CRG05(TE85L,Q,M) Toshiba

CRG05 Rectifier Diode Silicon Diffused Type CRG05 General Power Supply Rectification Unit: mm Repetitive peak reverse voltage : V = 800 V RRM Average forward current : I = 1.0 A F (AV) Peak forward voltage : V = 1.2 V (max) FM Small, thin package suitable for high-density board assembly TM Toshiba Nickname: S-FLAT Absolute Maximum Ratings (Ta = 25C) Characteristics Symbol Rating Unit Repetitive Peak Reverse Voltage V 800 V RRM Average Forward Current I 1.0 (Note1) A F (AV) Non-repetitive peak forward surge current I 15 (50Hz) A FSM 1 ANODE Junction Temperature T 40 to 150 C j 2 CATHODE Storage Temperature Range T 40 to 150 C stg Note 1: Ta = 54C Device mounted on a ceramic board Board size : 50 mm 50 mm JEDEC Soldering land size : 2 mm 2 mm Board thickness : 0.64 mm JEITA Rectangular waveform : = 180 TOSHIBA 3-2A1S Note 2: Using continuously under heavy loads (e.g. the application of Weight: 0.013 g (typ.) high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (Handling Precautions/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Electrical Characteristics (Ta = 25C) Characteristics Symbol Test Condition Min Typ. Max Unit V I = 0.1 A (Pulse test) 0.86 V FM(1) FM Peak forward voltage V I = 0.7 A (Pulse test) 1.0 V FM(2) FM V I = 1.0 A (Pulse test) 1.05 1.2 V FM(3) FM Repetitive peak reverse current I V = 800 V (Pulse test) 10 A RRM RRM Device mounted on a ceramic board board size 50 mm 50 mm 65 soldering land size 2 mm 2 mm Thermal resistance board thickness 0.64 mm R C/W th (j-a) Device mounted on a glass-epoxy board (junction to ambient) board size 50 mm 50 mm 130 soldering land size 6 mm 6 mm board thickness 1.6 mm Thermal resistance (junction to lead) R 20 C/W th (j-) Start of commercial production 2004-08 2018-10-16 1 CRG05 Marking Abbreviation Code Part No. G5 CRG05 Land pattern dimensions for reference only Unit: mm 1.2 1.2 2.8 Handling Precaution 1) The absolute maximum ratings are rated values and must not be exceeded during operation, even for an instant. The followings are the general derating methods that we recommend when you design a circuit with a device. V : We recommend that the worst case voltage, including surge voltage, be no greater than 80% of the maximum RRM rating of V for a DC circuit and be no greater than 50% of that of V for an AC circuit. RRM RRM V has a temperature coefficient of 0.1%/. Take this temperature coefficient into account designing a RRM device at low temperature. I : We recommend that the worst case current be no greater than 80% of the absolute maximum rating of I F(AV) F(AV) and Tj be below 120. Carry out adequate heat design. If you cant design a circuit with excellent heat radiation, set the margin by using an allowable Ta max - I curve. F(AV) I : This rating specifies the non-repetitive peak current. This is only applied for an abnormal operation, which FSM seldom occurs during the lifespan of the device. Tj : We recommend that a device be used at Tj below 120 under the worst load and heat radiation conditions. 2) Thermal resistance between junction and ambient fluctuates depending on the devices mounting condition. When using a device, design a circuit board and a soldering land size to match the appropriate thermal resistance value. 3) For other design considerations, see the Toshiba website. 2018-10-16 2