TLP701AF(F) Toshiba

TLP701AF Photocouplers GaAAs Infrared LED & Photo IC TLP701AFTLP701AFTLP701AFTLP701AF 1. 1. ApplicationsApplications 1. 1. ApplicationsApplications Industrial Inverters MOSFET Gate Drivers IGBT Gate Drivers Induction Cooktop and Home Appliances 2. 2. 2. 2. GeneralGeneralGeneralGeneral The TLP701AF is a photocoupler in a SDIP6 package that consists of a GaAAs infrared light-emitting diode (LED) optically coupled to an integrated high-gain, high-speed photodetector IC chip. The TLP701AF is physically smaller than the one in an 8-pin DIP package and compliant with international safety standards for reinforced insulation. It thus provides a smaller footprint solution for applications that require safety standard certification. The TLP701AF has an internal Faraday shield that provides a guaranteed Common-mode transient immunity of 20 kV/s. It has a totem-pole output that can both sink and source current. It is ideal for IGBT and power MOSFET gate drive. Leads of the TLP701AF is bend to satisfy 8 mm PC board spacing requirements. Absolute maximum ratings and electrical characteristics are the same as in the TLP701A. 3. 3. FeaturesFeatures 3. 3. FeaturesFeatures (1) Output peak current: 0.6 A (max) (2) Operating temperature: -40 to 100 (3) Supply current: 2 mA (max) (4) Supply voltage: 10 to 30 V (5) Threshold input current: 5 mA (max) (6) Propagation delay time: 500 ns (max) (7) Common-mode transient immunity: 20 kV/s (min) (8) Isolation voltage: 5000 Vrms (min) (9) Safety standards UL-approved: UL1577, File No.E67349 cUL-approved: CSA Component Acceptance Service No.5A File No.E67349 (Note 1) VDE-approved: EN60747-5-5 (Note 1)(Note 1)(Note 1) Option (D4) Note 1: When an EN60747-5-5 approved type is needed, please designate the Option (D4)Option (D4)Option (D4). Start of commercial production 2011-01 2016 Toshiba Corporation 2016-02-29 1 Rev.5.0TLP701AF 4. 4. 4. 4. Packaging and Pin ConfigurationPackaging and Pin ConfigurationPackaging and Pin ConfigurationPackaging and Pin Configuration 1: Anode 2: N.C. 3: Cathode 4: GND 5: V (Output) O 6: V CC 11-5J101S 5. 5. 5. 5. Internal Circuit (Note)Internal Circuit (Note)Internal Circuit (Note)Internal Circuit (Note) Note: A 0.1-F bypass capacitor must be connected between pin 6 and pin 4. 6. 6. Principle of OperationPrinciple of Operation 6. 6. Principle of OperationPrinciple of Operation 6.1. 6.1. 6.1. 6.1. Truth TableTruth TableTruth TableTruth Table Input LED M1 M2 Output H ON ON OFF H L OFF OFF ON L 6.2. 6.2. Mechanical ParametersMechanical Parameters 6.2. 6.2. Mechanical ParametersMechanical Parameters 7.62-mm Pitch 10.16-mm Pitch Characteristics Unit TLP701A TLP701AF Creepage distances 7.0 (min) 8.0 (min) mm Clearance distances 7.0 (min) 8.0 (min) Internal isolation thickness 0.4 (min) 0.4 (min) 2016 Toshiba Corporation 2016-02-29 2 Rev.5.0