X-On Electronics has gained recognition as a prominent supplier of BGM13S22F512GA-V3 Bluetooth Modules - 802.15.1 across the USA, India, Europe, Australia, and various other global locations. BGM13S22F512GA-V3 Bluetooth Modules - 802.15.1 are a product manufactured by Silicon Labs. We provide cost-effective solutions for Bluetooth Modules - 802.15.1, ensuring timely deliveries around the world.

BGM13S22F512GA-V3 Silicon Labs

Hot BGM13S22F512GA-V3 electronic component of Silicon Labs
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Part No.BGM13S22F512GA-V3
Manufacturer: Silicon Labs
Category: Bluetooth Modules - 802.15.1
Description: Bluetooth Modules - 802.15.1 BGM13S Wireless Bluetooth Module, SiP, +8 dBm, 2.4 GHz, 512 kB flash, -40 to 85 C, Built-in Antenna
Datasheet: BGM13S22F512GA-V3 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 7.8754 ea
Line Total: USD 7.88 
Availability - 334
Ship by Thu. 28 Nov to Wed. 04 Dec
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
334
Ship by Thu. 28 Nov to Wed. 04 Dec
MOQ : 1
Multiples : 1
1 : USD 7.8754
10 : USD 7.1318
25 : USD 7.0603
80 : USD 6.8757
260 : USD 6.6911

659
Ship by Thu. 28 Nov to Wed. 04 Dec
MOQ : 1
Multiples : 1
1 : USD 8.918
10 : USD 7.7532
25 : USD 7.6752
80 : USD 7.3723
260 : USD 7.0772
520 : USD 7.0057
1040 : USD 6.9355

3527
Ship by Tue. 26 Nov to Thu. 28 Nov
MOQ : 1
Multiples : 1
1 : USD 9.119
10 : USD 7.084
250 : USD 6.974
500 : USD 6.875
1000 : USD 6.842
2600 : USD 6.831

   
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We are delighted to provide the BGM13S22F512GA-V3 from our Bluetooth Modules - 802.15.1 category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the BGM13S22F512GA-V3 and other electronic components in the Bluetooth Modules - 802.15.1 category and beyond.

