TCK104G,TCK105G TOSHIBA CMOS Linear Integrated Circuit Silicon Monolithic TCK104G, TCK105G Load Switch IC with Current Limit function The TCK104G and TCK105G are load switch ICs for power management with slew rate control driver and current limit function featuring wide input voltage operation from 1.1 to 5.5 V. Switch ON resistance is only 50 m typical at 5.0V, -700mA load condition and these feature a slew rate control driver, thermal shutdown and output auto-discharge function. Output current type is available on -500mA, and -800mA. Thus it is easy to select devices and helpful for the design. This device is available in 0.4 mm pitch ultra small package WCSP6B (0.8 mm x 1.2 mm, t: 0.64 mm (max)) .Thus this WCSP6B devices is ideal for portable applications that require high-density Weight: 1 mg (typ.) board assembly such as cellular phone. Feature Wide input voltage operation: V = 1.1 to 5.5 V IN Low ON resistance : R = 50 m (typ.) at V = 5.0 V, -700 mA ON IN R = 55 m (typ.) at V = 3.3 V, -700 mA ON IN R = 75 m (typ.) at V = 1.8 V, -700 mA ON IN R = 140 m (typ.) at V = 1.2 V, -700 mA ON IN Low Quiescent Current: I = 20 A (typ.) at I = 0 mA Q OUT Low standby current: I = 0.1 A (typ.) at OFF state Q(OFF) Current limit function Inrush current reducing circuit Thermal Shutdown function Auto-discharge Pull down connection between CONTROL and GND Ultra small package : WCSP6B (0.8mm x 1.2mm, t: 0.64mm(max)) Start of commercial production 2013-04 1 2014-03-01 TCK104G,TCK105G Absolute Maximum Ratings (Ta = 25C) Characteristics Symbol Rating Unit Input voltage V -0.3 to 6.0 V IN Control voltage V -0.3 to 6.0 V CT Output voltage V -0.3 to V +0.3 V OUT IN TCK104G 800 Output current I mA OUT TCK105G 1200 Power dissipation P 800 (Note 1) mW D Operating temperature range T 40 to 85 C opr Junction temperature Tj 150 C Storage temperature T 55 to 150 C stg Note : Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (Handling Precautions/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note1: Rating at mounting on a board (Glass epoxy board dimension: 40mm x 40mm, both sides of board Metal pattern ratio: a surface approximately 50%, the reverse side approximately 50% Through hole: diameter 0.5mm x 28) Pin Assignment(Top view) Top marking 1 2 Index A A1: V OUT Lot trace code B1: V OUT C1: GND B T: TCK104G A2: V IN U: TCK105G B2: V IN C2: CONTROL C 2 2014-03-01