X-On Electronics has gained recognition as a prominent supplier of LPH0009 Heat Sinks across the USA, India, Europe, Australia, and various other global locations. LPH0009 Heat Sinks are a product manufactured by Versarien. We provide cost-effective solutions for Heat Sinks, ensuring timely deliveries around the world.

LPH0009 Versarien

Name: LPH0009
Brand: Versarien
SKU: LPH0009_Versarien
Availability: OutOfStock
Rating: 5 (11 reviews)

LPH0009 electronic component of Versarien

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See Product Specifications

Part No.	LPH0009
Manufacturer:	Versarien
Category:	Heat Sinks
Description:	Heat Sinks Heat Sink, Low Profile, Metallic VersarienCu Foam, 40x40x2.5mm
Datasheet:	LPH0009 Datasheet (PDF)
	Large This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges

Price (USD)

1: USD 23.8165 ea
Line Total: USD 23.82

Availability - 0

MOQ: 1 Multiples: 1
Pack Size: 1

LPH0009 More Buying Options & Price Grid(s)

Availability	Price	Buy Price	Quantity
0 Ship by Wed. 27 Nov to Fri. 29 Nov MOQ : 1 Multiples : 1	1 : USD 23.8165 10 : USD 22.5057 25 : USD 21.4173 50 : USD 20.4109 100 : USD 19.0533 250 : USD 18.8425 500 : USD 18.6553 1000 : USD 18.2808 2500 : USD 18.2691

Specifications

Manufacturer Versarien Versarien
Product Category Heat Sinks Heat Sinks
Product Heat Sinks Heat Sinks
Heatsink Material Copper Copper
Length 40 mm 40 mm
Width 40 mm 40 mm
Height 2.5 mm 2.5 mm
Hts Code 7616995190 7616995190

We are delighted to provide the LPH0009 from our Heat Sinks category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the LPH0009 and other electronic components in the Heat Sinks category and beyond.

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Additional Infomation About Product

Low Profile Metallic Foam Heat Sinks Introducing the next generation of low profile heat sinks from Versarien Technologies. Using the incredible new material VersarienCu, a The copper foam is coated with a thin, hard layer micro-porous metallic copper foam, Versariens heat of high temperature copper oxide that improves the sinks offer unparalleled thermal performance in low emissivity of the foam to improve its radiant properties profile applications. and reduce the temperature of your component. The large surface area created by the interconnected This range is designed for use in passive cooling pores of the foam coupled with the excellent thermal applications where space is at a premium and conductivity of copper allows for the height of performance is crucial. VersarienCu heat sinks can your heat sinks to be reduced, without sacrificing be used to cool any IC component. performance. Contact us today to find out more e: sales versarien.com t: +44 (0) 1594 888 622 w: www.versarien-technologies.co.uk 2015 Versarien Technologies Low Profile Heatsinks Rev 02 -10-03-2015Low Profile Metallic Foam Heat Sinks PRODUCT LPH0001 10x10x2 LPH0002 15x15x2 LPH0003 20x20x2.5 LPH0004 20x20x5 LPH0005 25x25x2.5 LPH0006 25x25x5 LPH0007 30x30x2.5 LPH0008 30x30x5 LPH0009 40x40x2.5 LPH0010 40x40x5 Performance Testing of 40X40 Low Profile Heat Sinks 35 Blank (No Heat Sink) 30 Micro-Porous Ceramic Heat Sink 2.5mm Aluminium Finned Heat Sink 5mm Versarien Copper Foam 2.5mm Versarien Copper Foam 5mm 25 Comparison testing of Versarien 63 % copper foam (solid lines) to market leading low profile ceramic and finned aluminium heat sinks (dashed lines). 20 Data presented is thermal resistance (C/W) vs applied power (W). Testing performed concurrently in still air with insulated load resistors. 15 1W 3W 5W Power (W) Comparative heatmap of a 40x40x2.5 microporous ceramic and VersarienCu heat sink at 5W. The Versarien heat sink is 6.10C/W cooler. At an applied load of 5W the thermal resistance of a 40x40x5 (mm) Versarien heat sink is 17.4 C/W Versarien At an applied load of 2W the thermal resistance of a 117.10C 20x20x5 (mm) Versarien heat sink is 35.8 C/W MPC 123.20C Contact us today to find out more e: sales versarien.com t: +44 (0) 1594 888 622 w: www.versarien-technologies.co.uk 2015 Versarien Technologies Low Profile Heatsinks Rev 02 -10-03-2015 APPLICATION POWER IC HIGH TEMP. COMPONENT TRANSISTOR STB AP ROUTER G PON CABLE MODEM BROADBAND VOIP LED TV LED TV (SCALAR IC) Thermal Resistance (0C/W)

HS Compliance

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:

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