X-On Electronics has gained recognition as a prominent supplier of BT121-A-V2-IAP Bluetooth Modules - 802.15.1 across the USA, India, Europe, Australia, and various other global locations. BT121-A-V2-IAP Bluetooth Modules - 802.15.1 are a product manufactured by Silicon Labs. We provide cost-effective solutions for Bluetooth Modules - 802.15.1, ensuring timely deliveries around the world.
We are delighted to provide the BT121-A-V2-IAP from our Bluetooth Modules - 802.15.1 category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the BT121-A-V2-IAP and other electronic components in the Bluetooth Modules - 802.15.1 category and beyond.
BT121 BLUETOOTH DUAL MODE MODULE DATA SHEET Friday, 18 June 2021 Document Version: 1.64 Not Recommennded for New Designs VERSION HISTORY Date Edited Comment 1.0 First release of document 1.1 Minor updates 1.2 Minor updates 1.3 Power consumption measurements 1.4 Revised power consumption measurements 1.41 FCC, IC, Japan and Korea certification info updated Various corrections and edits, corrected front page +10dBm LE power 1.42 number and RF specification +9dBm both to the +7dBm setting used in the module for regulatory compliance 1.43 Wake-up pin section added 1.44 Mass production part numbers added to ordering code list. Typo corrections related to the note concerning I2C 2. 1.45 I2C 2 can be used only in Alt 2 configuration. Certificates section under FCC separation between human body and antenna changed from 9 mm to 7 mm. 1.46 SWD bus clarification : PA13 = SWDIO and PA14 = SWCLK 1.47 Altered outline and footprint drawings to render properly in PDF 1.48 Sleep mode current updated Reset description elaborated, fixed I2C schematic, added number of 1.49 piconets, wake-up sources corrected 1.50 Fixed SPI slave select descriptions SDK and SDA pins in Figure 21 corrected to SCL and SDA with correct 1.51 placement 1.52 Minor changes 1.53 Contact information updated Added dimension details for the 8 center pads for programming and testing 1.6 Editorial and layout fixes Silicon Labs Not Recommennded for New Designs
