PHP01206E10R0BST3

PHP www.vishay.com Vishay Dale Thin Film High Power Thin Film Wraparound Chip Resistor FEATURES High purity ceramic substrate Power rating to 2.5 W Resistance range 10 to 30.1 k Resistor tolerance to 0.1 % TCR to 25 ppm/C Flame resistant UL 94 V-0 APPLICATIONS Power supplies PHP series chip resistors are designed with enlarged Power switching backside terminations to reduce the thermal resistance Braking system between the topside resistor layer and the solder joint on the Test and measurement equipment end users circuit board. Motor deflection circuits Actual power handling capability is limited by the end user mounting process. As with any high power chip resistor the TYPICAL PERFORMANCE ability to remove the generated heat is critical to the overall ABSOLUTE performance of the device. TCR 25 TOL. 0.1 STANDARD ELECTRICAL SPECIFICATIONS TEST SPECIFICATIONS CONDITIONS Material Nichrome - Resistance Range 10 to 30.1 k - 25 ppm/C, 50 ppm/C (stdandard) TCR: Absolute - 55 C to + 125 C and, 100 ppm/C Tolerance: Absolute 0.1 %, 0.5 %, 1.0 % and, 5.0 % + 25 C (1) Power Rating: Resistor 1206: 1.0 W, 2512: 2.5 W Maximum at + 70 C Stability: Absolute R 0.1 % 2000 h at + 70 C Stability: Ratio Not applicable - Voltage Coefficient < 0.1 ppm/V - Working Voltage 1206: 100 V, 2512: 200 V - Operating Temperature Range - 55 C to + 125 C - Storage Temperature Range - 55 C to + 150 C - Noise < - 30 dB - Shelf Life Stability: Absolute 0.01 % 1 year at + 25 C COMPONENT RATINGS CASE SIZE POWER RATING (mW) WORKING VOLTAGE (V) RESISTANCE RANGE () (1) 1206 1000 100 10 to 30.1K (1) 2512 2500 200 10 to 30.1K Note (1) Dependent on component mounting by user ENVIRONMENTAL TESTS (Vishay Performance vs. MIL-PRF-55342 Requirements) LIMITS MIL-PRF-55342 ENVIRONMENTAL TEST TYPICAL VISHAY PERFORMANCE CHARACTERISTIC E Resistance Temperature Characteristic 25 ppm/C 15 ppm/C Maximum Ambient Temperature at Rated Wattage + 70 C + 70 C Maximum Ambient Temperature at Power Derating + 150 C + 150 C Thermal Shock 0.1 % 0.04 % Low Temperature Operation 0.1 % 0.001 % Short Time Overload 0.1 % 0.003 % High Temperature Exposure 0.1 % 0.030 % Resistance to Soldering Heat 0.2 % 0.007 % Moisture Resistance 0.2 % 0.002 % Life at + 70 C for 2000 h 0.5 % 0.100 % Revision: 11-Jun-13 Document Number: 60076 1 For technical questions, contact: thinfilm vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000 PHP www.vishay.com Vishay Dale Thin Film DIMENSIONS in inches D W T E L WIDTH THICKNESS TOP PAD BOTTOM PAD CASE SIZE LENGTH W ( 0.005) MIN./MAX. D ( 0.005) E ( 0.005) 1206 0.126 0.008 0.063 0.015/0.033 0.020 + 0.005/- 0.010 0.040 2512 0.259 + 0.009/- 0.015 0.124 0.015/0.033 0.02 0.050 LAND PATTERN DIMENSIONS in inches PHP Land Pattern for 1206 Case Size PHP Land Pattern for 2512 Case Size 0.0710 0.1260 0.0755 0.0910 0.0220 0.1090 STANDARD MATERIAL SPECIFICATIONS Resistive Element Nichrome Substrate Material Alumina (Al O ) 2 3 Terminations (Tin/Lead) Tin/lead solder over nickel barrier Terminations (Lead (Pb)-free) Tin/silver/copper (Sn96.5Ag3.0Cu0.5) solder over nickel barrier PHP CHIP TEMP. VS. APPLIED POWER PHP CHIP TEMP. VS. APPLIED POWER 5.00 10.00 1206 - 100 2512 - 10 4.50 9.00 1206 - 5 k 2512 - 10 k 4.00 8.00 1206 - 10 k 2512 - 30 k 3.50 7.00 3.00 6.00 2.50 5.00 2.00 4.00 1.50 3.00 1.00 2.00 0.50 1.00 0.00 0.00 70 150 200 70 150 200 Chip Surface Temperature (C) Chip Surface Temperature (C) Notes Notes Chip surface temperature measured using FLIR A40 thermal Chip surface temperature measured using FLIR A40 thermal imaging system with an approximate test card surface imaging system with an approximate test card surface temperature of 25 C. temperature of 25 C. Thermal imaging was conducted under ambient conditions Case Size 2512 2512 2512 resulting in a steady state test card surface temperature of 85 C Resistance over the full range of power levels. Up to 10 Up to 10 k Up to 30 k Value Thermal imaging and load life testing was conducted mounting one device to 2 x 3 test cards with 2.5 mil copper plating on Temperature Power (W) both surfaces. Thermal vias on 120 mil centers were utilized for 70 2.44 1.81 1.87 heat transfer between surfaces of the test card. 150 6.82 4.89 5.19 200 9.33 6.63 7.09 Revision: 11-Jun-13 Document Number: 60076 2 For technical questions, contact: thinfilm vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000 Applied Power (W) Applied Power (W)