SiT9107 LVPECL / LVDS / CML - Preliminary 220 to 800 MHz High Performance Oscillator Features Benefits Extremely low RMS phase jitter (random) Ultra fast lead time: 3 to 5weeks No crystal or capacitors required <1 ps (typical) Eliminates crystal qualification time Wide frequency range More than 50% + board saving space 220 MHz to 800 MHz More cost effective than quartz oscillators, quartz crystals High frequency stability and clock ICs. 10 PPM, 15 PPM, 20 PPM Completely quartz-free 25 PPM, 50 PPM Applications Operating voltage Server 1.8, 2.5 or 3.3 V Router Other voltages up to 3.63 V (contact SiTime) RAID controller Operating temperature range Gigabit Ethernet Industrial, -40 to 85 C 10 Gigabit Ethernet Extended Commercial, -20 to 70 C Fiber Channel SATA / SAS Commercial, 0 to 70 C PCI-Express Small footprint Fully Buffered DIMM 5.0 x 3.2 x 0.75 (L x W x H) mm System clock 7.0 x 5.0 x 0.90 (L x W x H) mm Networking and computing Pb-free and RoHS compliant For Spread Spectrum option contact SiTime Ultra-reliable start up and greater immunity from inter ference Block Diagram Pinout OUT- OUT+ VDD ST/OE 1 6 VDD NC 2 5 OUT- MEMS High Performance Phase Lock Loop Resonator GND 3 4 OUT+ ST/OE GND SiTime Corporation 990 Almanor Avenue Sunnyvale, CA 94085 (408) 328-4400 www.sitime.com Rev. 1.0 Revised August 27, 2010 SiT9107 LVPECL / LVDS / CML 220 to 800 MHz High Performance Oscillator Pin Description Pin No. Name Pin Description 1ST/OE Input Standby or Output Enable pin for OUT+ and OUT-. OE: When High or Open : OUT+ and OUT- = active When Low : OUT+ and OUT- = High Impedance state ST: When High or Open : OUT+ and OUT- = active When Low : OUT+ and OUT- = High Impedance State 2 NC NA Do not connect pin, leave it floating. 3 GND Power VDD power supply ground. Connect to Ground 4 OUT+ Output 220 to 800 MHz programmable clock output. 5 OUT- Output 6 VDD Power Power supply Absolute Maximum Ratings Attempted operation outside the absolute maximum ratings of the part may cause permanent damage to the part. Actual performance of the IC is only guaranteed within the operational specifications, not at absolute maximum ratings. Absolute Maximum Table Parameter Min. Max. Unit Storage Temperature -65 150 C VDD -0.5 4 V Vin GND - 0.5 VDD + 0.5 V Theta JA ( with copper plane on VDD and GND) 5.0 x 3.2 package 68 C/W 7.0 x 5.0 package when center pad is soldered down 38 C/W 7.0 x 5.0 package when center pad is not soldered down 90 C/W Theta JC (with PCB traces of 0.010 inch to all pins) 5.0 x 3.2 package 45 C/W 7.0 x 5.0 package when center pad is soldered down 35 C/W 7.0 x 5.0 package when center pad is not soldered down 48 C/W Soldering Temperature (follow standard Pb free soldering guidelines) 260 C Number of Program Writes 1 NA Program Retention over -40 to 125C, Process, VDD (0 to 3.6V) 1,000+ years Human Body Model (JESD22-A114) 2000 Charged Device Model (JESD22-C101) 750 Machine Model (JESD22-A115) 200 Environmental Compliance Parameter Condition/Test Method Mechanical Shock MIL-STD-883F, Method 2002 Mechanical Vibration MIL-STD-883F, Method 2007 Temperature Cycle MIL-STD-883F, Method 1010-65-150C (1000 cycle) Solderability MIL-STD-883F, Method 2003 Moisture Sensitivity Level MSL1 260C Rev. 0.9 Page 2 of 12 www.sitime.com