IRFZ34, SiHFZ34 Vishay Siliconix Power MOSFET FEATURES PRODUCT SUMMARY Dynamic dV/dt Rating V (V) 60 DS Available 175 C Operating Temperature R ()V = 10 V 0.050 DS(on) GS RoHS* Fast Switching Q (Max.) (nC) 46 g COMPLIANT Ease of Paralleling Q (nC) 11 gs Q (nC) 22 Simple Drive Requirements gd Configuration Single Compliant to RoHS Directive 2002/95/EC D DESCRIPTION Third generation Power MOSFETs from Vishay provide the TO-220AB designer with the best combination of fast switching, ruggedized device design, low on-resistance and G cost-effectiveness. The TO-220AB package is universally preferred for all commercial-industrial applications at power dissipation S levels to approximately 50 W. The low thermal resistance S D and low package cost of the TO-220AB contribute to its G N-Channel MOSFET wide acceptance throughout the industry. ORDERING INFORMATION Package TO-220AB IRFZ34PbF Lead (Pb)-free SiHFZ34-E3 IRFZ34 SnPb SiHFZ34 ABSOLUTE MAXIMUM RATINGS (T = 25 C, unless otherwise noted) C PARAMETER SYMBOLLIMITUNIT Drain-Source Voltage V 60 DS V Gate-Source Voltage V 20 GS T = 25 C 30 C Continuous Drain Current V at 10 V I GS D T = 100 C 21 A C a I 120 Pulsed Drain Current DM Linear Derating Factor 0.59 W/C b Single Pulse Avalanche Energy E 200 mJ AS Maximum Power Dissipation T = 25 C P 88 W C D c Peak Diode Recovery dV/dt dV/dt 4.5 V/ns Operating Junction and Storage Temperature Range T , T - 55 to + 175 J stg C d Soldering Recommendations (Peak Temperature) for 10 s 300 10 lbf in Mounting Torque 6-32 or M3 screw 1.1 N m Notes a. Repetitive rating pulse width limited by maximum junction temperature (see fig. 11). b. V = 25 V, starting T = 25 C, L = 259 H, R = 25 , I = 30 A (see fig. 12). DD J g AS c. I 30 A, dI/dt 200 A/s, V V , T 175 C. SD DD DS J d. 1.6 mm from case. * Pb containing terminations are not RoHS compliant, exemptions may apply Document Number: 91290 www.vishay.com S11-0517-Rev. B, 21-Mar-11 1 This datasheet is subject to change without notice. THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000 IRFZ34, SiHFZ34 Vishay Siliconix THERMAL RESISTANCE RATINGS PARAMETER SYMBOLTYP. MAX. UNIT Maximum Junction-to-Ambient R -62 thJA Case-to-Sink, Flat, Greased Surface R 0.50 - C/W thCS Maximum Junction-to-Case (Drain) R -1.7 thJC SPECIFICATIONS (T = 25 C, unless otherwise noted) J PARAMETER SYMBOLTEST CONDITIONS MIN.TYP.MAX.UNIT Static Drain-Source Breakdown Voltage V V = 0 V, I = 250 A 60 - - V DS GS D V Temperature Coefficient V /T Reference to 25 C, I = 1 mA - 0.065 - V/C DS DS J D Gate-Source Threshold Voltage V V = V , I = 250 A 2.0 - 4.0 V GS(th) DS GS D Gate-Source Leakage I V = 20 V - - 100 nA GSS GS V = 60 V, V = 0 V - - 25 DS GS Zero Gate Voltage Drain Current I A DSS V = 48 V, V = 0 V, T = 150 C - - 250 DS GS J b Drain-Source On-State Resistance R V = 10 V I = 18 A - - 0.050 DS(on) GS D Forward Transconductance g V = 25 V, I = 18 A 9.3 - - S fs DS D Dynamic Input Capacitance C - 1200 - iss V = 0 V, GS Output Capacitance C -V = 25 V, 600- pF oss DS f = 1.0 MHz, see fig. 5 Reverse Transfer Capacitance C -100- rss Total Gate Charge Q -- 46 g I = 30 A, V = 48 V, D DS V = 10 V nC Gate-Source Charge Q --11 gs GS b see fig. 6 and 13 Gate-Drain Charge Q -- 22 gd Turn-On Delay Time t -13 - d(on) Rise Time t - 100 - r V = 30 V, I = 30 A, DD D ns b R = 12 , R = 1.0 , see fig. 10 g D Turn-Off Delay Time t -29- d(off) Fall Time t -52- f D Between lead, Internal Drain Inductance L -4.5 - D 6 mm (0.25 ) from nH package and center of G die contact Internal Source Inductance L -7.5 - S S Drain-Source Body Diode Characteristics D MOSFET symbol Continuous Source-Drain Diode Current I -- 30 S showing the A G integral reverse a Pulsed Diode Forward Current I - - 120 S SM p - n junction diode b Body Diode Voltage V T = 25 C, I = 30 A, V = 0 V -- 1.6 V SD J S GS Body Diode Reverse Recovery Time t - 120 230 ns rr T = 25 C, I = 30 A, dI/dt = 100 A/s J F Body Diode Reverse Recovery Charge Q -0.7 1.4 nC rr Forward Turn-On Time t Intrinsic turn-on time is negligible (turn-on is dominated by L and L ) on S D Notes a. Repetitive rating pulse width limited by maximum junction temperature (see fig. 11). b. Pulse width 300 s duty cycle 2 %. www.vishay.com Document Number: 91290 2 S11-0517-Rev. B, 21-Mar-11 This datasheet is subject to change without notice. THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000