Resistors Thermal Jumper Chip TJC Series High thermal conductivity Resistors Electrically isolated AlN ceramic chips Thermal Jumper Chip Compact thermal management Low capacitance TJC Series Pb-free or SnPb finish High thermal conductivity Electrically isolated AlN ceramic chips All Pb-free parts comply with EU Directive 2011/65/EU amended by (EU) 2015/863 (RoHS3) Compact thermal management Low capacitance Pb-free or SnPb finish Functional Data All Pb-free parts comply with EU Directive 2011/65/EU amended by (EU) 2015/863 (RoHS3) 0603 0505 0805 0508 1206 0612 2010 1020 2512 1225 Thermal Resistance C 17.4 9.3 14.9 5.8 18.8 4.6 18.5 4.6 18.7 4.6 Functional Data / Thermal Conductance 57.6 108 67.3 173 53.3 219 54 216 53.5 218 mW/C 0603 0505 0805 0508 1206 0612 2010 1020 2512 1225 W Thermal Resistance C/W 17.4 9.3 14.9 5.8 18.8 4.6 18.5 4.6 18.7 4.6 Capacitance typ. 1kHz 0.16 0.27 0.16 0.4 0.11 0.43 0.07 0.31 0.05 0.46 pF Thermal Conductance mW/C 57.6 108 67.3 173 53.3 219 54 216 53.5 218 Capacitance typ. 1kHz pF 0.16 0.27 0.16 0.4 0.11 0.43 0.07 0.31 0.05 0.46 Physical Data Physical Data Dimensions (mm) & weight (mg) Dimensions (mm) & weight (mg) L W T max A nom B min C nom Wt. nom Wt. L W T max A nom B min C nom nom 0603 1.5 0.1 0.80.1 0.8 0.59 0.3 0.59 3.4 0603 1.5 0.1 0.80.1 0.8 0.59 0.3 0.59 3.4 0505 1.21 0.1 1.21 0.1 0.8 0.54 0.1 0.54 4.2 0505 1.21 0.1 1.21 0.1 0.8 0.54 0.1 0.54 4.2 0805 2.0 0.15 1.25 0.15 0.8 0.69 0.5 0.69 5.9 0805 2.0 0.15 1.25 0.15 0.8 0.69 0.5 0.69 5.9 0508 1.25 0.15 2.0 0.15 0.8 0.55 0.12 0.55 5.9 0508 1.25 0.15 2.0 0.15 0.8 0.55 0.12 0.55 5.9 1206 3.2 0.2 1.6 0.2 0.8 0.71 1.55 0.71 11.3 1206 3.2 0.2 1.6 0.2 0.8 0.71 1.55 0.71 11.3 0612 1.6 0.2 3.2 0.2 0.8 0.63 0.15 0.63 12.1 0612 1.6 0.2 3.2 0.2 0.8 0.63 0.15 0.63 12.1 2010 5.1 0.3 2.5 0.2 0.8 0.78 3.4 0.78 29.2 2010 5.1 0.3 2.5 0.2 0.8 0.78 3.4 0.78 29.2 1020 2.5 0.2 5.1 0.3 0.8 0.74 1 0.74 31.9 1020 2.5 0.2 5.1 0.3 0.8 0.74 1 0.74 31.9 2512 6.5 0.3 3.2 0.2 0.8 0.89 4.3 0.89 43.9 2512 6.5 0.3 3.2 0.2 0.8 0.89 4.3 0.89 43.9 1225 3.2 0.2 6.5 0.2 0.8 0.9 1.1 0.9 49.7 1225 3.2 0.2 6.5 0.2 0.8 0.9 1.1 0.9 49.7 Construction Ag terminations are screen printed onto an aluminium nitride (AlN) substrate. Parts are wrap-around terminated and plated with nickel then either 100% matt Sn or 60/40 SnPb. Construction Marking Ag terminations are screen printed onto an aluminium nitride (AlN) substrate. Parts are wrap-around terminated and Components are not marked. Reels are marked with type, date code and quantity. plated with nickel then either 100% matt Sn or 60/40 SnPb. Packing Marking 2010, 1020, 2512 & 1225 sizes are supplied on 12mm plastic carrier tape. All smaller sizes are supplied on 8mm plastic carrier tape. All sizes are on 178mm (7 inch) reels as per IEC286-3. Components are not marked. Reels are marked with type, date code and quantity. Packaging General Note BI Technologies IRC Welwyn TT Electronics reserves the right to make changes in product specification without notice or liability. 2010, 1020, 2512 & 1225 sizes are supplied on 12mm plastic carrier tape. All smaller sizes are supplied on 8mm plastic All information is subject to TT Electronics own data and is considered accurate at time of going to print. www.ttelectronics.com/resistors carrier tape. All sizes are on 178mm (7 inch) reels as per IEC286-3. TT Electronics plc 10.19 Thermal Jumper Chip Thermal Jumper Chip TJC Series TJC Series Resistors Thermal Jumper Chip Performance Data Performance Data TJC Series Shear strength >18N Shear strength >18N Temperature cycling (-55/125C, 30 minutes dwell) No visual damage Temperature cycling (-55/125C, 30 minutes dwell) No visual damage Performance Data Solderability (245C 5C for 2s 0.5s) >95% coverage Solderability (245C 5C for 2s 0.5s) >95% coverage Shear strength >18N Temperature cycling (-55/125C, 30 minutes dwell) No visual damage Solderability (245C 5C for 2s 0.5s) >95% coverage Thermal Performance Calculation Thermal Performance Calculation The thermThermal Pal d ata are basederf on tormance Calculahe thermal resistivity of alumtioninium nitride, which is 170 W/mC. The thermal data are based on the thermal resistivity of aluminium nitride, which is 170 W/mC. Values for Thermal Resistance ( ) and Thermal Conductance ( ) are obtained as follows. The thermal data are based on the thermal conductivity of aluminium nitride, which is 170 W/mC. Values for Thermal Resistance ( ) and Thermal Conductance ( ) are obtained as follows. Values f or Thermal Resistance (T ) and Thermal Conductance (T ) are obtained as follows. R C = ( . )= ( . ) where is the thermal resistivity of AlN, 170W/mC where kw is the thermal conductivity of here is the thermal resistivAIN, 170W/m City of AlN, 170W/mC 1 1 = = Application Notes Application Notes TJC is designed to provide a thermally conductive pathway with electrical isolation. Application Notes TJC is designed to provide a thermally conductive pathway with electrical isolation. It may be used as a thermal management solution for cooling PCB hotspot areas. TJC is designed to provide a thermally conductive pathway with electrical isolation. A typical application is pictured, in which a TO220 power device is cooled by It may be used as a thermal management solution for cooling PCB hotspot areas. A linking it to a pad which is heatsinked by a fixing which connects to the equipment It may be used as a thermal management solution for cooling PCB hotspot areas. A typical application is pictured, in which a TO220 power device is cooled by linking it chassis. Electrical isolation from the chassis must be maintained. typical application is pictured, in which a TO220 power device is cooled by linking it to a pad which is heatsinked by a fixing which connects to the equipment chassis. TJC to a pad which is heatsinked by a fixing which connects to the equipment chassis. ElectricalT io select the opsolation from ttimum sizhe ce of ThassJCi, begin bs must y debe fining the rmaintaiangnede of t. erminal widths TJC W which besElectrit macalt iches the pad or solder joinsolation from the chasst to be cis muooled. Then select the st be maintained. shortest length dimension, L, within the constraints of capacitance and clearance Heatsinked To select the optimum size of TJC, begin by defining the range of terminal widths TO220 requirements. The capacitance must be controlled for circuits operating at high Heatsinked Pad To select the optimum size of TJC, begin by defining the range of terminal widths TO220 W which best matches the pad or solder joint to be cooled. Then select the frequency and where coupling between the pad to be cooled and the heatsink Pad W which best matches the pad or solder joint to be cooled. Then select the pad is undesirable. The clearance is important where high voltages can exist shortest length dimension, L, within the constraints of capacitance and clearance between the pads, and this is given by dimension B. Since the surface of the shortest length dimension, L, within the constraints of capacitance and clearance requirements. The capacitance must be controlled for circuits operating at high insulated body of TJC is ceramic, surface tracking is not considered an issue, so requirements. The capacitance must be controlled for circuits operating at high frequency and where coupling between the pad to be cooled and the heatsink pad this dimension may be compared to the air clearances required in the application frequency and where coupling between the pad to be cooled and the heatsink pad is undesirable. The clearance is important where high voltages can exist between design. is undesirable. The clearance is important where high voltages can exist between the pads, and this is given by dimension B. Since the surface of the insulated body the pads, and this is given by dimension B. Since the surface of the insulated body of TJC is ceramic, surface tracking is not considered an issue, so this dimension may of TJC is ceramic, surface tracking is not considered an issue, so this dimension may be compared to the air clearances required in the application design. be compared to the air clearances required in the application design. General Note BI Technologies IRC Welwyn TT Electronics reserves the right to make changes in product specification without notice or liability. All information is subject to TT Electronics own data and is considered accurate at time of going to print. www.ttelectronics.com/resistors TT Electronics plc 10.19