject to change, modify or discontinue without notice.
The data sheets include the typical data for design reference only. If there is any question
regarding the data sheets, please contact our sales personnel or application engineers.