Series SGRF300/SGRF303 DPDT Non-Latching Electromechanical Relay Signal Integrity up to 18Gbps SURFACE MOUNT HIGH REPEATABILITY, BROADBAND TO-5 RELAYS DPDT SERIES RELAY TYPE SGRF300 Repeatable, RF relay SGRF300D Repeatable, RF relay with internal diode for coil transient suppression Repeatable, RF relay with internal diodes for coil transient suppression and polarity reversal SGRF300DD protection SGRF303 Sensitive, repeatable, RF relay SGRF303D Sensitive, repeatable, RF relay with internal diode for coil transient suppression Sensitive, repeatable, RF relay with internal diodes for coil transient suppression and polarity SGRF303DD reversal protection DESCRIPTION The following unique construction features and manufacturing The ultraminiature SGRF300 and SGRF303 relays are designed to techniques provide excellent robustness to environmental provide a practical surface-mount solution with improved RF signal extremes and overall high reliability: repeatability over the frequency range. SGRF300 and SGRF303 Uniframe motor design provides high magnetic efficiency relays feature a unique ground shield that isolates and shields and mechanical rigidity each lead to ensure excellent contact-to-contact and pole-to-pole Minimum mass components and welded construction provide isolation. This ground shield provides a ground interface that results maximum resistance to shock and vibration in improved highfrequency performance as well as parametric Advanced cleaning techniques provide maximum assurance of repeatability. The SGRF300 and SGRF303 extend performance internal cleanliness advantages over similar RF devices that simply offer formed leads Gold-plated precious metal alloy contacts ensure reliable switching for surface mounting.These relays are engineered for use in RF Hermetically sealed attenuator, RF switch matrices, ATE and other applications that require dependable high frequency signal fidelity and performance. The Series SGRF300D/SGRF303D and SGRF300DD/ SGRF303DD relays have internal discrete silicon diodes for coil The SGRF300 and SGRF303 feature: suppression and polarity reversal protection. This hybrid package High repeatability reduces required PC board floor space by reducing the number of Broader bandwidth external components needed to drive the relay. Metal enclosure for EMI shielding High isolation between control and signal paths High resistance to ESD ENVIRONMENTAL AND INTERNAL CONSTRUCTION PHYSICAL SPECIFICATIONS Storage 65C to +125C Temperature UPPER (Ambient) Operating 55C to +85C UNIFRAME STATIONARY CONTACT Vibration 10 gs to 500 Hz MOVING (General Note I) CONTACT ARMATURE Shock 30 gs, LOWER STATIONARY (General Note I) 6ms half sine CONTACT Enclosure Hermetically sealed SGRF300 0.09 oz. (2.55g) max. Weight SGRF303 0.16 oz. (4.5g) max. SHOWN WITHOUT GROUND SHIELD 2010 TELEDYNE RELAYS (800) 284-7007 www.teledynerelays.com SGRF300/SGRF303 Page 1 SGRF300 SGRF303 102012 Q3Series SGRF300/SGRF303 DPDT Non-Latching Electromechanical Relay Signal Integrity up to 18Gbps SERIES SGRF300/SGRF303 TYPICAL RF CHARACTERISTICS (See RF Notes) Isolation Across Contacts (RF Note 4) Isolation Pole to Pole (RF Note 5) 0 0 -10 Energized -10 Normally Closed De-energized -20 Normally Open -20 -30 -30 -40 -40 -50 -50 -60 -70 -60 0 500 1000 1500 2000 2500 3000 3500 4000 4500 5000 5500 6000 0 500 1000 1500 2000 2500 3000 3500 4000 4500 5000 5500 6000 Frequency (MHz) Frequency (MHz) Insertion Loss (RF Note 6) VSWR (RF Note 6) 0 2.0 -0.2 1.8 Normally Closed Normally Closed Normally Open Normally Open -0.4 1.6 -0.6 1.4 -0.8 1.2 -1 1.0 0 500 1000 1500 2000 2500 3000 3500 4000 4500 5000 5500 6000 0 500 1000 1500 2000 2500 3000 3500 4000 4500 5000 5500 6000 Frequency (MHz) Frequency (MHz) SGRF300 Time Response (RF Note 6) 1.1 0.9 90% 0.7 37ps reference 0.5 62.3ps propagation delay time 0.3 51.3ps pulse rise time 10% 0.1 -0.1 -100 0 100 200 300 400 500 600 700 800 900 Time (ps) RF NOTES 1. Test conditions: a. Fixture: .031 copper clad, reinforced PTFE, RT/duroid 6002 with SMA connectors. (RT/duroid is a registered trademark of Rogers Corporation.) b. RF ground shield is soldered to PCB RF ground plane. c. Room ambient temperature. d. Terminals not tested were terminated with 50-ohm load. e. Contact signal level: 10 dBm. f. No. of test samples: 2. 2. Data presented herein represents typical characteristics and is not intended for use as specification limits. 3. Data is per pole, except for pole-to-pole data. 4. Data is the average from readings taken on all open contacts. 5. Data is the average from readings taken on poles with coil energized and de-energized. 6. Data is the average from readings taken on all closed contacts. 7. Test fixture effect de-embedded from frequency and time response data. SGRF300/SGRF303 Page 2 SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE 2010 TELEDYNE RELAYS SGRF300 SGRF303 102012 Q3 Insertion Loss (dB) Isolation (dB) Volt Isolation (dB) VSWR
