S606C Thermal Paste Features Good thermal conductivity Easy to assemble High stability Would not harden Applications Electronic components: IC, CPU, MOS LED, M/B, P/S, Heat Sink, LCD-TV Notebook, PC, Telecom Device, Wireless Hubetc. DDR II Module, DVD Applications, Hand-set Applicationsetc. Storage S606C has a shelf-life of eighteen (18) months from the date of manufacture, as indicated by the lot number, when stored in hte original, unopened contained at, or below 25C. Properties REACH Compliant RoHS Compliant Thermal Conductivity : 5.0 W/m.K Properties S606C Unit Tolerance Test Method Color Gray - - Visual Brook eld HBDV-1 PRIME Viscosity 120K~180K cps - RVF 7 20RPM Thermal Conductivity 5 W/m.k 0.5 ASTM D5470 Penetration 305 mm - ASTM D217 Weight Loss <0.5 % - ASTM E595 3 Speci c Gravity 2.6 g/cm 0.2 ASTM D792 Thermal Resistance 0.011~0.017 C-in/W - ASTM D5470 Volatile 0.16 % - 24 hrs at 100C Working Temperature -40~+180 C - - 12 Volume Resistance Ohm-cm - ASTM D257 >10 Oil Dispersible <0.05 % - 24hrs at 150C Standard Package 30 g/pot - - Breakdown Voltage 3.5 Kv/mm 0.35 - Need samples T-Global Technology Co., Ltd No. 33, Ln. 50, Daren Rd., Taoyuan City, Taoyuan County 33068, Taiwan TEL: +886-3-3618899 FAX: +886-3-3665666 www.tglobalthermal.com www.tglobal.com.tw Thermal Interface Materials: Thermal Pad, Thermal Tape, Thermal Grease, Ceramic Heat Spreader Version1 20131202X-ON Electronics Largest Supplier of Electrical and Electronic Components Click to view similar products for t global manufacturer: Other Similar products are found below : L373-150-0.5A H486A-150-1.0 L373S-150-0.5 LIV2-150X150X0.15 S606C H482-150-2.0A L375-150-3.0A LI-98-150-025