MP34DT05
MEMS audio sensor omnidirectional digital microphone
Datasheet - production data
Digital still and video cameras
Antitheft systems
Description
The MP34DT05 is an ultra-compact, low-power,
omnidirectional, digital MEMS microphone built
with a capacitive sensing element and an IC
interface.
The sensing element, capable of detecting
acoustic waves, is manufactured using a
specialized silicon micromachining process
dedicated to produce audio sensors.
The IC interface is manufactured using a CMOS
process that allows designing a dedicated circuit
able to provide a digital signal externally in PDM
Features
format.
Single supply voltage
The MP34DT05 is a low-distortion digital
Low power consumption
microphone with a 64 dB signal-to-noise ratio and
AOP = 122.5 dBSPL
26 dBFS 3 dB sensitivity.
64 dB signal-to-noise ratio
The MP34DT05 is available in a top-port, SMD-
Omnidirectional sensitivity
compliant, EMI-shielded package and is
26 dBFS 3 dB sensitivity
guaranteed to operate over an extended
PDM output
temperature range from -40 C to +85 C.
HCLGA package
Top-port design
Table 1: Device summary
SMD-compliant
Temp.
Order codes Package Packing
EMI-shielded
range [C]
ECOPACK , RoHS, and Green
HCLGA
compliant
MP34DT05 -40 to +85 (3 x 4 x 1 mm) Tray
4LD
Applications
HCLGA
Mobile terminals
Tape and
MP34DT05TR -40 to +85 (3 x 4 x 1 mm)
Laptop and notebook computers
reel
4LD
Portable media players
VoIP
Speech recognition
A/V eLearning devices
Gaming and virtual reality input devices
November 2016 DocID029902 Rev 1 1/21
www.st.com
This is information on a product in full production.
Contents MP34DT05
Contents
1 Pin description ................................................................................ 5
2 Acoustic and electrical specifications ........................................... 6
2.1 Acoustic and electrical characteristics ............................................... 6
2.2 Timing characteristics ....................................................................... 7
2.3 Frequency response ......................................................................... 8
3 Application recommendations ....................................................... 9
4 Carrier tape mechanical specifications ....................................... 11
5 Process recommendations ........................................................... 12
6 Sensing element ............................................................................ 14
7 Absolute maximum ratings ........................................................... 15
8 Functionality .................................................................................. 16
8.1 L/R channel selection ...................................................................... 16
9 Package information ..................................................................... 17
9.1 Soldering information ...................................................................... 17
9.2 HCLGA package information........................................................... 18
10 Revision history ............................................................................ 20
2/21 DocID029902 Rev 1