Metal Composite Power Inductor (Thin Film) Specification Sheet CIGT201610LH2R2MNE (2016 / EIA 0806) APPLICATION Smart phones, Tablet, Wearable devices, Power converter modules, etc. FEATURES RECOMMENDED LAND PATTERN Small power inductor for mobile devices Unit : mm Low DCR structure and high efficiency inductor for power circuits. TYPE 2016 Monolithic structure for high reliability A 0.8 Free of all RoHS-regulated substances B 0.8 Halogen free C 1.8 DIMENSION Dimension mm TYPE LW T D 2016 2.00.2 1.60.2 1.0 max 0.50.2 DESCRIPTION Rated DC Current (Irms) Inductance DC Resistance m Rated DC Current (Isat) A Size Thickness Inductance A Part no. tolerance inch/mm mm (max) uH Max. Typ. Max. Typ. Max. Typ. (%) CIGT201610LH2R2MNE 0806/2016 1.0 2.2 20 139 116 2 2.3 1.8 2 * Inductance : Measured with a LCR meter 4991A(Agilent) or equivalent (Test Freq. 1MHz, Level 0.1V) * DC Resistance : Measured with a Resistance HI-TESTER 3541(HIOKI) or equivalent * Maximum allowable DC current : Value defined when DC current flows and the initial value of inductance has decreased by 30% or when current flows and temperature has risen to 40 whichever is smaller. (Reference: ambient temperature is 25 10) (Isat) : Allowable current in DC saturation : The DC saturation allowable current value is specified when the decrease of the initial inductance value at 30% (Reference: ambient temperature is 25 10) (Irms) : Allowable current of temperature rise : The temperature rise allowable current value is specified when temperature of the inductor is raised 40 by DC current. (Reference: ambient temperature is 25 10) * Absolute maximum voltage : Absolute maximum voltage DC 20V. * Operating temperature range : -40 to +125C (Including self-temperature rise) PRODUCT IDENTIFICATION CIG T 2016 10 LH 2R2 M N E (1) (2) (3) (4) (5) (6) (7) (8) (9) (1) Power Inductor (2) Type (T: Metal Composite Thin Film Type) (3) Dimension (2016: 2.0mm 1.6 mm ) (4) Thicknes (10: 1.0mm) (5) Remark (Characterization Code) (6) Inductanc(2R2: 2.2 uH) (7) Toleranc (M:20%) (8) Internal Code (9) Packaging(C:paper tape, E:embossed tape) RECOMMENDED SOLDERING CONDITION REFLOW SOLDERING FLOW SOLDERING IRON SOLDERING Temperature of 280 max. Soldering Iron Tip Preheating 150 min. Temperature Temperature T 130 Differential Soldering Time 3sec max. Wattage 50W max. PACKAGING Packaging Style Quantity(pcs/reel) Embossed Taping 3000 pcsReliability Test Item Specified Value Test Condition After being dipped in flux for 41 seconds, and preheated at More than 90% of terminal electrode should be Solderability 150 180 for 23 min, the specimen shall be immersed in soldered newly. solder at 2455 for 41 seconds. No mechanical damage. After being dipped in flux for 41 seconds, and preheated at Remaining terminal Electrode: 75% min. Resistance to Soldering 150 180 for 23 min, the specimen shall be immersed in Inductance change to be within 20% to the solder at 2605 for 10 0.5 seconds. initial. No mechanical damage Thermal Shock Repeat 100 cycles under the following conditions. Inductance change to be within 20% to the (Temperature Cycle test) -403 for 30 min 853 for 30 min initial. 852 , 85%RH, for 50012 hours. High Temp. Humidity No mechanical damage Measure the test items after leaving at normal temperature Resistance Test Inductance change to be within 20% to the initial and humidity for 24 hours. Solder the sample on PCB. Exposure No mechanical damage at -552 for 50012 hours. Low Temperature Test Inductance change to be within 20% to the Measure the test items after leaving at normal temperature initial. and humidity for 24hours. Solder the sample on PCB. Exposure at 1252 for 50012 No mechanical damage hours. High Temperature Test Inductance change to be within 20% to the Measure the test items after leaving at normal temperature initial. and humidity for 24hours. 852 , 85%RH, Rated Current for 50012 hours. High Temp. Humidity Resistance No mechanical damage Measure the test items after leaving at normal temperature Loading Test Inductance change to be within 20% to the initial and humidity for 24 hours. 852 , Rated Current for 50012 hours. No mechanical damage High Temperature Loading Test Measure the test items after leaving at normal temperature Inductance change to be within 20% to the initial and humidity for 24 hours. No mechanical damage Reflow Test Peak 2605 , 3 times Inductance change to be within 20% to the initial No mechanical damage Solder the sample on PCB. Vibrate as apply 10~55Hz, 1.5mm Vibration Test Inductance change to be within 20% to the amplitude for 2 hours in each of three(X,Y,Z) axis (total 6 initial. hours). Bending Limit 2mm Test Speed 1.0mm/sec. No mechanical damage Keep the test board at the limit point in 5 sec. PCB thickness : 1.6mm Bending Test W(kgf) TIME(sec) No indication of peeling shall occur on the terminal electrode. 0.5 101 Terminal Adhesion Test No mechanical damage Random Free Fall test on concrete plate. Drop Test Inductance change to be within 20% to the 1 meter, 10 drops initial. 852 , 85%RH, Load(Ipeak) for 120 hours. (Frequncy:1MHz, Load(Ipeak):1.5hr on / 0.5hr off) Ipeak No mechanical damage Measure the test items after leaving at normal temperature (AC+DC Load Life) Inductance change to be within 20% to the initial and humidity for 24 hours. * Load(Ipeak) = Irms(max)1.4