LSM303DTR STMicroelectronics

LSM303D Ultra-compact high-performance eCompass module: 3D accelerometer and 3D magnetometer Datasheet - production data Display orientation Gaming and virtual reality input devices Impact recognition and logging Vibration monitoring and compensation Description LGA-16 (3x3x1 mm) The LSM303D is a system-in-package featuring a 3D digital linear acceleration sensor and a 3D digital magnetic sensor. The LSM303D has linear acceleration full scales Features of 2g / 4g / 6g / 8g / 16g and a magnetic 3 magnetic field channels and 3 acceleration field full scale of 2 / 4 / 8 / 12 gauss. channels 2 The LSM303D includes an I C serial bus 2/4/8/12 gauss magnetic full scale interface that supports standard and fast mode (100 kHz and 400 kHz) and SPI serial standard 2/4/6/8/16 g linear acceleration full scale interface. 16-bit data output 2 The system can be configured to generate an SPI / I C serial interfaces interrupt signal for free-fall, motion detection and Analog supply voltage 2.16 V to 3.6 V magnetic field detection. Thresholds and timing of Power-down mode / low-power mode interrupt generators are programmable by the end user. Programmable interrupt generators for free- fall, motion detection and magnetic field Magnetic and accelerometer blocks can be detection enabled or put into power-down mode separately. Embedded temperature sensor The LSM303D is available in a plastic land grid Embedded FIFO array package (LGA) and is guaranteed to operate over an extended temperature range ECOPACK , RoHS and Green compliant from -40 C to +85 C. Applications Table 1. Device summary Tilt-compensated compasses Temperature Part number Package Packaging Map rotation range C Position detection LSM303D -40 to +85 LGA-16 Tray Motion-activated functions Tape and LSM303DTR -40 to +85 LGA-16 reel Free-fall detection Click/double-click recognition Pedometers Intelligent power saving for handheld devices November 2013 DocID023312 Rev 2 1/52 This is information on a product in full production. www.st.comContents LSM303D Contents 1 Block diagram and pin description . 8 1.1 Block diagram . 8 1.2 Pin description 8 2 Module specifications . 10 2.1 Sensor characteristics . 10 2.2 Temperature sensor characteristics . 11 2.3 Electrical characteristics 12 2.4 Communication interface characteristics . 13 2.4.1 SPI - serial peripheral interface . 13 2 2.4.2 Sensor I C - inter-IC control interface 14 2.5 Absolute maximum ratings 15 3 Terminology . 16 3.1 Set/reset pulse . 16 3.2 Sensitivity . 16 3.2.1 Linear acceleration sensor sensitivity 16 3.2.2 Magnetic sensor sensitivity 16 3.3 Zero-g level . 16 3.4 Zero-gauss level 16 4 Functionality 17 4.1 Self-test 17 4.2 Temperature sensor . 17 4.3 FIFO . 17 4.4 Factory calibration 18 5 Application hints . 19 5.1 External capacitors 19 5.2 Pull-up resistors 19 5.3 Digital Interface power supply . 20 5.4 Soldering information 20 2/52 DocID023312 Rev 2