LIS331DLH STMicroelectronics

LIS331DLH MEMS digital output motion sensor ultra low-power high performance 3-axes nano accelerometer Features Wide supply voltage, 2.16 V to 3.6 V Low voltage compatible IOs, 1.8 V Ultra low-power mode consumption down to 10 A LGA 16 (3x3x1 mm) 2g/4g/8g dynamically selectable full-scale 2 I C/SPI digital output interface 16 bit data output Description 2 independent programmable interrupt The LIS331DLH is an ultra low-power high generators for free-fall and motion detection performance three axes linear accelerometer Sleep to wake-up function 2 belonging to the nano family, with digital I C/SPI 6D orientation detection serial interface standard output. Embedded self-test The device features ultra low-power operational modes that allow advanced power saving and 10000 g high shock survivability smart sleep to wake-up functions. ECOPACK RoHS and Green compliant (see Section 8) The LIS331DLH has dynamically user selectable full scales of 2g/4g/8g and it is capable of measuring accelerations with output data rates Applications from 0.5 Hz to 1 kHz. Motion activated functions The self-test capability allows the user to check Free-fall detection the functioning of the sensor in the final application. Intelligent power saving for handheld devices The device may be configured to generate Pedometer interrupt signal by inertial wake-up/free-fall events Display orientation as well as by the position of the device itself. Gaming and virtual reality input devices Thresholds and timing of interrupt generators are programmable by the end user on the fly. Impact recognition and logging Vibration monitoring and compensation The LIS331DLH is available in small thin plastic land grid array package (LGA) and it is guaranteed to operate over an extended temperature range from -40 C to +85 C. Table 1. Device summary Order codes Temperature range C Package Packaging LIS331DLH -40 to +85 LGA 16 Tray LIS331DLHTR -40 to +85 LGA 16 Tape and reel July 2009 Doc ID 15094 Rev 3 1/38 www.st.com 38 Contents LIS331DLH Contents 1 Block diagram and pin description . 6 1.1 Block diagram . 6 1.2 Pin description 6 2 Mechanical and electrical specifications 8 2.1 Mechanical characteristics . 8 2.2 Electrical characteristics . 9 2.3 Communication interface characteristics . 10 2.3.1 SPI - serial peripheral interface . 10 2.3.2 I2C - inter IC control interface 11 2.4 Absolute maximum ratings 12 2.5 Terminology . 13 2.5.1 Sensitivity 13 2.5.2 Zero-g level 13 2.5.3 Self-test . 13 2.5.4 Sleep to wake-up 13 3 Functionality 14 3.1 Sensing element 14 3.2 IC interface 14 3.3 Factory calibration 14 4 Application hints . 15 4.1 Soldering information 15 5 Digital interfaces . 16 5.1 I2C serial interface 16 5.1.1 I2C operation . 17 5.2 SPI bus interface . 18 5.2.1 SPI read . 19 5.2.2 SPI write 20 5.2.3 SPI read in 3-wires mode . 21 2/38 Doc ID 15094 Rev 3