1.6 mm SiB4317EDK www.vishay.com Vishay Siliconix P-Channel 30 V (D-S) MOSFET FEATURES PowerPAK SC-75-6L Single D Thermally enhanced PowerPAK SC-75 package D 6 - Small footprint area S 5 - Low on-resistance 4 - Thin 0.75 mm profile Typical ESD protection (MOSFET): 1500 V (HBM) 100 % R tested g S 1 7 Material categorization: for definitions of compliance 2 D 3 D please see www.vishay.com/doc 99912 1 G Top View Bottom View APPLICATIONS S Marking code: BP Portable devices such as smart phones, tablet PCs, and mobile PRODUCT SUMMARY computing G V (V) -30 - Battery charger switch DS - Buck converter R max. () at V = -10 V 0.065 DS(on) GS - Power management R max. () at V = -4.5 V 0.080 DS(on) GS - Load switch R max. () at V = -2.5 V 0.125 DS(on) GS D Q typ. (nC) 6.6 g P-Channel MOSFET a I (A) -4.5 D Configuration Single ORDERING INFORMATION Package PowerPAK SC-75 Lead (Pb)-free and halogen-free SiB4317EDK-T1-GE3 ABSOLUTE MAXIMUM RATINGS (T = 25 C, unless otherwise noted) A PARAMETER SYMBOL LIMIT UNIT Drain-source voltage V -30 DS V Gate-source voltage V 12 GS a T = 25 C -4.5 C a T = 70 C -4.5 C Continuous drain current (T = 150 C) I J D b, c T = 25 C -4.3 A b, c T = 70 C -3.5 A A Pulsed drain current (t = 300 s) I -15 DM a T = 25 C -4.5 Continuous source-drain diode current C I S (MOSFET diode conduction) b, c T = 25 C -1.63 A T = 25 C 10 C T = 70 C 6.4 C Maximum power dissipation P W D b, c T = 25 C 1.95 A b, c T = 70 C 1.25 A Operating junction and storage temperature range T , T -55 to +150 J stg C d, e Soldering recommendations (peak temperature) 260 Notes a. Package limited b. Surface mounted on 1 x 1 FR4 board c. t = 10 s d. See solder profile (www.vishay.com/doc 73257). The PowerPAK SC-75 is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components S21-1126-Rev. A, 22-Nov-2021 Document Number: 63164 1 For technical questions, contact: pmostechsupport vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000 1.6 mmSiB4317EDK www.vishay.com Vishay Siliconix THERMAL RESISTANCE RATINGS PARAMETER SYMBOL TYPICAL MAXIMUM UNIT a, b Maximum junction-to-ambient t 5 s R 51 64 thJA C/W Maximum junction-to-case (drain) Steady state R 10 12.5 thJC Notes a. Surface mounted on 1 x 1 FR4 board b. Maximum under steady state conditions is 100 C/W SPECIFICATIONS (T = 25 C, unless otherwise noted) J PARAMETER SYMBOL TEST CONDITIONS MIN.TYP.MAX.UNIT Static Drain-source breakdown voltage V V = 0 V, I = -250 A -30 - - V DS GS D V temperature coefficient V /T --23 - DS DS J I = -250 A mV/C D V temperature coefficient V /T -2.7 - GS(th) GS(th) J Gate-source threshold voltage V V = V , I = -250 A -0.6 - -1.3 V GS(th) DS GS D V = 0 V, V = 4.5 V - - 0.5 DS GS Gate-source leakage I GSS V = 0 V, V = 12 V - - 10 DS GS A V = -30 V, V = 0 V - - -1 DS GS Zero gate voltage drain current I DSS V = -30 V, V = 0 V, T = 55 C - - -10 DS GS J V = -10 V, I = -3 A - 0.054 0.065 GS D a Drain-source on-state resistance R V = -4.5 V, I = -2 A - 0.065 0.080 DS(on) GS D V = -2.5 V, I = -1 A - 0.095 0.125 GS D a Forward transconductance g V = -10 V, I = -3 A - 9 - S fs DS D b Dynamic Input capacitance C -600 - iss V = -15 V, V = 0 V, f = 1 MHz Output capacitance C -55 - pF oss DS GS Reverse transfer capacitance C -50 - rss V = -15 V, V = -10 V, I = -4.2 A -14 23 DS GS D Total gate charge Q g -6.6 10 nC Gate-source charge Q V = -5 V, V = -4.5 V, I = -4.2 A -1.3 - gs DS GS D Gate-drain charge Q -2 - gd Gate resistance R f = 1 MHz 1.1 5.5 11 g Turn-on delay time t -20 40 d(on) Rise time t V = -15 V, R = 4.4 -20 40 r DD L I -3.4 A, V = -4.5 V, R = 1 Turn-off delay time t D GEN g -23 45 d(off) Fall time t -10 20 f ns Turn-on delay time t -10 20 d(on) Rise time t -10 20 V = -15 V, R = 4.4 r DD L I -3.4 A, V = -10 V, R = 1 Turn-off delay time t D GEN g -25 50 d(off) Fall time t -7 15 f Drain-Source Body Diode Characteristics Continuous source-drain diode current I T = 25 C - - -4.5 S C A Pulse diode forward current I -- -15 SM Body diode voltage V I = -3.4 A, V = 0 V - -0.9 -1.2 V SD S GS Body diode reverse recovery time t -16 30 ns rr Body diode reverse recovery charge Q - 8 15 nC rr I = -3.4 A, di/dt = 100 A/s, F T = 25 C Reverse recovery fall time t J -9 - a ns Reverse recovery rise time t -7 - b Notes a. Pulse test pulse width 300 s, duty cycle 2 % b. Guaranteed by design, not subject to production testing Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. S21-1126-Rev. A, 22-Nov-2021 Document Number: 63164 2 For technical questions, contact: pmostechsupport vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000