X-On Electronics has gained recognition as a prominent supplier of TLSR8271F512ET32 RF System on a Chip - SoC across the USA, India, Europe, Australia, and various other global locations. TLSR8271F512ET32 RF System on a Chip - SoC are a product manufactured by Telink. We provide cost-effective solutions for RF System on a Chip - SoC, ensuring timely deliveries around the world.

TLSR8271F512ET32 Telink

TLSR8271F512ET32 electronic component of Telink
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Part No.TLSR8271F512ET32
Manufacturer: Telink
Category: RF System on a Chip - SoC
Description: RF System on a Chip - SoC BLE 5.1, AoA/Tx, Telink Mesh, 2.4G Proprietary, 32 pin QFN
Datasheet: TLSR8271F512ET32 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 2.827 ea
Line Total: USD 2.83 
Availability - 2614
Ship by Wed. 27 Nov to Fri. 29 Nov
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
2614
Ship by Wed. 27 Nov to Fri. 29 Nov
MOQ : 1
Multiples : 1
1 : USD 2.827
10 : USD 2.574
100 : USD 2.167
250 : USD 2.057
500 : USD 1.87
1000 : USD 1.716
3000 : USD 1.562
9000 : USD 1.54

   
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We are delighted to provide the TLSR8271F512ET32 from our RF System on a Chip - SoC category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the TLSR8271F512ET32 and other electronic components in the RF System on a Chip - SoC category and beyond.

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Datasheet for Telink Bluetooth LE SoC TLSR8271 DS-TLSR8271-E11 Ver 1.2.0 2021/11/17 Keyword BLE 2.4 GHz PWM Audio QDEC MDEC ADC Temperature sensor Low power comparator AES PKE TRNG Brief This datasheet is dedicated for Telink Bluetooth LE SoC TLSR8271. In this datasheet, key features, working modes, main modules, electrical specifications and application of the TLSR8271 are introduced.Datasheet for Telink TLSR8271 Published by Telink Semiconductor Bldg 3, 1500 Zuchongzhi Rd, Zhangjiang Hi-Tech Park, Shanghai, China Telink Semiconductor All Rights Reserved Legal Disclaimer This document is provided as-is. Telink Semiconductor reserves the right to make improvements without further notice to this document or any products herein. This document may contain technical inaccuracies or typographical errors. Telink Semiconductor disclaims any and all liability for any errors, inaccuracies or incompleteness contained herein. Copyright 2021 Telink Semiconductor (Shanghai) Co., Ltd. Information For further information on the technology, product and business term, please contact Telink Semiconductor Company (www.telink-semi.com). For sales or technical support, please send email to the address of: telinksales telink-semi.com telinksupport telink-semi.com DS-TLSR8271-E11 1 Ver 1.2.0

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
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