Ver. 201308
Multilayer Power Inductor
CIG22L Series (2520/ EIA 1008)
APPLICATION
Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter
FEATURES RECOMMENDED LAND PATTERN
Low DC resistance
Magnetically shielded structure
Free of all RoHS-regulated substances
Monolithic structure for high reliability
DIMENSION
Dimension [mm]
TYPE
L W T D
22 2.50.2 2.00.2 0.90.1 0.550.25
DESCRIPTION
Size Inductance DC Rated Current A)
(
Part no.
(inch/mm) (uH)@1MHz Resistance( ) Max.
CIG22LR47MNE 1008/2520 0.47 20 % 0.040 25 % 1.80
CIG22L1R0MNE 1008/2520 1.0 20 % 0.060 25 % 1.60
CIG22L1R2MNE 1008/2520 1.2 20 % 0.065 25 % 1.50
CIG22L1R5MNE 1008/2520 1.5 20 % 0.070 25 % 1.50
CIG22L2R2MNE 1008/2520 2.2 20 % 0.080 25 % 1.30
CIG22L3R3MNE 1008/2520 3.3 20 % 0.100 25 % 1.20
CIG22L4R7MNE 1008/2520 4.7 20 % 0.110 25 % 1.10
CIG22L6R8MNE 1008/2520 6.8 20 % 0.203 30 % 0.80
CIG22L100MNE 1008/2520 10.0 20 % 0.323 30 % 0.60
Rated Current (A): DC current value when the self-generation of heat rises to 40 (Reference ambient temperature:25 )
Operating temperature range: 40 to +125C ( Including self-temperature rise)
Test equipment: Agilent :E4991A+16092A
CHARACTERISTIC DATA
1) Frequency characteristics (Typ.) 2) DC Bias characteristics (Typ.)Ver. 201308
PRODUCT IDENTIFICATION
CI G 22 L 1R0 M N E
(1) (2) (3) (4) (5) (6) (7) (8)
Chip Inductor Power Inductor
(1) (2)
Dimension Product Series L: Low Rdc)
(3) (4) (
Inductance R0:1.0uH) Tolerance M:
(5) (1 (6) ( 20%)
Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard)
(7)
Packaging(C:paper tape, E:embossed tape)
(8)
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING FLOW SOLDERING
PACKAGING
Packaging Style Quantity(pcs/reel)
Embossed Taping 3,000
Any data in this sheet are subject to change, modify or discontinue without notice.
The data sheets include the typical data for design reference only. If there is any question
regarding the data sheets, please contact our sales personnel or application engineers.