CMS16 TOSHIBA Schottky Barrier Diode CMS16 Switching Mode Power Supply Applications Unit: mm Portable Equipment Battery Applications DC-DC Converter Applications Repetitive peak reverse voltage : V = 40 V RRM Average forward current : I = 3 A F (AV) Peak forward voltage : V = 0.55 V (max) ( I = 3 A) FM FM Suitable for compact assembly due to a small surface-mount package: TM M FLAT (Toshiba package name) Absolute Maximum Ratings (Ta = 25C) Characteristic Symbol Rating Unit Repetitive peak reverse voltage V 40 V RRM Average forward current I 3 (Note 1) A F (AV) Non-repetitive peak forward surge current I 30 (50 Hz) A FSM Junction temperature T 40 to 150 C j Storage temperature range T 40 to 150 C stg Note 1: T = 106C Device mounted on a ceramic board Board size : 50 mm 50 mm JEDEC Soldering land size : 2 mm 2 mm Board thickness : 0.64 mm JEITA Rectangular waveform ( = 180), VR = 20 V TOSHIBA 3-4E1A Note 2 : Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in Weight: 0.023 g (typ.) temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (Handling Precautions/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Electrical Characteristics (Ta = 25C) Characteristic Symbol Test Condition Min Typ. Max Unit V I = 1 A (pulse test) 0.4 FM (1) FM Peak forward voltage V V I = 3 A (pulse test) 0.50 0.55 FM (2) FM IRRM (1) VRRM = 5 V (pulse test) 2 Peak repetitive reverse current A I V = 40 V (pulse test) 26 200 RRM (2) RRM Junction capacitance C V = 10 V, f = 1 MHz 95 pF j R Device mounted on a ceramic board board size : 50 mm 50 mm 60 soldering land size : 2 mm 2 mm board thickness : 0.64 mm Device mounted on a glass-epoxy board Thermal resistance board size : 50 mm 50 mm R 135 C/W th (j-a) (junction to ambient) soldering land size : 6 mm 6 mm board thickness : 1.6 mm Device mounted on a glass-epoxy board board size : 50 mm 50 mm 210 soldering land size : 2.1 mm 1.4 mm board thickness : 1.6 mm Thermal resistance (junction to lead) Rth (j-) 16 C/W Start of commercial production 2003-12 1 2018-04-04 CMS16 Marking Abbreviation Code Part No. SF CMS16 Land pattern dimensions for reference only Unit: mm 1.4 3.0 1.4 Handling Precaution 1) Schottky barrier diodes (SBDs) have reverse current greater than other types of diodes. This makes SBDs more vulnerable to damage due to thermal runaway under high-temperature and high-voltage conditions. Thus, both forward and reverse power losses of SBDs should be considered for thermal and safety design. 2) The absolute maximum ratings are rated values that must not be exceeded during operation, even for an instant. The following are the recommended general derating methods for designing a circuit board using this device. VRRM : Use this rating with reference to 1) above. VRRM has a temperature coefficient of 0.1%/ at low temperatures. Take this coefficient into account when designing a circuit board that will be operated in a low-temperature environment. IF(AV) : We recommend that the worst-case current be no greater than 80% of the absolute maximum rating of IF(AV) and that the worst-case junction temperature, Tj, be kept below 120. When using this device, allow margins, referring to the Ta(max)-IF(AV) curve. IFSM : This rating specifies peak non-repetitive forward surge current. This only applies to an abnormal operation, which seldom occurs during the lifespan of a device. Tj : Derate device parameters in proportion to this rating in order to ensure high reliability. We recommend that the junction temperature (Tj) of a device be kept below 120 . 3) Thermal resistance (junction-to-ambient) varies with the mounting conditions of a device on a circuit board. An appropriate thermal resistance value should be used, considering the heatsink, circuit board design and land pattern dimensions (provided for reference only). 4) For other design considerations, see the Rectifiers databook or the Toshiba website. 2 2018-04-04 2.1