6A60 Taiwan Semiconductor

Manufacturing Company 1. The 6A60 is a manufacturing process developed by Taiwan Semiconductor Manufacturing Company (TSMC) for the fabrication of advanced 3D transistor chips. 2. The 6A60 process utilizes a FinFET transistor architecture and advanced doping techniques in order to achieve superior performance, power efficiency and higher current density. 3. The 6A60 process is based on a 28nm lithography and provides a low leakage power, higher compute power and better thermal performance than its predecessors. 4. The 6A60 process features improved substrate and line width control, as well as scribe-line processes. 5. It also integrates dual work shells to provide better control over the critical process challenges of leak current, lithography line edge roughness (LER), and contact self alignment. 6. The 6A60 process also enables advanced multi-chip packaging that reduces warpage and increases the system integration strength of multiple chips.