INMP411 Omnidirectional Microphone with Bottom Port and Analog Output GENERAL DESCRIPTION APPLICATIONS The INMP411* is a high performance, high SPL, low noise, low Fire and Safety Radios power, analog output bottom ported, omnidirectional MEMS Safety Masks microphone. The INMP411 consists of a MEMS microphone Tablet Computers Teleconferencing Systems element and an impedance converter amplifier. The INMP411 Studio Microphones sensitivity specification makes it an excellent choice for near- Security and Surveillance field applications. The INMP411 is pin compatible with the INMP401 microphone, providing an easy upgrade path. FEATURES The INMP411 has a linear response up to 131 dB SPL. It offers high SNR and extended wideband frequency response 4.72 3.76 1.0 mm Surface-Mount Package resulting in natural sound with high intelligibility. Low current High 131 dB SPL Acoustic Overload Point consumption enables long battery life for portable Sensitivity of 46 dBV applications. 2 dB Sensitivity Tolerance Omnidirectional Response The INMP411 is available in a 4.72 3.76 1.0 mm surface- High SNR of 62 dBA mount package. It is reflow solder compatible with no Extended Frequency Response from 28 Hz to 20 kHz sensitivity degradation. Low Current Consumption: <250 A *Protected by U.S. Patents 7,449,356 7,825,484 7,885,423 and 7,961,897. Single-Ended Analog Output Other patents are pending. High PSR of 80 dBV Compatible with Sn/Pb and Pb-Free Solder Processes RoHS/WEEE Compliant ORDERING INFORMATION FUNCTIONAL BLOCK DIAGRAM PART TEMP RANGE INMP411ACEZ-R0* 40C to +85C INMP411ACEZ-R7 40C to +85C OUTPUT OUTPUT AMPLIFIER EV INMP411-FX * 13 Tape and Reel 7 Tape and reel to be discontinued. Check with sales invensense.com for availability. POWER INMP411 VDD GND InvenSense Inc. InvenSense reserves the right to change the detail Document Number: DS-INMP411-00 1745 Technology Drive, San Jose, CA 95110 U.S.A specifications as may be required to permit Revision: 1.1 +1(408) 9887339 improvements in the design of its products. Rev Date: 05/21/2014 www.invensense.com INMP411 TABLE OF CONTENTS General Description ................................................................................................................................................. 1 Applications ............................................................................................................................................................. 1 Features ................................................................................................................................................................... 1 Functional Block Diagram ........................................................................................................................................ 1 Ordering Information ............................................................................................................................................... 1 Table of Contents ............................................................................................................................................................ 2 Specifications .................................................................................................................................................................. 3 Table 1. Electrical Characteristics ............................................................................................................................ 3 Absolute Maximum Ratings ............................................................................................................................................ 4 Table 2. Absolute Maximum Ratings ....................................................................................................................... 4 ESD Caution ............................................................................................................................................................. 4 Soldering Profile....................................................................................................................................................... 5 Table 3. Recommended Soldering Profile ................................................................................................................ 5 Pin Configurations And Function Descriptions ............................................................................................................... 6 Table 4. Pin Function Descriptions ........................................................................................................................... 6 Typical Performance Characteristics ............................................................................................................................... 7 Applications Information ................................................................................................................................................ 8 Connecting To Audio Codecs ................................................................................................................................... 8 Dynamic Range Considerations ............................................................................................................................... 8 Supporting Documents ................................................................................................................................................... 9 Evaluation Board User Guide ................................................................................................................................... 9 Application Note (product specific) ......................................................................................................................... 9 Application Notes (general) ..................................................................................................................................... 9 PCB Design And Land Pattern Layout ........................................................................................................................... 10 Handling Instructions .................................................................................................................................................... 11 Pick And Place Equipment ..................................................................................................................................... 11 Reflow Solder ......................................................................................................................................................... 11 Board Wash............................................................................................................................................................ 11 Outline Dimensions ....................................................................................................................................................... 12 Ordering Guide ...................................................................................................................................................... 13 Revision History ..................................................................................................................................................... 13 Compliance Declaration Disclaimer ....................................................................................................................... 14 Page 2 of 14 Document Number: DS-INMP411-00 Revision: 1.1