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet The BGM13S is Silicon Labs first SiP module solution for Bluetooth 5 connectivity. It supports 2 Mbps, 1 Mbps and coded LE Bluetooth PHYs. Also, with 512 kB of flash and KEY FEATURES 64 kB of RAM, the BGM13S is suited to meet Bluetooth Mesh networking memory re- quirements effectively. Bluetooth 5 compliant Fit for Bluetooth Mesh Based on the EFR32BG13 Blue Gecko SoC, the BGM13S delivers robust RF perform- Antenna or RF Pin variants ance, low energy consumption, a wide selection of MCU peripherals, regulatory test cer- Up to +19 dBm TX power tificates for various regions and countries, and a simplified development experience, all in a 6.5 6.5 mm package. Together with the certified software stacks and powerful -94.1 dBm RX sensitivity at 1 Mbps tools also offered by Silicon Labs, the BGM13S minimizes the area requirements, engi- 32-bit ARM Cortex-M4 core at 38.4 neering efforts and development costs associated with adding Bluetooth 5.0 or Bluetooth MHz Mesh connectivity to any product, accelerating its time-to-market. 512/64 kB of flash/RAM memory Precision Low Frequency Oscillator meets The BGM13S is intended for a broad range of applications, including: Bluetooth Low Energy Sleep Clock accuracy requirements Wearables Autonomous Hardware Crypto IoT end-node devices and gateways Accelerators Health, sports, and wellness Integrated DC-DC converter Industrial, home, and building automation 32 GPIO pins Beacons 6.5 mm 6.5 mm 1.4 mm Smart phone, tablet, and PC accessories Core / Memory Crystal Clock Management Energy Management Other H-F Crystal H-F Voltage 38.4 MHz CRYPTO Oscillator RC Oscillator Voltage Monitor Regulator TM ARM Cortex M4 processor Flash Program Precision L-F RC Auxiliary H-F RC with DSP extensions, FPU and MPU Memory CRC Oscillator Oscillator DC-DC Power-On Reset Converter L-F Crystal L-F True Random Oscillator RC Oscillator Number Generator Brown-Out LDMA ETM Debug Interface RAM Memory Ultra L-F RC Controller Detector SMU Oscillator 32-bit bus Peripheral Reflex System Antenna Radio Transceiver Serial I/O Ports Timers and Triggers Analog I/F Interfaces DEMOD ADC External USART Timer/Counter Protocol Timer Chip Antenna Interrupts Analog Comparator PGA IFADC I Low Energy General Low Energy Low Energy LNA Matching TM UART Purpose I/O Timer Sensor Interface IDAC RF Frontend AGC PA Capacitive 2 I C Pin Reset Pulse Counter Watchdog Timer Touch Q Frequency Synthesizer VDAC MOD Real Time Pin Wakeup Counter and Cryotimer Op-Amp Calendar Lowest power mode with peripheral operational: EM0Active EM1Sleep EM2Deep Sleep EM3Stop EM4Hibernate EM4Shutoff silabs.com Building a more connected world. Rev. 1.2 BALUN CRC FRC RAC BUFC BGM13S Blue Gecko Bluetooth SiP Module Data Sheet Feature List 1. Feature List Supported Protocols Support for Internet Security Bluetooth 5 General Purpose CRC Bluetooth Mesh True Random Number Generator (TRNG) Wireless System-on-Chip 2 Hardware Cryptographic Accelerators (CRYPTO) for AES 128/256, SHA-1, SHA-2 (SHA-224 and SHA-256) and 2.4 GHz radio ECC TX power up to +19 dBm Wide Selection of MCU Peripherals High Performance 32-bit 38.4 MHz ARM Cortex -M4 with 12-bit 1 Msps SAR Analog to Digital Converter (ADC) DSP instruction and floating-point unit for efficient signal 2 Analog Comparator (ACMP) processing 2 Digital to Analog Converter (VDAC) 512 kB flash program memory 3 Operational Amplifier (Opamp) 64 kB RAM data memory Digital to Analog Current Converter (IDAC) Embedded Trace Macrocell (ETM) for advanced debugging Low-Energy Sensor Interface (LESENSE) Integrated DC-DC converter Multi-channel Capacitive Sense Interface (CSEN) High Receiver Performance 32 pins connected to analog channels (APORT) shared be- -102.1 dBm sensitivity at 125 kbit/s GFSK tween analog peripherals -97.9 dBm sensitivity at 500 kbit/s GFSK 32 General Purpose I/O pins with output state retention and -94.1 dBm sensitivity at 1 Mbit/s GFSK asynchronous interrupts -90.2 dBm sensitivity at 2 Mbit/s GFSK 8 Channel DMA Controller Low Energy Consumption 12 Channel Peripheral Reflex System (PRS) 9.7 mA RX current at 1 Mbps, GFSK 2 16-bit Timer/Counter 8.9 mA TX current at 0 dBm output power 3 or 4 Compare/Capture/PWM channels 87 A/MHz in Active Mode (EM0) 1 32-bit Timer/Counter 1.4 A EM2 DeepSleep current (full RAM retention and 3 Compare/Capture/PWM channels RTCC running from LFXO) Precision Low Frequency RC Oscillator (PLFRCO) 1.14 A EM3 Stop current (State/RAM retention) 32-bit Real Time Counter and Calendar Wake on Radio with signal strength detection, preamble 16-bit Low Energy Timer for waveform generation pattern detection, frame detection and timeout 32-bit Ultra Low Energy Timer/Counter for periodic wake-up Regulatory Certifications from any Energy Mode FCC 16-bit Pulse Counter with asynchronous operation CE 2 Watchdog Timer IC / ISEDC 3 Universal Synchronous/Asynchronous Receiver/Trans- MIC / Telec 2 mitter (UART/SPI/SmartCard (ISO 7816)/IrDA/I S) Wide Operating Range Low Energy UART (LEUART ) 1.8 V to 3.8 V single power supply 2 2 I C interface with SMBus support and address recogni- -40 C to +85 C tion in EM3 Stop Dimensions 6.5 mm 6.5 mm 1.4 mm silabs.com Building a more connected world. Rev. 1.2 2

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8542.3 - Electronic integrated circuits:
8542.31.00 -- Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
.Digital:
61 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products
62 No ..Other
63 No Hybrid integrated circuits
64 No Multichip integrated circuits
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