TCET1100, TCET1100G www.vishay.com Vishay Semiconductors Optocoupler, Phototransistor Output, High Temperature FEATURES High common mode rejection CE Low temperature coefficient of CTR 4 3 CTR offered in 7 groups Reinforced isolation provides circuit protection against electrical shock (safety class II) Isolation materials according to UL 94 V-0 1 2 Pollution degree 2 (DIN / VDE 0110 / resp. IEC 60664) AC Climatic classification 55 / 100 / 21 (IEC 60068 part 1) Rated impulse voltage (transient overvoltage) 17197 4 V = 6 kV IOTM peak Isolation test voltage (partial discharge test voltage) LINKS TO ADDITIONAL RESOURCES V = 1.6 kV pd Rated isolation voltage (RMS includes DC ) V = 600 V Related IOWM RMS Documents Rated recurring peak voltage (repetitive) V = 848 V DESCRIPTION IORM peak Creepage current resistance according to VDE 0303 / The TCET110. consists of a phototransistor opticall y IEC 60112 comparative tracking index: CTI 175 coupled to a gallium arsenide infrared-emitting diode in a 4-lead plastic dual inline package. Material categorization: for definitions of compliance please see www.vishay.com/doc 99912 AGENCY APPROVALS APPLICATIONS UL 1577 Circuits for safe protective separation against electrical cUL 1577 shock according to safety class II (reinforced isolation): DIN EN 60747-5-5 (VDE 0884-5) For application class I to IV at mains voltage 300 V BSI: EN 62368-1:2014 For application class I to III at mains voltage 600 V CQC GB4943.1-2011 according to DIN EN 60747-5-5 (VDE 0884), suitable for: CQC GB8898-2011 - Switch-mode power supplies - Line receiver - Computer peripheral interface - Microprocessor system interface ORDERING INFORMATION DIP T C E T 110 7.62 mm PART NUMBER LEAD FORM AGENCY CTR (%) CERTIFIED / 10 mA PACKAGE UL, cUL, VDE, 50 to 600 40 to 80 63 to 125 100 to 200 160 to 320 100 to 300 80 to 160 130 to 260 200 to 400 BSI, CQC DIP-4 TCET1100 - TCET1102 TCET1103 - TCET1106 TCET1107 TCET1108 TCET1109 DIP-4, 400 mil TCET1100G TCET1101G TCET1102G TCET1103G TCET1104G TCET1106G TCET1107G TCET1108G TCET1109G Note G = lead form 10.16 mm G is not marked on the body Rev. 2.4, 13-Jan-2021 Document Number: 83503 1 For technical questions, contact: optocoupleranswers vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000 TCET1100, TCET1100G www.vishay.com Vishay Semiconductors ABSOLUTE MAXIMUM RATINGS (T = 25 C, unless otherwise specified) amb PARAMETER TEST CONDITION SYMBOL VALUE UNIT INPUT Reverse voltage V 6V R Forward current I 60 mA F Forward surge current t 10 s I 1.5 A p FSM OUTPUT Collector emitter voltage V 70 V CEO Emitter collector voltage V 7V ECO Collector current I 50 mA C Collector peak current t /T = 0.5, t 10 ms I 100 mA p p CM COUPLER Isolation test voltage (RMS) t = 1 min V 5000 V ISO RMS Operating ambient temperature range T -40 to +100 C amb Storage temperature range T -55 to +125 C stg (1) Soldering temperature 2 mm from case, 10 s T 260 C sld Notes Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. Functional operation of the device is not implied at these or any other conditions in excess of those given in the operational sections of this document. Exposure to absolute maximum ratings for extended periods of the time can adversely affect reliability (1) Refer to wave profile for soldering conditions for through hole devices THERMAL CHARACTERISTICS PARAMETER SYMBOL VALUE UNIT LED power dissipation P 100 mW diss T A Output power dissipation P 150 mW diss Maximum LED junction temperature T 125 C jmax. CA Package Maximum output die junction temperature T 125 C jmax. T C EC Thermal resistance, junction emitter to board 173 C/W EB DC T T DE JE JD Thermal resistance, junction emitter to case 149 C/W EC Thermal resistance, junction detector to board 111 C/W DB DB EB Thermal resistance, junction detector to case 127 C/W DC T B Thermal resistance, junction emitter to 173 C/W ED junction detector BA (1) Thermal resistance, board to ambient 197 C/W BA 19996 T A (1) Thermal resistance, case to ambient 4041 C/W CA Notes The thermal model is represented in the thermal network below. Each resistance value given in this model can be used to calculate the temperatures at each node for a given operating condition. The thermal resistance from board to ambient will be dependent on the type of PCB, layout and thickness of copper traces. For a detailed explanation of the thermal model, please reference Vishays Thermal Characteristics of Optocouplers application note (1) For 2 layer FR4 board (4 x 3 x 0.062 ) Rev. 2.4, 13-Jan-2021 Document Number: 83503 2 For technical questions, contact: optocoupleranswers vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000