CRF02 TOSHIBA Fast Recovery Diode Silicon Diffused Type CRF02 Power Supply Applications Unit: mm Strobo Flasher Applications Repetitive peak reverse voltage: V = 800 V RRM Average forward current: I = 0.5 A F (AV) Low forward voltage: V = 3.0 V (max.) FM Very fast reverse-recovery time: t = 100 ns (max.) rr Suitable for compact assembly due to its small surface-mount TM package, the SFLAT (Toshiba package name) Absolute Maximum Ratings (Ta = 25C) Characteristics Symbol Rating Unit Repetitive peak reverse voltage V 800 V RRM I 0.5 F(AV) Average forward current A (Note 1) Peak one-cycle surge forward current I 10 (50 Hz) A FSM (non-repetitive) JEDEC Junction temperature T 40~150 C j JEITA Storage temperature range T 40~150 C stg TOSHIBA 3-2A1A Note 1: Ta = 84C: Device mounted on a ceramic board Weight: 0.013 g (typ.) Board size: 50 mm 50 mm, Soldering Land size: 2 mm 2 mm Board thickness: 0.64 t Rectangular waveform ( = 180) Note 2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (Handling Precautions/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). 2006-11-07 1CRF02 Electrical Characteristics (Ta = 25C) Characteristics Symbol Test Condition Min Typ. MaxUnit Peak forward voltage V I = 0.5 A 2.2 3.0 V FM FM Repetitive peak reverse current I V = 400 V 3.0 A RRM(1) RRM Repetitive peak reverse current I V = 800 V 50 A RRM(2) RRM Reverse recovery time t I = 1 A, di/dt = 30 A/s 100 ns rr F Device mounted on a ceramic board (board size: 50 mm 50 mm) 70 (soldering land: 2 mm 2 mm) (board thickness: 0.64 t) Device mounted on a glass-epoxy board (board size: 50 mm 50 mm) Thermal resistance R C/W 140 th (j-a) (soldering land: 6 mm 6 mm) (board thickness: 1.6 t) Device mounted on a glass-epoxy board (board size: 50 mm 50 mm) 240 (soldering land: 1.2 mm 1.2 mm) (board thickness: 1.6 t) Thermal resistance (junction to lead) R 20 C/W th (j-) Marking Standard Soldering Pad Abbreviation Code Part No. Unit: mm F2 CRF02 1.2 1.2 2.8 Handling Precaution The absolute maximum ratings mean the absolute maximum ratings, which are rated values and must not be exceeded during operation, even for an instant. The followings are the general derating method that we recommend for designing a circuit using this device. VRRM: We recommend that the worst-case voltage, including surge voltage, be no greater than 80% of the absolute maximum rating of VRRM for a DC circuit and no greater than 50% of that of VRRM for an AC circuit. VRRM has a temperature coefficient (0.1%/). Be sure to take this temperature coefficient into account when designing a device at low temperature. IF(AV): We recommend that the worst case current be no greater than 80% of the absolute maximum rating of IF(AV). Carry out sufficient heat design. If it is not possible to design a circuit with excellent heat radiation, set a margin by using an allowable Tamax-IF (AV) curve. This rating specifies the non-repetitive peak current in one cycle of a 50-Hz sine wave, condition angle 180. Therefore this applies only to abnormal operation, which seldom occurs during the lifespan of the device. For this device, we recommend a Tj of below 120 under the worst load and heat radiation conditions. Thermal resistance between junction and ambient fluctuates depending on the mounting condition of the device. When using the device, be sure to design the circuit board and soldering land size to match the appropriate thermal resistance value. Refer to the Rectifier databook for further information. 2006-11-07 2