X-On Electronics has gained recognition as a prominent supplier of 291 temperature sensor development tools across the USA, India, Europe, Australia, and various other global locations. 291 temperature sensor development tools are a product manufactured by Tinkerforge. We provide cost-effective solutions for temperature sensor development tools, ensuring timely deliveries around the world.

291

291 electronic component of Tinkerforge
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Part No.291
Manufacturer: Tinkerforge
Category:Temperature Sensor Development Tools
Description: Temperature Sensor Development Tools Temperature IR Bricklet 2.0: Measures contactless object temperature between -70 C and +380 C
Datasheet: 291 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 40.1583 ea
Line Total: USD 40.16

Availability - 46
Ships to you between
Wed. 05 Jun to Fri. 07 Jun
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
12 - WHS 1


Ships to you between Wed. 05 Jun to Fri. 07 Jun

MOQ : 1
Multiples : 1
1 : USD 35.5246

     
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We proudly offer the 291 Temperature Sensor Development Tools at competitive prices in the United States, Australia, India, Europe and more. By maintaining strong relationships with manufacturers and optimizing our operations, we provide significant savings to our customers. Customer satisfaction is at the heart of our business. Our knowledgeable and friendly customer service team is always ready to assist you with any inquiries or issues. From product selection to after-sales support, we are dedicated to providing our customers with a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why we are the top choice for the 291 Temperature Sensor Development Tools.

SPC560B40x, SPC560B50x SPC560C40x, SPC560C50x 32-bit MCU family built on the Power Architecture for automotive body electronics applications Datasheet - production data Up to 6 FlexCAN interfaces (2.0B active) with 64-message objects each Up to 4 LINFlex/UART 3 DSPI / I2C LQFP100 (14 x 14 x 1.4 mm) LQFP64 (10 x 10 x 1.4 mm) Single 5 V or 3.3 V supply LQFP144 (20 x 20 x 1.4 mm) 10-bit analog-to-digital converter (ADC) with up to 36 channels Features Extendable to 64 channels via external multiplexing High-performance 64 MHz e200z0h CPU Individual conversion registers 32-bit Power Architecture technology Cross triggering unit (CTU) Up to 60 DMIPs operation Variable length encoding (VLE) Dedicated diagnostic module for lighting Advanced PWM generation Memory Time-triggered diagnostic Up to 512 KB Code Flash with ECC PWM-synchronized ADC measurements 64 KB Data Flash with ECC Up to 48 KB SRAM with ECC Clock generation 8-entry memory protection unit (MPU) 4 to 16 MHz fast external crystal oscillator (FXOSC) Interrupts 32 kHz slow external crystal oscillator 16 priority levels (SXOSC) Non-maskable interrupt (NMI) 16 MHz fast internal RC oscillator (FIRC) Up to 34 external interrupts incl. 18 wakeup 128 kHz slow internal RC oscillator (SIRC) lines Software-controlled FMPLL GPIO: 45(LQFP64), 75(LQFP100), Clock monitor unit (CMU) 123(LQFP144) Timer units Exhaustive debugging capability 6-channel 32-bit periodic interrupt timers Nexus1 on all devices 4-channel 32-bit system timer module Nexus2+ available on emulation package Software watchdog timer (LBGA208) Real-time clock timer Low power capabilities 16-bit counter time-triggered I/Os Ultra-low power standby with RTC, SRAM Up to 56 channels with PWM/MC/IC/OC and CAN monitoring ADC diagnostic via CTU Fast wakeup schemes Communications interface Operating temp. range up to -40 to 125 C Table 1. Device summary Part number Package 256 KB code Flash memory 512 KB code Flash memory LQFP144 SPC560B40L5 SPC560B50L5 LQFP100 SPC560B40L3 SPC560C40L3 SPC560B50L3 SPC560C50L3 (1) LQFP64 SPC560B40L1 SPC560C40L1 SPC560B50L1 SPC560C50L1 1. All LQFP64information is indicative and must be confirmed during silicon validation. February 2015 DocID14619 Rev 13 1/116 This is information on a product in full production. www.st.comContents SPC560B40x/50x, SPC560C40x/50x Contents 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 1.1 Document overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 1.2 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 3 Package pinouts and signal descriptions . . . . . . . . . . . . . . . . . . . . . . . 15 3.1 Package pinouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 3.2 Pad configuration during reset phases . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 3.3 Voltage supply pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 3.4 Pad types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 3.5 System pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 3.6 Functional ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 3.7 Nexus 2+ pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 3.8 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 3.9 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 3.10 Parameter classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 3.11 NVUSRO register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 3.11.1 NVUSRO[PAD3V5V] field description . . . . . . . . . . . . . . . . . . . . . . . . . . 40 3.11.2 NVUSRO[OSCILLATOR_MARGIN] field description . . . . . . . . . . . . . . . 41 3.11.3 NVUSRO[WATCHDOG_EN] field description . . . . . . . . . . . . . . . . . . . . 41 3.12 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 3.13 Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 3.14 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 3.14.1 Package thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 3.14.2 Power considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 3.15 I/O pad electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 3.15.1 I/O pad types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 3.15.2 I/O input DC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 3.15.3 I/O output DC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 3.15.4 Output pin transition times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 3.15.5 I/O pad current specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 2/116 DocID14619 Rev 13

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