X-On Electronics has gained recognition as a prominent supplier of STM32MP157CAB3 Microprocessors - MPU across the USA, India, Europe, Australia, and various other global locations. STM32MP157CAB3 Microprocessors - MPU are a product manufactured by STMicroelectronics. We provide cost-effective solutions for Microprocessors - MPU, ensuring timely deliveries around the world.

STM32MP157CAB3 STMicroelectronics

STM32MP157CAB3 electronic component of STMicroelectronics
STM32MP157CAB3 STMicroelectronics
STM32MP157CAB3 Microprocessors - MPU
STM32MP157CAB3  Semiconductors

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Part No. STM32MP157CAB3
Manufacturer: STMicroelectronics
Category: Microprocessors - MPU
Description: Microprocessors - MPU 16/32-BITS MICROS
Datasheet: STM32MP157CAB3 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 25.118 ea
Line Total: USD 25.12 
Availability - 0
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Wed. 01 Jan to Fri. 03 Jan
MOQ : 1
Multiples : 1
1 : USD 25.118
10 : USD 23.173
25 : USD 22.1273
100 : USD 19.7849
250 : USD 18.8752
504 : USD 17.3588
1008 : USD 17.3484

   
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We are delighted to provide the STM32MP157CAB3 from our Microprocessors - MPU category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the STM32MP157CAB3 and other electronic components in the Microprocessors - MPU category and beyond.

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STM32MP157C/F Arm dual Cortex -A7 800 MHz + Cortex -M4 MPU, 3D GPU, TFT/DSI, 37 comm. interfaces, 29 timers, adv. analog, crypto Datasheet - production data Features TFBGA LFBGA Includes ST state-of-the-art patented LFBGA448 (18 18mm) TFBGA361 (12 12 mm) technology LFBGA354 (16 16mm) TFBGA257 (10 10 mm) min Pitch 0.5mm Pitch 0.8mm Core Internal temperature sensors 32-bit dual-core Arm Cortex -A7 Low-power modes: Sleep, Stop and Standby L1 32-Kbyte I / 32-Kbyte D for each core DDR memory retention in Standby mode 256-Kbyte unified level 2 cache Controls for PMIC companion chip Arm NEON and Arm TrustZone 32-bit Arm Cortex -M4 with FPU/MPU Low-power consumption Up to 209 MHz (Up to 703 CoreMark ) Total current consumption down to 2 A (Standby mode, no RTC, no LSE, no Memories BKPSRAM, no RETRAM) External DDR memory up to 1 Gbyte up to LPDDR2/LPDDR3-1066 16/32-bit Clock management up to DDR3/DDR3L-1066 16/32-bit Internal oscillators: 64 MHz HSI oscillator, 708 Kbytes of internal SRAM: 256 Kbytes of 4 MHz CSI oscillator, 32 kHz LSI oscillator AXI SYSRAM + 384 Kbytes of AHB SRAM + External oscillators: 8-48 MHz HSE oscillator, 64 Kbytes of AHB SRAM in Backup domain 32.768 kHz LSE oscillator and 4 Kbytes of SRAM in Backup domain 6 PLLs with fractional mode Dual mode Quad-SPI memory interface Flexible external memory controller with up to General-purpose input/outputs 16-bit data bus: parallel interface to connect Up to 176 I/O ports with interrupt capability external ICs and SLC NAND memories with up Up to 8 secure I/Os to 8-bit ECC Up to 6 Wakeup, 3 tampers, 1 active tamper Security/safety Secure boot, TrustZone peripherals, active Interconnect matrix tamper 2 bus matrices Cortex -M4 resources isolation 64-bit Arm AMBA AXI interconnect, up to 266 MHz Reset and power management 32-bit Arm AMBA AHB interconnect, up 1.71 V to 3.6 V I/Os supply (5 V-tolerant I/Os) to 209 MHz POR, PDR, PVD and BOR 3 DMA controllers to unload the CPU On-chip LDOs (RETRAM, BKPSRAM, DSI 1.2 V, USB 1.8 V, 1.1 V) 48 physical channels in total Backup regulator (~0.9 V) May 2021 DS12505 Rev 6 1/262 This is information on a product in full production. www.st.comSTM32MP157C/F 1 high-speed general-purpose master direct up to WXGA (1366 768) 60 fps or up to memory access controller (MDMA) Full HD (1920 1080) 30 fps Pixel clock up to 90 MHz 2 dual-port DMAs with FIFO and request router capabilities for optimal peripheral Two layers with programmable colour LUT management MIPI DSI 2 data lanes up to 1 Gbps each Up to 37 communication peripherals Up to 29 timers and 3 watchdogs 2 6 I C FM+ (1 Mbit/s, SMBus/PMBus) 2 32-bit timers with up to 4 IC/OC/PWM or 4 UART + 4 USART (12.5 Mbit/s, ISO7816 pulse counter and quadrature (incremental) interface, LIN, IrDA, SPI slave) encoder input 6 SPI (50 Mbit/s, including 3 with full duplex 2 16-bit advanced motor control timers 2 I S audio class accuracy via internal audio PLL 10 16-bit general-purpose timers (including 2 or external clock) basic timers without PWM) 2 4 SAI (stereo audio: I S, PDM, SPDIF Tx) 5 16-bit low-power timers SPDIF Rx with 4 inputs RTC with sub-second accuracy and hardware HDMI-CEC interface calendar MDIO Slave interface 2 4 Cortex -A7 system timers (secure, non- secure, virtual, hypervisor) 3 SDMMC up to 8-bit (SD / eMMC / SDIO) 1 SysTick M4 timer 2 CAN controllers supporting CAN FD protocol, out of which one supports time- 3 watchdogs (2 independent and window) triggered CAN (TTCAN) Hardware acceleration 2 USB 2.0 high-speed Host + 1 USB 2.0 full-speed OTG simultaneously AES 128, 192, 256, TDES or 1 USB 2.0 high-speed Host HASH (MD5, SHA-1, SHA224, SHA256), + 1 USB 2.0 high-speed OTG HMAC simultaneously 2 true random number generator 10/100M or Gigabit Ethernet GMAC (3 oscillators each) IEEE 1588v2 hardware, 2 CRC calculation unit MII/RMII/GMII/RGMII 8- to 14-bit camera interface up to 140 Mbyte/s Debug mode Arm CoreSight trace and debug: SWD and 6 analog peripherals JTAG interfaces 2 ADCs with 16-bit max. resolution (12 bits 8-Kbyte embedded trace buffer up to 4.5 Msps, 14 bits up to 4 Msps, 16 bits up to 3.6 Msps) 3072-bit fuses including 96-bit unique ID, 1 temperature sensor up to 1184-bit available for user 2 12-bit D/A converters (1 MHz) All packages are ECOPACK2 compliant 1 digital filters for sigma delta modulator (DFSDM) with 8 channels/6 filters Internal or external ADC/DAC reference V REF+ Graphics 3D GPU: Vivante - OpenGL ES 2.0 Up to 26 Mtriangle/s, 133 Mpixel/s LCD-TFT controller, up to 24-bit // RGB888 2/262 DS12505 Rev 6

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8542.31.00 52 No ..CMOS and MOS Microprocessors (MPU), Microcontrollers (MCU) and Digital Signal Processors (DSP)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits Digital.
C-Max (VA)
SG3
ST
ST MICROELECTRONICS
ST2
ST7
STM
STMICRELECTRONICS
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