TGNSP-25-C30ML T-Global Technology

TG-NSP25 Non-Silicone Thermal Putty Features TG-NSP25 is a silicone-free type spacer with 2.5 W/m.K Have enough compressibility It has very low thermal resistance It is the best for north bridge IC Properties Thermal Conductivity: 2.5 W/m.K Very low thermal resistance Have enough compressibility 7 0.5 6 0.4 5 0.3 4 3 0.2 2 0.1 1 0 0 0.1 0.2 0.3 0.4 0.5 0.6 10 20 30 40 50 60 70 80 Compressibility % BLT (mm) Reliability Thermal Impedance Initial 250 Hr 500 Hr 1000 Hr 80C Aging 0.124 0.125 0.127 0.126 150C Aging 0.128 0.129 0.129 0.13 85C/85% RH 0.126 0.128 0.129 0.131 Physical Properties TG-NSP25 Unit Tolerance Test Method Color Gray - - Visual Solid Content 100 % - - Viscosity 0.5rpm 5000 Pas - Brookfield Density 2.6 g/cm3 - ASTM D792 Thermal Conductivity 2.5 W/m.K 0.25 ASTM D5470 Low MW Siloxane (D4-10) 0 ppm - GC/MS TML 0.2 % - ASTM E595 CVCM 0.1 % - ASTM E595 14 Volume Resistivity Ohm-cm - ASTM D257 10 Working Temp. -50 to 150 C - - T-Global Technology Co., Ltd No. 33, Ln. 50, Daren Rd., Taoyuan City, Taoyuan County 33068, Taiwan TEL: +886-3-3618899 FAX: +886-3-3665666 www.tglobalthermal.com www.tglobal.com.tw Thermal Interface Materials: Thermal Pad, Thermal Tape, Thermal Grease, Ceramic Heat Spreader Version1 20131202 psi Thermal impedance Cin2/W X-ON Electronics Largest Supplier of Electrical and Electronic Components Click to view similar products for t global manufacturer: Other Similar products are found below : L373-150-0.5A H486A-150-1.0 L373S-150-0.5 LIV2-150X150X0.15 S606C H482-150-2.0A L375-150-3.0A LI-98-150-025