STWLC04 Qi based 1 W wireless power receiver Datasheet - production data Rx coil NTC protection Thermal protection Low power dissipative rectifier overvoltage clamp Flip Chip 77 bumps (3.12x4.73 mm) Applications Wearable applications Smart watches Glasses Medical and healthcare instrumentation Description Features The STWLC04 is an integrated wireless power 1 W output power receiver suitable for wearable applications. The Qi 1.0 wireless communication protocol STWLC04 is focused on 1-watt power transfer based based on Qi protocol with digital control and Integrated high efficiency synchronous precise analog control loops ensuring stable rectifier operation. Together with the STWBC-WA 800 kHz programmable step-down converter transmitter, the STWLC04 enables a complete with input current and input voltage 2 wireless power transmission. I C interface allows regulation loop many parameters to be customized in the device Step-down converter efficiency up to 90% and this configuration can be stored in the Simplified Li-Ion/Polymer charger function embedded NVM. 32-bit, 16 MHz embedded microcontroller The STWLC04 can deliver the output power in with 16 kB ROM and 2 kB RAM memory two modes: as a power supply with configured 2 kB NVM for customization output voltage or as a simple CC/CV battery Integrated driver for external supply switch charger with configurable charging current, Precise voltage and current measurements charging voltage and termination current. The for received power calculation STWLC04 can detect the external (wired) power 2 I C interface supply connection and drive an external power Configurable GPIO output switch. Table 1: Device summary Order code Description Package Packing STWLC04JR Wearable optimized 1 W output Flip Chip 77 bumps (3.12x4.73 mm) Tape and reel March 2017 DocID029574 Rev 2 1/45 www.st.com This is information on a product in full production. Contents STWLC04 Contents 1 Introduction ..................................................................................... 6 2 Pin configuration ............................................................................. 7 3 Maximum ratings ........................................................................... 10 4 Electrical characteristics .............................................................. 12 5 Device description ......................................................................... 16 5.1 Using the STWLC04 as a power supply .......................................... 16 5.2 Using the STWLC04 as a battery charger ....................................... 17 5.3 Connecting external power supply .................................................. 17 5.4 Proprietary protocol based on Qi ..................................................... 19 5.5 Device interface .............................................................................. 19 6 I2C register description ................................................................ 20 6.1 ADC measured values .................................................................... 26 6.2 Service registers ............................................................................. 28 7 Non-volatile memory ..................................................................... 29 7.1 NVM sector maps ............................................................................ 29 8 Application information ................................................................ 36 8.1 Application schematic and recommended external components..... 36 8.2 External passive component selection ............................................ 39 8.2.1 Input resonant circuit component selection (L1, C1, C2) ................. 39 8.2.2 Voltage clamp resistor selection (RCL1, RCL2) ............................... 39 8.2.3 Load modulation capacitor selection (CM1, CM2) ........................... 40 8.2.4 Feedback resistor divider component selection (RFB1, RFB2) ....... 40 8.2.5 Rx NTC circuit components selection (RNTC, R1) .......................... 40 8.2.6 Soft-start capacitor selection (C10) .................................................. 40 8.2.7 External supply transistor selection .................................................. 40 8.3 Reference PCB layout ..................................................................... 41 9 Package information ..................................................................... 42 9.1 Flip Chip 77 bumps (3.12x4.73 mm) package information .............. 42 10 Revision history ............................................................................ 44 2/45 DocID029574 Rev 2