8 mm SiJH440E www.vishay.com Vishay Siliconix N-Channel 40 V (D-S) 175 C MOSFET FEATURES PowerPAK 8 x 8L Single TrenchFET Gen IV power MOSFET Fully lead (Pb)-free device Optimized Q , Q , and Q /Q ratio reduces g gd gd gs D switching related power loss Up to 200 A maximum continuous drain current 2 1 50 % smaller footprint than D PAK / TO-263 G 2 100 % R and UIS tested g S 3 Material categorization: for definitions of compliance S 1 4 please see www.vishay.com/doc 99912 S Top View Bottom View APPLICATIONS D PRODUCT SUMMARY Synchronous rectification V (V) 40 DS OR-ing R max. ( ) at V = 10 V 0.00096 DS(on) GS G R max. ( ) at V = 4.5 V 0.00115 DS(on) GS Motor drive control Q typ. (nC) 127 g Battery management a, g I (A) 200 D N-Channel MOSFET S Configuration Single ORDERING INFORMATION Package PowerPAK 8 x 8L Lead (Pb)-free and halogen-free SiJH440E-T1-GE3 ABSOLUTE MAXIMUM RATINGS (T = 25 C, unless otherwise noted) A PARAMETER SYMBOL LIMIT UNIT Drain-source voltage V 40 DS V Gate-source voltage V +20 / -16 GS a T = 25 C 200 C a T = 70 C 200 C Continuous drain current (T = 150 C) I J D b T = 25 C 40 A b T = 70 C 33.8 A A Pulsed drain current (t = 100 s) I 500 DM T = 25 C 160 C Continuous source-drain diode current I S b, c T = 25 C 2.67 A Single pulse avalanche current I 60 AS L = 0.1 mH Single pulse avalanche energy E 180 mJ AS T = 25 C 158 C T = 70 C 110 C Maximum power dissipation P W D b T = 25 C 3 A b T =70 C 2.1 A Operating junction and storage temperature range T , T -55 to +175 J stg C c Soldering recommendations (peak temperature) 260 THERMAL RESISTANCE RATINGS PARAMETER SYMBOL TYPICAL MAXIMUM UNIT b Maximum junction-to-ambient Steady state R 42 50 thJA C/W Maximum junction-to-case (drain) Steady state R 0.8 0.95 thJC Notes a. Package limited. b. Surface mounted on 1 x 1 FR4 board. c. t = 10 s. d. See solder profile (www.vishay.com/doc 73257). The PowerPAK 8 x 8L is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection. e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components. f. Maximum under steady state conditions is 50 C/W. g. T = 25 C. C S16-2149-Rev. A, 17-Oct-16 Document Number: 76206 1 For technical questions, contact: pmostechsupport vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000 8.1 mmSiJH440E www.vishay.com Vishay Siliconix SPECIFICATIONS (T = 25 C, unless otherwise noted) J PARAMETER SYMBOL TEST CONDITIONS MIN.TYP.MAX.UNIT Static Drain-source breakdown voltage V V = 0 V, I = 250 A 40 - - V DS GS D V temperature coefficient V /T I = 10 mA - 24 - DS DS J D mV/C V temperature coefficient V /T I = 250 A - -6.6 - GS(th) GS(th) J D Gate-source threshold voltage V V = V , I =250 A 1 - 2.3 V GS(th) DS GS D Gate-source leakage I V = 0 V, V = +20 / -16 V - - 100 nA GSS DS GS V = 40 V, V =0 V - - 1 DS GS Zero gate voltage drain current I A DSS V = 40 V, V = 0 V, T = 70 C - - 15 DS GS J a On-state drain current I V 10 V, V =10 V 60 - - A D(on) DS GS V = 10 V, I = 20 A - 0.00080 0.00096 GS D a Drain-source on-state resistance R DS(on) V = 4.5 V, I = 20 A - 0.00096 0.00115 GS D a Forward transconductance g V = 15 V, I = 20 A - 140 - S fs DS D b Dynamic Input capacitance C - 20 330 - iss Output capacitance C V = 20 V, V = 0 V, f = 1 MHz - 2920 - pF oss DS GS Reverse transfer capacitance C - 820 - rss V = 20 V, V = 10 V, I = 20 A - 279 420 DS GS D Total gate charge Q g - 127 195 nC Gate-source charge Q V = 20 V, V = 4.5 V, I =20 A -64 - gs DS GS D Gate-drain charge Q - 24.5 - gd Gate resistance R f = 1 MHz 0.5 1.7 3.0 g Turn-on delay time t -28 56 d(on) Rise time t -35 70 r V = 20 V, R = 10 , I 20 A, DD L D V = 10 V, R = 1 Turn-off delay time t GEN g - 105 210 d(off) Fall time t -30 60 f ns Turn-on delay time t - 140 280 d(on) Rise time t -290580 V = 20 V, R = 1 , I 20 A, r DD L D V = 4.5 V, R = 1 Turn-off delay time t -GEN g 78156 d(off) Fall time t - 53 106 f Drain-Source Body Diode Characteristics Continuous source-drain diode current I T = 25 C - - 160 S C A Pulse diode forward current I - - 300 SM Body diode voltage V I = 5 A, V = 0 V - 0.68 1.1 V SD S GS Body diode reverse recovery time t - 92 184 ns rr Body diode reverse recovery charge Q - 245 490 nC rr I = 20 A, dI/dt = 100 A/s, T = 25 C F J Reverse recovery fall time t -54 - a ns Reverse recovery rise time t -38 - b Notes a. Pulse test pulse width 300 s, duty cycle 2 %. b. Guaranteed by design, not subject to production testing. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. S16-2149-Rev. A, 17-Oct-16 Document Number: 76206 2 For technical questions, contact: pmostechsupport vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000