LIS33DETR STMicroelectronics

LIS33DE MEMS motion sensor 3-axis - 2g/8g smart digital output nano accelerometer Features 2.16 V to 3.6 V supply voltage 1.8 V compatible IOs < 1 mW power consumption 2g/ 8g dynamically selectable full-scale 2 I C/SPI digital output interface Programmable interrupt generator 3 LGA 16 (3x3x1mm ) Embedded self test 10000g high shock survivability The IC interface is manufactured using a CMOS ECOPACK RoHS and Green compliant process that allows to design a dedicated circuit (see Section 8) which is trimmed to better match the sensing element characteristics. Applications The LIS33DE has dynamically user selectable full Portrait - landascape image rotation in mobile scales of 2g/8g and it is capable of measuring phones and PDA accelerations with an output data rate of 100 Hz Motion activated user interfaces or 400 Hz. Gaming A self-test capability allows the user to check the functioning of the sensor in the final application. Motion triggered wake-up The device may be configured to generate inertial wake-up/free-fall interrupt signals when a Description programmable acceleration threshold is crossed The LIS33DE is an ultra compact low-power three at least in one of the three axis. Thresholds and axis linear accelerometer belonging to the nano timing of interrupt generator are programmable by family of ST motion sensors. It includes a sensing the end user on the fly. element and an IC interface able to provide the The LIS33DE is available in plastic Thin Land measured acceleration to the external world 2 Grid Array package (LGA) and it is designed to through I C/SPI serial interface. operate over an extended temperature range from The sensing element is manufactured using a -40C to +85C. dedicated process developed by ST to produce inertial sensors and actuators in silicon. Table 1. Device summary Order code Temp range, CPackage Packing LIS33DE -40 to +85 LGA 16 Tray LIS33DETR -40 to +85 LGA 16 Tape and reel April 2009 Doc ID 15596 Rev 1 1/31 www.st.com 31 Contents LIS33DE Contents 1 Block diagram and pin description . 5 1.1 Block diagram . 5 1.2 Pin description 5 2 Mechanical and electrical specifications 7 2.1 Mechanical characteristics . 7 2.2 Electrical characteristics . 8 2.3 Communication interface characteristics 9 2.3.1 SPI - serial peripheral interface 9 2.3.2 I2C - Inter IC control interface 10 2.4 Absolute maximum ratings 11 2.5 Terminology . 12 2.5.1 Sensitivity 12 2.5.2 Zero-g level 12 2.5.3 Self test . 12 3 Functionality 13 3.1 Sensing element 13 3.2 IC interface 13 3.3 Factory calibration 13 4 Application hints . 14 4.1 Soldering information 14 5 Digital interfaces . 15 5.1 I2C serial interface 15 5.1.1 I2C operation . 16 5.2 SPI bus interface . 17 5.2.1 SPI read . 18 5.2.2 SPI write 19 5.2.3 SPI read in 3-wires mode . 20 6 Register mapping 21 2/31 Doc ID 15596 Rev 1