L3GD20 STMicroelectronics

L3GD20 MEMS motion sensor: three-axis digital output gyroscope Datasheet - production data Applications Gaming and virtual reality input devices Motion control with MMI (man-machine interface) GPS navigation systems Appliances and robotics LGA-16 (4x4x1 mm) Description The L3GD20 is a low-power three-axis angular Features rate sensor. Three selectable full scales (250/500/2000 It includes a sensing element and an IC interface dps) capable of providing the measured angular rate to 2 I C/SPI digital output interface the external world through a digital interface 2 16 bit-rate value data output (I C/SPI). 8-bit temperature data output The sensing element is manufactured using a dedicated micro-machining process developed by Two digital output lines (interrupt and data STMicroelectronics to produce inertial sensors ready) and actuators on silicon wafers. Integrated low- and high-pass filters with user- selectable bandwidth The IC interface is manufactured using a CMOS process that allows a high level of integration to Wide supply voltage: 2.4 V to 3.6 V design a dedicated circuit which is trimmed to Low voltage-compatible IOs (1.8 V) better match the sensing element characteristics. Embedded power-down and sleep mode The L3GD20 has a full scale of 250/500/ 2000 dps and is capable of measuring rates with a Embedded temperature sensor user-selectable bandwidth. Embedded FIFO The L3GD20 is available in a plastic land grid High shock survivability array (LGA) package and can operate within a Extended operating temperature range (-40 C temperature range of -40 C to +85 C. to +85 C) ECOPACK RoHS and Green compliant Table 1. Device summary Order code Temperature range (C) Package Packing L3GD20 -40 to +85 LGA-16 (4x4x1 mm) Tray L3GD20TR -40 to +85 LGA-16 (4x4x1 mm) Tape and reel February 2013 DocID022116 Rev 2 1/44 This is information on a product in full production. www.st.com 44Contents L3GD20 Contents 1 Block diagram and pin description . 6 1.1 Pin description 6 2 Mechanical and electrical specifications 8 2.1 Mechanical characteristics . 8 2.2 Electrical characteristics . 9 2.3 Temperature sensor characteristics 9 2.4 Communication interface characteristics . 10 2.4.1 SPI - serial peripheral interface . 10 2.4.2 I2C - Inter IC control interface 11 2.5 Absolute maximum ratings 12 2.6 Terminology . 13 2.6.1 Sensitivity 13 2.6.2 Zero-rate level 13 2.7 Soldering information 13 3 Application hints . 14 4 Digital main blocks . 15 4.1 Block diagram 15 4.2 FIFO . 15 4.2.1 Bypass mode . 16 4.2.2 FIFO mode . 16 4.2.3 Stream mode . 17 4.2.4 Bypass-to-stream mode . 19 4.2.5 Stream-to-FIFO mode 19 4.2.6 Retrieve data from FIFO 20 5 Digital interfaces . 21 5.1 I2C serial interface 21 5.1.1 I2C operation . 22 5.2 SPI bus interface . 23 5.2.1 SPI read . 25 2/44 DocID022116 Rev 2