CRG09(TE85L,Q,M) Toshiba

CRG09 TOSHIBA Rectifier Silicon Diffused Type CRG09 General Purpose Rectifier Applications Unit: mm Repetitive peak reverse voltage: V = 400 V RRM Average forward current: I = 1.0 A F (AV) Forward voltage: V = 1.1 V (max) ( I = 0.7 A) FM FM High ESD Capability Suitable for high-density board assembly due to the use of a small TM surface-mount package, SFLAT 0.9 0.1 0.16 Absolute Maximum Ratings (Ta = 25C) + 0.2 1.6 0.1 Characteristics Symbol Rating Unit Repetitive peak reverse voltage V 400 V RRM ANODE CATHODE Average forward current I 1.0 (Note 1) A F(AV) Non-repetitive peak surge current I 15 (50 Hz) A FSM Junction temperature T 40 to 150 C j JEDEC Storage temperature T 40 to 150 C stg JEITA Note: Using continuously under heavy loads (e.g. the application of high TOSHIBA 3-2A1A temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the Weight: 0.013 g (typ.) reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (Handling Precautions/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: Ta = 66C Device mounted on a ceramic board Board size: 50 mm 50 mm Soldering size: 2 mm 2 mm Board thickness: 0.64 mm Start of commercial production 2008-12 2013-11-01 1 0 ~ 0.1 2.6 0.1 3.5 0.2 0.98 0.1 0.65 0.2 0.65 0.2 CRG09 Electrical Characteristics (Ta = 25C) Characteristics Symbol Test Condition Min Typ. Max Unit V I = 0.1 A (pulse test) 0.83 FM (1) FM Peak forward voltage V V I = 0.7 A (pulse test) 0.95 1.1 FM (2) FM V I = 1.0 A (pulse test) 1.00 FM (3) FM Repetitive peak reverse current I V = 400 V (pulse test) 10 A RRM RRM C = 150 pF , R = 2 k , A contact electric ESD(1) 25 kV discharge Electrostatic Discharge Capability C = 330 pF , R = 2 k , A contact electric ESD(2) 25 kV discharge Device mounted on a ceramic board (board size: 50 mm 50 mm) 65 (soldering land: 2 mm 2 mm) (board thickness: 0.64 mm) Thermal resistance R C/W th (j-a) (junction to ambient) Device mounted on a glass-epoxy board (board size: 50 mm 50 mm) 130 (soldering land: 6 mm 6 mm) (board thickness: 1.6 mm) Thermal resistance R 20 C/W th (j-) (junction to lead) Marking Part No.(or abbreviation code) Abbreviation Code Part No. Anode Cathode G9 CRG09 G9 Cathode mark and Lot code Land pattern dimensions for reference only Unit: mm 1.2 1.2 2.8 2013-11-01 2