TLP754 Toshiba

TLP754 Photocouplers GaAAs Infrared LED & Photo IC TLP754TLP754TLP754TLP754 1. 1. ApplicationsApplications 1. 1. ApplicationsApplications Intelligent Power Module Signal Isolation Factory Automation (FA) Industrial Inverters 2. 2. 2. 2. GeneralGeneralGeneralGeneral The TLP754 is a photocoupler in a DIP8 package that consists of a GaAAs infrared light-emitting diode (LED) optically coupled to an integrated high-gain, high-speed photodetector IC chip. It provides guaranteed performance and specifications at temperatures up to 125 .An internal noise shield provides a guaranteed common mode transient immunity of 20 kV/s. The TLP754 guarantees minimum and maximum of propagation delay time, pulse width distortion. Therefore it is suitable for isolation interface between IPM and control IC circuits in motor control application. 3. 3. FeaturesFeatures 3. 3. FeaturesFeatures (1) Inverter logic type (open collector output) (2) Package: DIP8 (3) Operating temperature: -40 to 125 (4) Supply voltage: -0.5 to 30 V (5) Threshold input current: 5.0 mA (max) (6) Supply current: 1.3 mA (max) (7) Propagation delay time: t = 400 ns (max), t = 550 ns (max) pHL pLH (8) Pulse width distortion: 400 ns (max) (9) Common-mode transient immunity: 20 kV/s (min) (10) Isolation voltage: 5000 Vrms (min) (11) Safety standards UL-approved: UL1577, File No.E67349 cUL-approved: CSA Component Acceptance Service No.5A File No.E67349 (Note 1) VDE-approved: EN60747-5-5, EN60065 or EN60950-1 (Note 1)(Note 1)(Note 1) Option (D4) Note 1: When a VDE approved type is needed, please designate the Option (D4)Option (D4)Option (D4). Start of commercial production 2012-01 2015 Toshiba Corporation 2015-12-26 1 Rev.5.0TLP754 4. 4. 4. 4. Packaging and Pin ConfigurationPackaging and Pin ConfigurationPackaging and Pin ConfigurationPackaging and Pin Configuration 1: N.C. 2: Anode 3: Cathode 4: N.C. 5: GND 6: V (Output) O 7: N.C. 8: V CC 11-10C4S 5. 5. 5. 5. Internal CircuitInternal CircuitInternal CircuitInternal Circuit 6. 6. 6. 6. Principle of OperationPrinciple of OperationPrinciple of OperationPrinciple of Operation 6.1. 6.1. 6.1. 6.1. Truth TableTruth TableTruth TableTruth Table Input LED Output H ON L L OFF H 6.2. 6.2. 6.2. 6.2. Mechanical ParametersMechanical ParametersMechanical ParametersMechanical Parameters 7.62-mm Pitch 10.16-mm Pitch Characteristics Unit TLP754 TLP754F Creepage distances 7.0 (min) 8.0 (min) mm Clearance distances 7.0 (min) 8.0 (min) Internal isolation thickness 0.4 (min) 0.4 (min) 2015 Toshiba Corporation 2015-12-26 2 Rev.5.0