TK31Z60X,S1F Toshiba

TK31Z60X MOSFETs Silicon N-Channel MOS (DTMOS-H) TK31Z60XTK31Z60XTK31Z60XTK31Z60X 1. 1. ApplicationsApplications 1. 1. ApplicationsApplications Switching Voltage Regulators 2. 2. 2. 2. FeaturesFeaturesFeaturesFeatures (1) Low drain-source on-resistance: R = 0.073 (typ.) DS(ON) by used to Super Junction Structure : DTMOS (2) High-speed switching properties with lower capacitance. (3) Enhancement mode: V = 2.5 to 3.5 V (V = 10 V, I = 1.5 mA) th DS D 3. 3. Packaging and Internal CircuitPackaging and Internal Circuit 3. 3. Packaging and Internal CircuitPackaging and Internal Circuit 1. Drain (Heatsink) 2. Source 1 3. Source 2 4. Gate Notice: Only use source 2 pin for gate input signal return. Please make sure that the main current flows into the source 1 pin. TO-247-4L(T) Start of commercial production 2015-11 2016-2017 2017-12-06 1 Toshiba Electronic Devices & Storage Corporation Rev.4.0TK31Z60X 4. 4. 4. 4. Absolute Maximum Ratings (Note) (TAbsolute Maximum Ratings (Note) (TAbsolute Maximum Ratings (Note) (TAbsolute Maximum Ratings (Note) (T = 25 = 25 = 25 = 25 unless otherwise specified) unless otherwise specified) unless otherwise specified) unless otherwise specified) aaaa Characteristics Symbol Rating Unit Drain-source voltage V 600 V DSS Gate-source voltage V 30 GSS Drain current (DC) (Note 1) I 30.8 A D Drain current (pulsed) (Note 1) I 123 DP Power dissipation (T = 25 ) P 230 W c D Single-pulse avalanche energy (Note 2) E 437 mJ AS Avalanche current I 7.7 A AR Reverse drain current (DC) (Note 1) I 30.8 DR Reverse drain current (pulsed) (Note 1) I 123 DRP Channel temperature T 150 ch Storage temperature T -55 to 150 stg Mounting torque TOR 0.8 Nm Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook Handling PrecautionDerating Concept and Method) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). 5. 5. Thermal CharacteristicsThermal Characteristics 5. 5. Thermal CharacteristicsThermal Characteristics Characteristics Symbol Max Unit Channel-to-case thermal resistance R 0.543 /W th(ch-c) Channel-to-ambient thermal resistance R 50 th(ch-a) Note 1: Ensure that the channel temperature does not exceed 150 . Note 2: V = 90 V, T = 25 (initial), L = 12.9 mH, R = 25 , I = 7.7 A DD ch G AR Note: This transistor is sensitive to electrostatic discharge and should be handled with care. 2016-2017 2017-12-06 2 Toshiba Electronic Devices & Storage Corporation Rev.4.0