uClamp0506P TM Clamp 6-Line ESD protection Array TM PROTECTION PRODUCTS - MicroClampPROTECTION PRODUCTS Features Description TM The Clamp series of TVS arrays are designed to pro- Transient protection for data lines to tect sensitive electronics from damage or latch-up due IEC 61000-4-2 (ESD) 15kV (air), 8kV (contact) to ESD. They are designed for use in applications where IEC 61000-4-4 (EFT) 40A (5/50ns) board space is at a premium. Each device requires less Protects six I/O lines 2 than 2.6mm of PCB area and will protect up to six lines. Ultra-small package (1.6 x 1.6 x 0.6mm1.6 x 1.6 x 0.6mm1.6 x 1.6 x 0.6mm1.6 x 1.6 x 0.6mm1.6 x 1.6 x 0.6mm) requires 2 TVS diodes are solid-state devices designed specifically less than 2.6mm of PCB area for transient suppression. They feature large cross-sec- Working voltage: 5V tional area junctions for conducting high transient cur- Low leakage current rents. They offer desirable characteristics for board level Low operating and clamping voltages protection including fast response time, low operating Solid-state silicon-avalanche technology and clamping voltage, and no device degradation. Mechanical Characteristics The uClamp0506P is in a 6-pin, RoHS/WEEE compliant, SLP1616P6 package. It measures 1.6 x 1.6 x 0.60mm. SLP1616P6 6L package The leads are spaced at a pitch of 0.5mm and are fin- RoHS/WEEE Compliant ished with lead-free NiPdAu. They may be used to meet Nominal Dimensions: 1.6 x 1.6 x 0.60 mm the ESD immunity requirements of IEC 61000-4-2, Level Lead Finish: NiPdAu 4 (15kV air, 8kV contact discharge). The combination Molding compound flammability rating: UL 94V-0 of small size, low capacitance, and high ESD surge capa- Marking: 0506P bility makes them ideal for use in portable electronics Packaging: Tape and Reel per EIA 481 such as cell phones, PDAs, notebook computers, and digital cameras. Applications Cellular Handsets and Accessories Cordless Phones Personal Digital Assistants (PDAs) Portable Instrumentation Digital Cameras Peripherals MP3 Players Circuit Diagram PIN Configuration 1.6 12 3 4 5 6 1 1.6 6 0.5 0.6 Center Pad SLP1616P6 (Bottom View) Nominal Dimensions in mm www.semtech.com Revision 04/17/2007 1uClamp0506P PROTECTION PRODUCTS Absolute Maximum Rating Rlating Seymbo Vsalu Unit PPeak Pulse Power (tp = 8/20s) 1s00 Watt pk M)aximum Peak Pulse Current (tIp = 8/20s 7sAmp pp ESD per IEC 61000-4-2 (Air) V +/- 20 kV PP ESD per IEC 61000-4-2 (Contact) +/- 12 LTead Soldering Temperature 2C60 (10 sec.) L OTperating Temperature -C55 to +125 J STtorage Temperature -C55 to +150 STG o Electrical Characteristics (T=25 C) Plarameter SsymboCmondition MlinimuTmypicaMsaximu Unit RVeverse Stand-Off Voltage 5V RWM RVeverse Breakdown Voltage I=61mA V BR t RIeverse Leakage Current V=15V, T=25C A R RWM RIeverse Leakage Current V=03V, T=25C 0A.50 R RWM CVlamping Voltage I = 1A, t = 8/20s 9V C PP p Any I/O to Ground Pad CVlamping Voltage I = 1A, t = 8/20s 1V0 C PP p I/O to I/O CVlamping Voltage I = 7A, t = 8/20s 1V1 C PP p Any I/O to Ground Pad CVlamping Voltage I = 7A, t = 8/20s 1V2 C PP p I/O to I/O JCunction Capacitance Between I/O Pins and 650 7Fp j Gnd V = 0V, f = 1MHz R JCunction Capacitance Between I/O Pins and 300 4Fp j I/O Pins V = 0V, f = 1MHz R www.semtech.com 2007 Semtech Corp. 2