CRG04 TOSHIBA Rectifier Silicon Diffused Type CRG04 Unit: mm General Power Supply Rectification Repetitive peak reverse voltage : V = 600 V RRM Average forward current : I = 1.0 A F (AV) Peak forward voltage : VFM = 1.1 V (max) The use of small, thin surface-mount package is optimum way for high-density mounting. TM Nickname: S-FLAT Absolute Maximum Ratings (Ta = 25C) Characteristics Symbol Rating Unit Repetitive Peak Reverse Voltage V 600 V RRM Average Forward Current I 1.0 (Note1) A F (AV) 1 ANODE 2 CATHODE Non-repetitive peak forward surge current I 15 (50Hz) A FSM Junction Temperature T 40 to 150 C j Storage Temperature Range T 40 to 150 C stg JEDEC Note 1: Ta = 66C Device mounted on a ceramic board JEITA board size 50 mm 50 mm Soldering land size 2 mm 2 mm TOSHIBA 3-2A1S board thickness 0.64 mm Weight: 0.013 g (typ.) Half-sine waveform = 180 Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (Handling Precautions/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Electrical Characteristics (Ta = 25C) Characteristics Symbol Test Condition Min Typ. Max Unit V I = 0.1 A (Pulse test) 0.84 V FM(1) FM Peak forward voltage V I = 0.7 A (Pulse test) 0.95 V FM(2) FM V I = 1.0 A (Pulse test) 0.98 1.1 V FM(3) FM Repetitive peak reverse current I V = 600 V (Pulse test) 10 A RRM RRM Device mounted on a ceramic board board size 50 mm 50 mm 65 soldering land size 2 mm 2 mm board thickness 0.64 mm Thermal resistance R C/W th (j-a) (junction to ambient) Device mounted on a glass-epoxy board board size 50 mm 50 mm 130 soldering land size 6 mm 6 mm board thickness 1.6 mm Thermal resistance (junction to lead) R 20 C/W th (j-) Start of commercial production 2004-08 2019-04-22 1 CRG04 Marking Abbreviation Code Part No. G4 CRG04 Land pattern dimensions for reference only Unit: mm 1.2 1.2 2.8 Usage Considerations 1) The absolute maximum ratings are rated values that must not be exceeded for a moment to have you use an element safely. Please refer to each following absolute maximum ratings on the occasion of use and design. V : In DC circuit, the voltage peaks of applied voltage must be rated less than 80 % absolute maximum ratings. RRM In AC circuit, the voltage peaks of applied voltage must be rated less than 50 % absolute maximum ratings. And, V has a temperature coefficient of 0.1 %/C. RRM Please take this coefficient into account when designing a circuit board that will be operated in a low-temperature environment. I : We recommend that the current be in less than 80 % of rating and the junction temperature (T ) F(AV) j be in less than 80 % of absolute maximum rating under the worst condition. This rating is based on the premise that the device is radiating heat enough. Therefore, when enough heat radiation is not expected, please consider the margin to the permission curve of T - I for using the device. a(max) F(AV) I : This rating specifies a non-repetitive limit value. FSM This only applies to an abnormal operation, which seldom occurs during the lifespan of a device. T : Derate device parameters in proportion to this rating in order to ensure high reliability. j We recommend that the junction temperature (T ) of a device be kept below 80 %. j 2) Thermal resistance (junction-to-ambient) varies with the mounting conditions of the device on the circuit board. An appropriate thermal resistance value that should be used, must be considering the circuit board design and soldering land size. 3) For other design considerations, see the Toshiba website. 2019-04-22 2