ICM-20648 6-Axis MEMS MotionTracking Device with Enhanced EIS Support and Sensor Fusion Processing GENERAL DESCRIPTION APPLICATIONS Wearable Devices The ICM-20648 a 6-axis MotionTracking device that is ideally Smartphones and Tablets suited for Smartphones, Tablets, Wearable Sensors, and IoT Applications general IoT applications. Motion-based game controllers 3-axis gyroscope, 3-axis accelerometer, 3-axis compass, 3D remote controls for Internet connected DTVs and TM and a Digital Motion Processor (DMP ) in a set top boxes, 3D mice 3x3x0.9mm (24-pin QFN) package FEATURES Step Count, Activity Classifier, and B2S (Bring-to-See) 3-Axis Gyroscope with Programmable FSR of Gesture tuned for Wrist Worn Wearable Applications 250dps, 500dps, 1000dps and 2000dps DMP offloads computation of motion processing 3-Axis Accelerometer with Programmable FSR of algorithms from the host processor, improving system 2g, 4g, 8g and 16g power performance Onboard Digital Motion Processor (DMP) Software drivers are fully compliant with Googles latest Android support Android release SW features supported in DMP Enhanced FSYNC functionality to improve timing for o Bring to See applications like EIS o Step Counter 2 ICM-20648 supports an auxiliary I C interface to external o Step Detector sensors, on-chip 16-bit ADCs, programmable digital filters, an o Activity Classifier (walk, run, bike, still) o Calibration: Accel Bias, Compass Cal, Gyro embedded temperature sensor, and programmable Cal interrupts. The device features an operating voltage range 2 o Game Rotation Vector down to 1.71V. Communication ports include I C and high o Significant Motion speed SPI at 7 MHz. o Pick up o Rotation Vector (with Aux compass) ORDERING INFORMATION o GeoMagnetic Rotation Vector (with Aux compass) PART TEMP RANGE PACKAGE o Linear Acceleration ICM-20648 40C to +85C 24-Pin QFN o Gravity Denotes RoHS and Green-Compliant Package o Orientation o Tilt TYPICAL OPERATING CIRCUIT 2 Auxiliary I C interface for external sensors nCS SCLK On-Chip 16-bit ADCs and Programmable Filters SDI 7 MHz SPI or 400 kHz Fast Mode IC Digital-output temperature sensor VDD operating range of 1.71V to 3.6V GND NC 1 18 MEMS structure hermetically sealed and bonded at NC 2 17 NC wafer level NC 3 16 NC ICM-20648 NC RoHS and Green compliant 4 15 NC 5 14 NC NC VDD 6 13 NC 1.71 3.6VDC BLOCK DIAGRAM C2, 0.1 mF 1.71 3.6VDC C1, 0.1 mF C3, 0.1 F SDO InvenSense Inc. InvenSense reserves the right to change the detail Document Number: DS-000179 1745 Technology Drive, San Jose, CA 95110 U.S.A specifications as may be required to permit Revision: 1.1 +1(408) 9887339 improvements in the design of its products. Revision Date: 11/2/2016 www.invensense.com AUX CL SDA / SDI 24 7 SCL / SCLK VDDIO 23 8 nCS SDO / AD0 22 9 AUX DA REGOUT 21 10 RESV FSYNC 11 20 INT2 INT1 19 12ICM-20648 TABLE OF CONTENTS General Description ............................................................................................................................................. 1 Ordering Information ........................................................................................................................................... 1 Typical Operating Circuit ...................................................................................................................................... 1 Applications ......................................................................................................................................................... 1 Features ............................................................................................................................................................... 1 Block Diagram ...................................................................................................................................................... 1 1 Introduction ....................................................................................................................................................... 10 1.1 Purpose and Scope .................................................................................................................................. 10 1.2 Product Overview.................................................................................................................................... 10 1.3 Applications ............................................................................................................................................. 10 2 Features ............................................................................................................................................................. 11 2.1 Gyroscope Features ................................................................................................................................ 11 2.2 Accelerometer Features .......................................................................................................................... 11 2.3 DMP Features .......................................................................................................................................... 11 2.4 Additional Features ................................................................................................................................. 11 3 Electrical Characteristics .................................................................................................................................... 12 3.1 Gyroscope Specifications ........................................................................................................................ 12 3.2 Accelerometer Specifications .................................................................................................................. 13 3.3 Electrical Specifications ........................................................................................................................... 14 2 3.4 I C Timing Characterization ..................................................................................................................... 17 3.5 SPI Timing Characterization .................................................................................................................... 18 3.6 Absolute Maximum Ratings .................................................................................................................... 19 4 Applications Information ................................................................................................................................... 20 4.1 Pin Out Diagram and Signal Description ................................................................................................. 20 4.2 Typical Operating Circuit ......................................................................................................................... 21 4.3 Bill of Materials for External Components .............................................................................................. 21 4.4 Block Diagram ......................................................................................................................................... 22 4.5 Overview ................................................................................................................................................. 22 4.6 Three-Axis MEMS Gyroscope with 16-bit ADCs and Signal Conditioning ............................................... 23 4.7 Three-Axis MEMS Accelerometer with 16-bit ADCs and Signal Conditioning ......................................... 23 4.8 Digital Motion Processor ......................................................................................................................... 23 2 4.9 Primary I C and SPI Serial Communications Interfaces ........................................................................... 23 2 4.10 Auxiliary I C Serial Interface ................................................................................................................ 25 4.11 Self-Test .............................................................................................................................................. 25 4.12 Clocking ............................................................................................................................................... 26 4.13 Sensor Data Registers ......................................................................................................................... 26 4.14 FIFO ..................................................................................................................................................... 26 4.15 FSYNC .................................................................................................................................................. 26 Document Number: DS-000179 Page 2 of 83 Revision: 1.1 Revision Date: 11/2/2016