MP34DT05TR STMicroelectronics

MP34DT05 MEMS audio sensor omnidirectional digital microphone Datasheet - production data Digital still and video cameras Antitheft systems Description The MP34DT05 is an ultra-compact, low-power, omnidirectional, digital MEMS microphone built with a capacitive sensing element and an IC interface. The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process dedicated to produce audio sensors. The IC interface is manufactured using a CMOS process that allows designing a dedicated circuit able to provide a digital signal externally in PDM Features format. Single supply voltage The MP34DT05 is a low-distortion digital Low power consumption microphone with a 64 dB signal-to-noise ratio and AOP = 122.5 dBSPL 26 dBFS 3 dB sensitivity. 64 dB signal-to-noise ratio The MP34DT05 is available in a top-port, SMD- Omnidirectional sensitivity compliant, EMI-shielded package and is 26 dBFS 3 dB sensitivity guaranteed to operate over an extended PDM output temperature range from -40 C to +85 C. HCLGA package Top-port design Table 1: Device summary SMD-compliant Temp. Order codes Package Packing EMI-shielded range [C] ECOPACK , RoHS, and Green HCLGA compliant MP34DT05 -40 to +85 (3 x 4 x 1 mm) Tray 4LD Applications HCLGA Mobile terminals Tape and MP34DT05TR -40 to +85 (3 x 4 x 1 mm) Laptop and notebook computers reel 4LD Portable media players VoIP Speech recognition A/V eLearning devices Gaming and virtual reality input devices November 2016 DocID029902 Rev 1 1/21 www.st.com This is information on a product in full production. Contents MP34DT05 Contents 1 Pin description ................................................................................ 5 2 Acoustic and electrical specifications ........................................... 6 2.1 Acoustic and electrical characteristics ............................................... 6 2.2 Timing characteristics ....................................................................... 7 2.3 Frequency response ......................................................................... 8 3 Application recommendations ....................................................... 9 4 Carrier tape mechanical specifications ....................................... 11 5 Process recommendations ........................................................... 12 6 Sensing element ............................................................................ 14 7 Absolute maximum ratings ........................................................... 15 8 Functionality .................................................................................. 16 8.1 L/R channel selection ...................................................................... 16 9 Package information ..................................................................... 17 9.1 Soldering information ...................................................................... 17 9.2 HCLGA package information........................................................... 18 10 Revision history ............................................................................ 20 2/21 DocID029902 Rev 1