VIPer01 Datasheet Energy saving off-line high voltage converter Features 800 V avalanche-rugged power MOSFET allowing ultra wide V input range to AC be covered Embedded HV startup and sense-FET Current mode PWM controller Drain current limit protection (OCP) Figure 1. Basic application Wide supply voltage range: 4.5 V to 30 V schematic Self-supply option allows the auxiliary winding or bias components to be Din Rin ~ AC removed Cin Minimized system input power consumption: R1 Less than 10 mW 230 V in no-load condition AC Less than 400 mW 230 V with 250 mW load AC VCC DRAIN C2 Jittered switching frequency reduces the EMI filter cost: Cs R2 D2 FB 30 kHz 7% (type X) GND COMP DIS 60 kHz 7% (type L) C1 Lout 120 kHz 7% (type H) Vout D1 Embedded E/A with 1.2 V reference Cout Protections with automatic restart: overload/short-circuit (OLP), line or output OVP, max. duty cycle counter, V clamp CC Pulse-skip protection to prevent flux-runaway Embedded thermal shutdown Product status link Built-in soft-start for improved system reliability VIPER01 Applications Product label Low power SMPS for home appliances, building and home control, small industrial, consumers, lighting, motion control Low power adapters Description The device is a high voltage converter smartly integrating an 800 V avalanche- rugged power MOSFET with PWM current mode control. The power MOSFET with 800 V breakdown voltage allows the extended input voltage range to be applied, as well as the size of the DRAIN snubber circuit to be reduced. This IC meets the most stringent energy-saving standards as it has very low consumption and operates in pulse frequency modulation under light load. The design of flyback, buck and buck boost converters is supported. The integrated HV startup, sense-FET, error amplifier and oscillator with jitter allow a complete application to be designed with the minimum number of components. DS11423 - Rev 2 - April 2020 www.st.com For further information contact your local STMicroelectronics sales office.VIPer01 Pin setting 1 Pin setting Figure 2. Connection diagram DRAIN GND DRAIN VCC DRAIN DIS DRAIN FB COMP DRAIN GIPD091220151050MT Table 1. Pin description SSOP10 Name Function Ground and MOSFET source. Connection of source of the internal MOSFET and the return of the bias 1 GND current of the device. All groundings of bias components must be tied to a trace going to this pin and kept separate from the pulsed current return. Controller supply. An external storage capacitor has to be connected across this pin and GND. The pin, internally connected to the high voltage current source, provides the VCC capacitor charging current at 2 VCC startup and during steady-state operation, if the self-supply mode is selected. A small bypass capacitor (0.1 F typ.) in parallel, placed as close as possible to the IC, is also recommended, for noise filtering purpose. Disable. If its voltage exceeds the internal threshold V (1.2 V typ.) for more than t time (1 ms, DIS th DEB typ.), the PWM is disabled in auto-restart mode. An input overvoltage protection can be built by connecting 3 DIS a voltage divider between DIS pin and the rectified mains. In case of non-isolated topologies, with the same principle an output overvoltage protection can be implemented. If the disable function is not required, DIS pin must be soldered to GND, which excludes the function. Direct feedback. It is the inverting input of the internal transconductance E/A, which is internally referenced to 1.2 V with respect to GND. In case of non-isolated converter, the output voltage information 4 FB is directly fed into the pin through a voltage divider. In case of primary regulation, the FB voltage divider is connected to the VCC. The E/A is disabled soldering FB to GND. Compensation. It is the output of the internal E/A. A compensation network is placed between this pin and GND to achieve stability and good dynamic performance of the control loop. In case of secondary 5 COMP feedback, the internal E/A must be disabled and the COMP directly driven by the optocoupler to control the DRAIN peak current setpoint. MOSFET drain. The internal high voltage current source sinks current from this pin to charge the VCC capacitor at startup and during steady-state operation. These pins are mechanically connected to the 6 to 10 DRAIN internal metal PAD of the MOSFET in order to facilitate heat dissipation. On the PCB, copper area must be placed under these pins in order to decrease the total junction-to-ambient thermal resistance thus facilitating the power dissipation. DS11423 - Rev 2 page 2/36