VSMY2940RG, VSMY2940G www.vishay.com Vishay Semiconductors High Speed Infrared Emitting Diodes, 940 nm, Surface Emitter Technology FEATURES VSMY2940RG VSMY2940G Package type: surface-mount Package form: GW, RGW Dimensions (L x W x H in mm): 2.3 x 2.3 x 2.8 Peak wavelength: = 940 nm p High reliability High radiant power Very high radiant intensity DESCRIPTION Angle of half intensity: = 10 TM As part of the SurfLight portfolio, the VSMY2940 series Suitable for high pulse current operation are infrared, 940 nm emitting diodes based on GaAlAs Terminal configurations: gullwing or reverse gullwing surface emitter chip technology with extreme high radiant intensities, high optical power and high speed, molded in Package matches with detector VEMD2000X01 series clear, untinted plastic packages (with lens) for surface Floor life: 4 weeks, MSL 2a, according to J-STD-020 mounting (SMD). Material categorization: for definitions of compliance please see www.vishay.com/doc 99912 APPLICATIONS Miniature light barrier Photointerrupters Optical switch Emitter source for proximity sensors PRODUCT SUMMARY COMPONENT I (mW/sr) (deg) (nm) t (ns) e P r VSMY2940RG 145 10 940 10 VSMY2940G 145 10 940 10 Note Test conditions see table Basic Characteristics ORDERING INFORMATION ORDERING CODE PACKAGING REMARKS PACKAGE FORM VSMY2940RG Tape and reel MOQ: 6000 pcs, 6000 pcs/reel Reverse gullwing VSMY2940G Tape and reel MOQ: 6000 pcs, 6000 pcs/reel Gullwing Note MOQ: minimum order quantity Rev. 1.1, 08-Dec-17 Document Number: 84221 1 For technical questions, contact: emittertechsupport vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000 VSMY2940RG, VSMY2940G www.vishay.com Vishay Semiconductors ABSOLUTE MAXIMUM RATINGS (T = 25 C, unless otherwise specified) amb PARAMETER TEST CONDITION SYMBOL VALUE UNIT Reverse voltage V 5V R Forward current I 100 mA F Peak forward current t /T = 0.5, t = 100 s I 200 mA p p FM Surge forward current t = 100 s I 1A p FSM Power dissipation P 180 mW V Junction temperature T 100 C j Operating temperature range T -40 to +85 C amb Storage temperature range T -40 to +100 C stg Soldering temperature According to Fig. 10, J-STD-020 T 260 C sd Thermal resistance junction-to-ambient J-STD-051, soldered on PCB R 250 K/W thJA 200 100 180 160 R = 250 K/W thJA 80 140 R = 250 K/W thJA 120 60 100 80 40 60 40 20 20 0 0 0 20406080 100 0 20406080 100 T - Ambient Temperature (C) T - Ambient Temperature (C) amb amb Fig. 1 - Power Dissipation Limit vs. Ambient Temperature Fig. 2 - Forward Current Limit vs. Ambient Temperature BASIC CHARACTERISTICS (T = 25 C, unless otherwise specified) amb PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT I = 100 mA, t = 20 ms V -1.4 1.8 V F p F Forward voltage I = 1 A, t = 100 s V -2.5 - V F p F Temperature coefficient of V I = 100 mA TK --0.7 - mV/K F F VF Reverse current I Not designed for reverse operation A R 2 Junction capacitance V = 0 V, f = 1 MHz, E = 0 mW/cm C -55- pF R J I = 100 mA, t = 20 ms I 75 145 215 mW/sr F p e Radiant intensity I = 1 A, t = 100 s I - 1000 - mW/sr F p e Radiant power I = 100 mA, t = 20 ms -55- mW F p e Temperature coefficient of radiant I = 100 mA TK --0.2 - %/K F e power Angle of half intensity - 10 - deg Peak wavelength I = 100 mA 920 940 960 nm F p Spectral bandwidth I = 100 mA -50- nm F Temperature coefficient of I = 100 mA TK -0.25 - nm/K p F p Rise time I = 100 mA, 10 % to 90 % t -10- ns F r Fall time I = 100 mA, 10 % to 90 % t -10- ns F f Rev. 1.1, 08-Dec-17 Document Number: 84221 2 For technical questions, contact: emittertechsupport vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000 P -Power Dissipation (mW) V I - Forward Current (mA) F