Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS 120 SERIES The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal resistance of only 0.05C/W for a 0.001 in. film with an area of one square inch. There is no measurable increase in case temperature of a mounted semiconductor on a heat sink after the 6-month stabilization period (Time versus Thermal Resistivity graph below). TYPICAL VALUES FOR THERMAL RESISTANCE, 120 SERIES - THERMAL JOINT COMPOUND CASE TO SINK ( ) WHEN THERMAL JOINT cs Characteristic Description COMPOUNDS ARE USED Volume Resistivity 5 X 10e 14 ohm/cm Typical Mounting Torque Thermal Dielectric Strength 225 volts/mil in inch pounds Resistance Specific Gravity 2.1 min. Case Style Characteristics (NM) (C/W) Thermal Conductivity WC 0.735 W/(m)(K) T0-3 8 (0.9) 0.09 2 5.1(Btu) (in.)/(hr)(ft )(F) TO-66 9 (0.9) 0.14 Thermal Resistivity (P) 56 (C)(in.)/watt TO-220 8 (0.9) 0.50 0.19 (4.8) stud x 0.44 (11.2) hex 15 (1.7) 0.16 Bleed, % after 24 hrs 200C 0.5 0.25 (6.4) stud x 0.69 (17.5) hex 30 (3.39) 0.10 Evaporation, % after 24 hrs 200C 0.5 0.38 (9.7) stud x 1.06 (26.9) hex 75 (8.47) 0.07 Color opaque white 0.50 (12.7) stud x 1.06 (26.9) hex 125 (14.12) 0.07 Shelf life 5 years 0.75 (19.1) stud x 1.25 (31.8) hex 600 (67.79) 0.052 Operating Temperature Range (C) -40/+200 120 SERIES - ORDER GUIDE Series - Container Size P/N 120-SA s 4 gram plastic pak 120-2 s 2 oz (0.06 kg) jar 120-5 s 5 oz (0.14 kg) tube 120-8 s 8 oz (0.23 kg) jar 120-80 s 5 lb (2.27 kg) can 120-320 20 lb (9.08 kg) can The 126 Series is a nontoxic, synthetic, ester-based (nonsilicone) Thermal Joint Compound with metal oxide 126 SERIES fillers designed to enhance thermal performance characteristics of plastic and metal package devices exceeding that of silicone-based compounds. Solved are problems associated with contamination of wave solder baths and migration of silicone-based products. Shelf life: 5 years. 126 SERIES - ORDER GUIDE 126 SERIES THERMAL JOINT COMPOUND Series - Characteristics Description Container Size P/N Appearance Smooth, white homogeneous paste 126-2 s 2 oz (0.6 kg) jar Solids Content, wt % 65% min 2 126-4 4 oz (0.11 kg) tube Thermal Conductivity at 36C = 4.8 (Btu)(in.)/(hr) (ft ) (F) 19.0 X 10e 4 cal/sec cm C, min 126-4S 4 oz (0.11 kg) syringe Interface Thermal Resistance 0.043C/W TO-3 at 0.0008 thick film 126-5LB 5 lb (2.27 kg) can Bleed, 24 hrs at 200C, wt% 0.09% max Evaporation, 24 hrs at 200C, wt% 0.6 max Volume Resistivity 2.3 x 10e 12 ohms/cm Dielectric Strength 200 volts/mil Specific Gravity 60F 2.93 (gm/cc) Penetration 280 to 320 Operating Range -40C to 200C All other products, please contact factory for price, delivery, and minimums. G Normally stocked 69Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS DeltaBond 152 adhesive is ideal for general cementing thermally bonding semiconductors and components to DeltaBond 152 chassis or heat sinks, while electrically isolating one from the other fabricating heat sinks or thermal links and for all permanent bonding of assemblies which require high thermally conductive interfaces. It produces a rigid, high strength bond to most materials when cured. DeltaBond 152 is available in bi-packs, kits, and quarts. Order one bottle of hardener A-4 or B-4 per one quart of DeltaBond 152 separately. Shelf life: 152KA 1 year, all others 2 years. DELTABOND152 DELTABOND152 Characteristics Hardener Type Mixing Proportions and Working Properties Typical Properties Fully Cured A4 B-4 Characteristics A-4 B4 Thermal conductivity - Parts of hardener per 100 parts of resin by weight 7.5 3.5 W/(m) (K) 0.836 0.908 2 (Btu) (in.)