ICM30670
Worlds First Dual Interface Optical Image Stabilization (OIS) and 6-axis
Motion Tracking Solution
GENERALDESCRIPTION FEATURES
ThesinglechipICM30670istheworldsfirstdualinterfaceOptical
Sensorhubwithintegrated6Axisina32PinLGA:
ImageStabilization(OIS)and6axismotiontrackingsolutionforUser
4x4x0.98mmpackage
Interface,UI,withanintegratedsensorhubandframeworksoftware.
ShakerlessOISCalibrationsupport
Itcombinesindustryleadinggyroscopeandaccelerometersensors
SimultaneousOIS+UIinterfacesupport
withanARMCortexM0CPU,andaDMP4DigitalMotionProcessor
Builtinsensorhubframeworkenablesfasttimetomarket
inasmall4x4x0.98mmLGApackage.
AndroidLollipopandbeyondSupport
SmartFSRSwitchingbetweenOISandUImodes
2
The ICM30670 provides a dedicated I C Master interface for
OnChipRuntimeCalibration
connectingtoOIScontrollers.Additionally,theDMP4runsagyro
2
I CinterfaceforOIScontrollers
filteralgorithmthatallowsforbestinclassOISperformance.
2
AuxiliaryI Cinterfacetosupportadditionalsensors,
enablingmultisensorMotionFusionoperation
TheICM30670servesasasensorhubthatsupportsthecollection
3AxisGyroscopewithProgrammableFSRof250,500,
and processing of data from internal and external sensors. The
1000,and2000dps
processorsaredesignedtooffloadprocessingfromtheApplication
3AxisAccelerometerwithProgrammableFSRof2g,4g,
Processor,therebysavingsystempowerandimprovingperformance.
8gand16g
ARMCortexM0CPUandDMP4
The ARM CortexM0 CPU provides a lowpower programmable
Flash64Kbytes
platformforsoftwaredevelopment.TheDMP4isoptimizedforfixed
SRAM64Kbytes(sharedbyCortexM0,DMPs,FIFO)
pointprocessingandFFTgenerationandcomplementstheCPUby
4timersthatcanbeusedfortimestamp,watchdog,and
offloadingmathintensiveoperationsaswellasrunningtheGyro
generalpurposetimerfunctions
FilterportionoftheOIScontrolalgorithm.
SerialWireDataPortforCortexM0debug/trace
3onchiposcillatorsforsystemclock,accuratetime
TheintegratedInvenSenseSensorFrameworkprovidesanopenand
stamping,andperiodicwakeup
powerfulplatformforcreatingcuttingedgealwaysonapplications
8GPIObidirectionalpinsconfigurableasgeneralpurpose
formobileplatforms.Developerscanusethebuiltinframework
input/output,orinterruptinput/output
components to rapidly develop and launch new features. The
2
I Cupto1MHz;SPIupto8MHz
commandprotocolisdesignedforseamlessportingtonewsystems,
allowingsoftwarereuseandthusmaximizingreturnsonsoftware
investment.
TYPICALOPERATINGCIRCUIT
GPIO4/FSYNC
BLOCKDIAGRAM
GPIO5
AUX_SCL
GPIO0/AUX_SCL
AUX_SDA
GPIO1/AUX_SDA
GPIO2
OIS_SDA
OIS_SDA
OIS_SCL
OIS_SCL
C4, 0.1 F
1 24 SWDIO
VDDIO
GPIO7 2 23
SWDCLK
3 22 NC
NC
NC
4 21 NC
ICM30670
NC 5 20 NC
NC 6 19 GPIO3
nCS
nCS 7 18
GPIO6
SDO/AD0
SDO 8 17 NC
XTALO
SDI/SDA
SDI
SCLK/SCL System Clock 32.768KHz
XTALI
SCLK
RESETL
nRESET
C3, 0.1 F
VDD
1.83.3VDC
C5, 0.1F
ORDERINGINFORMATION
APPLICATIONS
PART TEMPRANGE PACKAGE
SmartphonesandTablets
ICM3067040Cto+85C 32PinLGA
DenotesRoHSandGreenCompliantPackage
InvenSenseInc.
