CRG04 TOSHIBA Rectifier Silicon Diffused Type CRG04 Unit: mm General-Purpose Rectifier Applications Repetitive peak reverse voltage: V = 600 V RRM Average forward current: I = 1.0 A F (AV) Average forward voltage: V = 1.1V(Max) FM Suitable for high-density board assembly due to the use of a small TM surface-mount package, SFLAT Absolute Maximum Ratings (Ta = 25C) 0.9 0.1 0.16 + 0.2 1.6 0.1 Characteristics Symbol Rating Unit Repetitive Peak Reverse Voltage V 600 V RRM Average Forward Current I 1.0(Note1) A ANODE F (AV) CATHODE Peak One Cycle Surge Forward I 15.0 (50Hz) A FSM Current (NonRepetitive) Junction Temperature T 40 to 150 C j Storage Temperature Range T 40 to 150 C stg JEDEC Note 1: Ta=66C Device mounted on a ceramic board JEITA board size: 50 mm 50 mm TOSHIBA 3-2A1A soldering land: 2 mm 2 mm board thickness: 0.64 mm Weight: 0.013 g (typ.) Half-sine waveform: =180 Note 2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (Handling Precautions/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Electrical Characteristics (Ta = 25C) Characteristics Symbol Test Condition Min Typ. Max Unit V I = 0.1 A (Pulse test) 0.84 V FM(1) FM Peak forward voltage V I = 0.7 A (Pulse test) 0.95 V FM(2) FM V I = 1.0 A (Pulse test) 0.98 1.1 V FM(3) FM Repetitive peak reverse current I V = 600 V (Pulse test) 10 A RRM RRM Device mounted on a ceramic board Board size: 50 mm 50 mm 65 Soldering land: 2 mm 2 mm Board thickness: 0.64 mm Thermal resistance R C/W th (j-a) Device mounted on a glass-epoxy board Board size: 50 mm 50 mm 130 Soldering land: 6 mm 6 mm Board thickness: 1.6 mm R 20 C/W th (j-) Start of commercial production 2004-08 2013-11-01 1 0 ~ 0.1 2.6 0.1 3.5 0.2 0.98 0.1 0.65 0.2 0.65 0.2 CRG04 Marking Abbreviation Code Part No. G4 CRG04 Standard Soldering Pad Unit: mm 1.2 1.2 2.8 Handling Precaution The absolute maximum ratings are rated values and must not be exceeded during operation, even for an instant. The following are the general derating methods that we recommend when you design a circuit with a device. V : We recommend that the worst case voltage, including surge voltage, be no greater than 80% of the maximum RRM rating of V for a DC circuit and be no greater than 50% of that of V for an AC circuit. RRM RRM V has a temperature coefficient of 0.1%/. Take this temperature coefficient into account designing a device RRM at low temperature. I : We recommend that the worst case current be no greater than 80% of the maximum rating of I . Carry out F(AV) F(AV) adequate heat design. If you cant design a circuit with excellent heat radiation, set the margin by using an allowable Ta max-I curve. F (AV) This rating specifies the non-repetitive peak current in one cycle of a 50-Hz sine wave, condition angle 180. Therefore, this is only applied for an abnormal operation, which seldom occurs during the lifespan of the device. We recommend that a device be used at Tj below 120 under the worst load and heat radiation conditions. Thermal resistance between junction and ambient fluctuates depending on the devices mounting condition. When using a device, design a circuit board and a soldering land size to match the appropriate thermal resistance value. Please refer to the Rectifiers databook for further information. 2013-11-01 2