/(hr) (ft ) (F) 5.8 6.3 *Working Time - at 77F 45 min 30 min Thermal resistivity - (C) (in.)watt 47 42 Initial cure time 77F 8 hrs 6 hrs Bond shear strength 77F 2,900 2,300 150F 45 min 30 min 1 in. overlap - psi 125F 2,200 2,000 250F 20 min 15 minn etched aluminum to etched aluminum 212F 400 800 Post-cure time at a temp in F 4 hrs 200F 4 hrs 200F Heat distortion point - F 130 225 Alternate room temp. aging 4 days 4 days Minimum dielectric strength, time at 77F v/mil, 0.125 in. sample 400 400 Working consistency (77F) viscous liquid paste Max operation Continuous 65 150 temp - C Intermittent 100 190 Working viscosity (77F) cps 25,000 DELTABOND152 Ordering Guide - Resin and Hardener Model Resin Hardener Number Part No. Container Part Number 152-1A Bi-Pack (1 oz) Included in PIN 152-1 A (A-4) Type DeltaBond 152 152-1B Bi-Pack (1 oz) Included in P/N 152-1 B (B-4) Type All hardener 152-KA Kit (7 oz Resin, 0.5 oz Hardener) lncluded in P/N 152-KA part numbers 152-Q 1 quart (4 lbs) A-4 (0.316 lb), B-4 (0.14 lb), (order 1 only) A-4, B-4 NOTES: * Since the hardener/resin reaction is exothermic, it is important that batch size be matched to hardener speed. Working times given are for approximate batch sizes: A200 gms, B200 gms. Larger batch sizes will greatly reduce working time. ** For optimum electrical properties, dry parts for 15 minutes at 150F (65C) or 30 minutes at 75F (24C) to slowly evaporate the thinner and then final cure for 4 hours at 275F (135C). After initial cure, material may be handled, removed from fixture, etc., but has not yet achieved full properties and should be room temperature aged or post-cured as shown to achieve full physical and electrical properties. After initial cure, material may be brought to full physical and electrical properties during post-cure or may be room temperature aged for charted length of time to achieve same full properties. The information contained herein is based on data believed to be reliable but we do not assume responsibility for accuracy. All such information is used at the customer s own risk, conditions of use being beyond our control. THERMAL INTERFACE MATERIAL DATA FOR T-SERIES AND S-SERIES T-Series Thermal Ta p e s come Thermal Resistivity Manufacturer Material Degc in. Watt Thickness Description Reference double-sided, and can be attached T-1 79 0.006 Thermal Tape Chomerics T-405 at the factory. Clips or mechanical T-2 55 0.0045 Thermal Tape Adhesives Research Arclad 8223 fasteners are not required when T-3 28 0.009 Thermal Tape Chomerics T-412 thermal tapes are used. Not to be T-4 157 0.007 Thermal Tape Chomerics T-410 used for electrical isolation. S-Series Thermal Interface Material Thermal Resistivity Manufacturer Material Degc in. Watt Thickness Description Reference come double-sided, and are applied S-3 25 0.005 Thermal Interface Bergquist Q-pad 3 at the factory only. They fill gaps due S-4 11 0.005 Thermal Interface Bergquist softface to surface roughness and flatness S-5 15 0.0055 Thermal Interface Chomerics T-710 either under pressure or at tempera- S-6 19 0.0052 Phase-Change Pad Chomerics T-443 ture. These products also require S-7 6 0.003 Tape a/Alum. Sub. Power Devices AI-S (Thermstrate) mechanical fasteners. Not to be used S-8 25 0.0065 Phase-Change Pad Bergquist 2004 for electrical isolation. All other products, please contact factory for price, delivery, and minimums. G Normally stocked 70