InvenSensereservestherighttochangethedetail DocumentNumber:DS000129
1745TechnologyDrive,SanJose,CA95110U.S.A
specificationsasmayberequiredtopermit Revision:1.0
+1(408)9887339
improvementsinthedesignofitsproducts.. ReleaseDate:06/15/2016
www.invensense.com
9 32
10 31
REGOUT
11 30
12 29
28 NC
13
14 27
15 26
16 25 ICM30670
TABLEOFCONTENTS
GeneralDescription.............................................................................................................................................1
BlockDiagram......................................................................................................................................................1
Applications.........................................................................................................................................................1
Features...............................................................................................................................................................1
Typicaloperatingcircuit......................................................................................................................................1
OrderingInformation...........................................................................................................................................1
1 Introduction.........................................................................................................................................................6
1.1 PurposeandScope....................................................................................................................................6
1.2 ProductOverview......................................................................................................................................6
1.3 Applications...............................................................................................................................................6
2 Features...............................................................................................................................................................7
2.1 GyroscopeFeatures..................................................................................................................................7
2.2 AccelerometerFeatures............................................................................................................................7
2.3 ARMCortexM0Features..........................................................................................................................7
2.4 DMP4Features..........................................................................................................................................7
2.5 OnChipMemory.......................................................................................................................................7
2.6 ClockGenerationUnit...............................................................................................................................8
2.7 SerialInterfaces.........................................................................................................................................8
2.8 DigitalPeripherals.....................................................................................................................................8
2.9 PowerManagement.................................................................................................................................8
3 ElectricalCharacteristics......................................................................................................................................9
3.1 GyroscopeSpecifications..........................................................................................................................9
3.2 AccelerometerSpecifications..................................................................................................................10
3.3 ElectricalSpecifications...........................................................................................................................11
3.3.1 D.C.ElectricalCharacteristics..................................................................................................................11
3.3.2 A.C.ElectricalCharacteristics..................................................................................................................12
3.4 I2CTimingCharacterization....................................................................................................................14
3.5 SPITimingCharacterization....................................................................................................................15
3.6 AbsoluteMaximumRatings....................................................................................................................16
4 ApplicationsInformation...................................................................................................................................17
4.1 PinOutDiagramandSignalDescription.................................................................................................17
4.2 TypicalOperatingCircuit.........................................................................................................................19
4.3 BillofMaterialsforExternalComponents..............................................................................................19
4.4 ICM30670BlockDiagram.......................................................................................................................20
4.5 Overview.................................................................................................................................................21
4.6 ThreeAxisMEMSGyroscopewith16bitADCsandSignalConditioning...............................................21
4.7 ThreeAxisMEMSAccelerometerwith16bitADCsandSignalConditioning.........................................21
4.8 ARMCortexM0CPU...............................................................................................................................21
4.9 DigitalMotionProcessor.........................................................................................................................22
4.10 FLASH......................................................................................................................................................22
4.11 SRAM.......................................................................................................................................................22
4.12 FIFO.........................................................................................................................................................22
4.13 GPIO........................................................................................................................................................22
4.14 DMAController.......................................................................................................................................22
2
4.15 PrimarySLAVEI CORSLAVESPISerialCommunicationsInterfaces......................................................23
2
4.15.1 ICM30670SolutionUsingI CInterface.............................................................................................23
4.15.2 ICM30670SolutionUsingSPIInterface.............................................................................................24
2
4.16 AuxiliaryI CSerialInterface....................................................................................................................24
2
4.17 OISI CSerialInterface............................................................................................................................25
4.18 Timers.....................................................................................................................................................25
4.19 SerialWireDataPort...............................................................................................................................25
4.20 Interrupts................................................................................................................................................25
4.21 OnChipOscillators..................................................................................................................................26
DocumentNumber:DS000129 Page2of39
Revision:1.0
RevDate:06/15/2016