Product Information

BAL-CC25-01D3

BAL-CC25-01D3 electronic component of STMicroelectronics

Datasheet
Signal Conditioning 50 nominal input Conjugate matchbalun

Manufacturer: STMicroelectronics
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Price (USD)

174: USD 0.013 ea
Line Total: USD 2.26

8657 - Global Stock
Ships to you between
Mon. 20 May to Fri. 24 May
MOQ: 174  Multiples: 1
Pack Size: 1
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8657 - WHS 1


Ships to you between Mon. 20 May to Fri. 24 May

MOQ : 1
Multiples : 1

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BAL-CC25-01D3
STMicroelectronics

1 : USD 0.0134
10 : USD 0.0132
25 : USD 0.0131
50 : USD 0.013
250 : USD 0.0127
1000 : USD 0.0127
3000 : USD 0.0127

970 - WHS 2


Ships to you between Mon. 20 May to Fri. 24 May

MOQ : 172
Multiples : 1

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BAL-CC25-01D3
STMicroelectronics

172 : USD 0.1979
500 : USD 0.1979
2500 : USD 0.1979

4835 - WHS 3


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MOQ : 1
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BAL-CC25-01D3
STMicroelectronics

1 : USD 0.3685
10 : USD 0.2793
30 : USD 0.2204
100 : USD 0.2033
500 : USD 0.1954
1000 : USD 0.1913

1212 - WHS 4


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MOQ : 863
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BAL-CC25-01D3
STMicroelectronics

863 : USD 0.1134

8657 - WHS 5


Ships to you between Mon. 20 May to Fri. 24 May

MOQ : 174
Multiples : 1

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BAL-CC25-01D3
STMicroelectronics

174 : USD 0.013
250 : USD 0.0127

4258 - WHS 6


Ships to you between Mon. 20 May to Fri. 24 May

MOQ : 252
Multiples : 1

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BAL-CC25-01D3
STMicroelectronics

252 : USD 0.1605

     
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BAL-CC25-01D3 50 ohm, conjugate match to CC253x, CC254x, CC257x, CC852x, CC853x, transformer balun Datasheet production data Description STMicroelectronics BAL-CC25-01D3 is an ultra miniature balun which integrates a matching network in a monolithic glass substrate. This has been customized for the CC25xx and CC85xx RF transceivers. Its a design using STMicroelectronics IPD (integrated passive device) technology on non- conductive glass substrate to optimize RF )OLS &KLS SDFNDJH performance. EXPSV Figure 1. Pin configuration (top view) Features SE 2.45 GHz balun with integrated matching RF N network Matching optimized for following chip-sets: CC2530, CC2531, CC2533 CC2540 RF P GND CC2543, CC2544, CC2545 CC2570, CC2571 CC8520, CC8521 CC8530, CC82531 Figure 2. Application schematic (top view) Low insertion loss 3RZHU 6XSSO Low amplitude imbalance Low phase imbalance Coated Flip-Chip on glass && && && && % / && Small footprint: < 0.88 mm && && && && && && && 2SWLRQDO 5)B1 5)B1 6( && && ILOWHULQJ Benefits = 5)B3 5)B3 *1 Very low profile High RF performance PCB space saving versus discrete solution BOM count reduction Efficient manufacturability November 2015 DocID024657 Rev 4 1/10 This is information on a product in full production. www.st.com 10Characteristics BAL-CC25-01D3 1 Characteristics Table 1. Absolute maximum rating (limiting values) Value Symbol Parameter Unit Min. Typ. Max. P Input power RF 20 dBm PEAK IN ESD ratings MIL STD883C (HBM: C = 100 pF, R = 1.5 kair discharge) 2000 V ESD ratings machine model (MM: C = 200 pF, R = 25 L = 500 nH) 500 V ESD ESD ratings charged device model (CDM, JESD22-C101D) 500 T Operating temperature -40 +125 C OP Table 2. Electrical characteristics - RF performance (T = 25 C) amb Value Symbol Parameter Unit Min. Typ. Max. Z Nominal differential output impedance OUT Conjugate match to CC25xx, CC85xx Z Nominal input impedance IN F Frequency range (bandwidth) 2379 2507 I Insertion loss in bandwidth 0.66 dB L R Single ended return loss in bandwidth 19 dB L SE R Differential ended return loss in bandwidth 19 dB L DIFF Phase imbalance 14 imb A Amplitude imbalance 0.3 dB imb 2/10 DocID024657 Rev 4

Tariff Desc

8504.50.10 Electrical transformers, static converters (for example, rectifiers) and inductors.

8504.50 COILS, toroidal, having ALL of the following: (a) winding wire dia NOT exceeding 0.25 mm; (b) internal window dia NOT exceeding 40 mm; (c) external dia NOT exceeding 55 mm Op. 17.06.1985 Dec. 13.01.1986 - TC 8532473

8504.90 CORES AND SHAPES, ferrite, iron powder or molybdenum permalloy powder Op. 13.03.1984 Dec. 13.03.1984 - TC 8342777

8547.9 TC 8535449 SHEETING OR SHAPES, electrically insulating, thermally conductive,
being combinations of two OR more of the following:
(a) silicone rubber;
(b) glass fibre;
(c) boron nitride;
(d) polyimide;
(e) copper
C-Max
C-Max (VA)
SG3
ST
ST MICROELECTRONICS
ST2
ST7
STM
STMICRELECTRONICS
STN

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