CRG07(TE85L,Q,M) Toshiba

CRG07 TOSHIBA Rectifier Silicon Diffused Type CRG07 General Power Supply Rectification Unit: mm Average forward current : IF(AV) = 0.7 A Repetitive peak reverse voltage : VRRM = 400 V Small, thin package suitable for high-density board assembly TM Toshiba Nickname: S-FLAT Absolute Maximum Ratings (Ta = 25C) Characteristics Symbol Rating Unit Repetitive peak reverse voltage V 400 V RRM Average forward current (Note 1) I 0.7 A F(AV) Non-repetitive peak forward surge current I 15 A FSM (50 Hz) Junction temperature (Note 2) T 175 C j Storage temperature (Note 2) T -55 to 175 C stg JEDEC Note: Using continuously under heavy loads (e.g. the application of JEITA high temperature/current/voltage and the significant change in TOSHIBA 3-2A1A temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. Weight: 0.013 g (typ.) operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook Handling PrecautionDerating Concept and Method) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1 : Ta = 111C Device mounted on a ceramic board Board size : 50 mm 50 mm Soldering size : 2 mm 2 mm Board thickness : 0.64 mm Half Sine Waveform Conduction angle 180 Note 2: The definitions of maximum rating condition for both junction temperature and storage temperature range are referred from AEC-Q101. Electrical Characteristics (Ta = 25C) Characteristics Symbol Test Condition Min Typ. Max Unit V I = 0.1 A (pulse test) 0.88 FM (1) FM Peak forward voltage V I = 0.7 A (pulse test) 1.0 1.1 V FM (2) FM V I = 1 A (pulse test) 1.1 FM (3) FM Repetitive peak reverse current I V = 400 V (pulse test) 10 A RRM RRM Device mounted on a ceramic board (board size: 50 mm 50 mm) 65 (soldering land: 2 mm 2 mm) (board thickness: 0.64 mm) Thermal resistance R C/W th (j-a) Device mounted on a glass-epoxy board (board size: 50 mm 50 mm) 130 (soldering land: 6 mm 6 mm) (board thickness: 1.6 mm) Start of commercial production 2007-02 1 2017-05-09 CRG07 Marking Part No.(or abbreviation code) Abbreviation Code Part No. G7 CRG07 G7 Cathode mark and Lot code Land Pattern Dimensions (for reference only) Unit: mm 1.2 1.2 2.8 Handling Precaution 1) The absolute maximum ratings denote the absolute maximum ratings, which are rated values and must not be exceeded during operation, even for an instant. The following are the general derating methods that we recommend when you design a circuit with a device. VRRM: Use this rating with reference to the above. VRRM has a temperature coefficient of 0.1%/C. Take this temperature coefficient into account designing a device at low temperature. IF(AV): We recommend that the worst case current be no greater than 80% of the absolute maximum rating of IF(AV) and Tj be below 120C. When using this device, take the margin into consideration by using an allowable Ta max-IF(AV) curve. IFSM: This rating specifies the non-repetitive peak current. This is only applied for an abnormal operation, which seldom occurs during the lifespan of the device. Tj: Derate this rating when using a device in order to ensure high reliability. We recommend that the device be used at a Tj of below 120C. 2) Thermal resistance between junction and ambient fluctuates depending on the devices mounting condition. When using a device, design a circuit board and a soldering land size to match the appropriate thermal resistance value. 3) Please refer to the Rectifiers databook for further information. 2 2017-05-09