STM32F103xC, STM32F103xD, STM32F103xE High-density performance line Arm -based 32-bit MCU with 256 to 512KB Flash, USB, CAN, 11 timers, 3 ADCs, 13 communication interfaces Datasheet production data Features Core: Arm 32-bit Cortex -M3 CPU WLCSP64 72 MHz maximum frequency, 1.25 DMIPS/MHz LQFP64 10 10 mm, LQFP100 14 14 mm, LFBGA100 10 10 mm (Dhrystone 2.1) performance at 0 wait state LQFP144 20 20 mm LFBGA144 10 10 mm memory access Single-cycle multiplication and hardware Up to 11 timers division Up to four 16-bit timers, each with up to 4 Memories IC/OC/PWM or pulse counter and quadrature 256 to 512 Kbytes of Flash memory (incremental) encoder input up to 64 Kbytes of SRAM 2 16-bit motor control PWM timers with dead- Flexible static memory controller with 4 Chip time generation and emergency stop Select. Supports Compact Flash, SRAM, 2 watchdog timers (Independent and Window) PSRAM, NOR and NAND memories SysTick timer: a 24-bit downcounter LCD parallel interface, 8080/6800 modes 2 16-bit basic timers to drive the DAC Clock, reset and supply management Up to 13 communication interfaces 2.0 to 3.6 V application supply and I/Os 2 Up to 2 I C interfaces (SMBus/PMBus) POR, PDR, and programmable voltage detector Up to 5 USARTs (ISO 7816 interface, LIN, IrDA (PVD) capability, modem control) 4-to-16 MHz crystal oscillator 2 Up to 3 SPIs (18 Mbit/s), 2 with I S interface Internal 8 MHz factory-trimmed RC multiplexed Internal 40 kHz RC with calibration CAN interface (2.0B Active) 32 kHz oscillator for RTC with calibration USB 2.0 full speed interface Low power SDIO interface Sleep, Stop and Standby modes CRC calculation unit, 96-bit unique ID V supply for RTC and backup registers BAT ECOPACK packages 3 12-bit, 1 s A/D converters (up to 21 channels) Table 1.Device summary Conversion range: 0 to 3.6 V Reference Part number Triple-sample and hold capability Temperature sensor STM32F103RC STM32F103VC STM32F103xC STM32F103ZC 2 12-bit D/A converters DMA: 12-channel DMA controller STM32F103RD STM32F103VD STM32F103xD STM32F103ZD Supported peripherals: timers, ADCs, DAC, 2 2 SDIO, I Ss, SPIs, I Cs and USARTs STM32F103RE STM32F103ZE STM32F103xE Debug mode STM32F103VE Serial wire debug (SWD) & JTAG interfaces Cortex -M3 Embedded Trace Macrocell Up to 112 fast I/O ports 51/80/112 I/Os, all mappable on 16 external interrupt vectors and almost all 5 V-tolerant July 2018 DS5792 Rev 13 1/143 www.st.comContents STM32F103xC, STM32F103xD, STM32F103xE Contents 1 Introduction 9 2 Description 10 2.1 Device overview 11 2.2 Full compatibility throughout the family 14 2.3 Overview . 15 2.3.1 Arm Cortex -M3 core with embedded Flash and SRAM 15 2.3.2 Embedded Flash memory . 15 2.3.3 CRC (cyclic redundancy check) calculation unit 15 2.3.4 Embedded SRAM . 15 2.3.5 FSMC (flexible static memory controller) 15 2.3.6 LCD parallel interface 16 2.3.7 Nested vectored interrupt controller (NVIC) 16 2.3.8 External interrupt/event controller (EXTI) . 16 2.3.9 Clocks and startup . 16 2.3.10 Boot modes 17 2.3.11 Power supply schemes . 17 2.3.12 Power supply supervisor 17 2.3.13 Voltage regulator 17 2.3.14 Low-power modes . 18 2.3.15 DMA 18 2.3.16 RTC (real-time clock) and backup registers 18 2.3.17 Timers and watchdogs 19 2.3.18 IC bus 21 2.3.19 Universal synchronous/asynchronous receiver transmitters (USARTs) 21 2.3.20 Serial peripheral interface (SPI) . 21 2 2.3.21 Inter-integrated sound (I S) 21 2.3.22 SDIO . 22 2.3.23 Controller area network (CAN) . 22 2.3.24 Universal serial bus (USB) . 22 2.3.25 GPIOs (general-purpose inputs/outputs) 22 2.3.26 ADC (analog to digital converter) 22 2.3.27 DAC (digital-to-analog converter) 23 2.3.28 Temperature sensor 24 2/143 DS5792 Rev 13