X-On Electronics has gained recognition as a prominent supplier of 667-20ABPPE Heat Sinks across the USA, India, Europe, Australia, and various other global locations. 667-20ABPPE Heat Sinks are a product manufactured by Wakefield. We provide cost-effective solutions for Heat Sinks, ensuring timely deliveries around the world.

667-20ABPPE Wakefield

667-20ABPPE electronic component of Wakefield
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Part No.667-20ABPPE
Manufacturer: Wakefield
Category: Heat Sinks
Description: Heat Sinks Labor-Saving SpeedClip Heat Sink for Vertical Mount for TO220, Plain Pin, 50.8mm
Datasheet: 667-20ABPPE Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 2.5987 ea
Line Total: USD 2.6 
Availability - 383
Ship by Wed. 27 Nov to Fri. 29 Nov
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
898
Ship by Fri. 29 Nov to Thu. 05 Dec
MOQ : 10
Multiples : 10
10 : USD 3.5175
50 : USD 3.465
100 : USD 3.4125
175 : USD 3.36
350 : USD 2.52
525 : USD 2.3494
700 : USD 2.31

383
Ship by Wed. 27 Nov to Fri. 29 Nov
MOQ : 1
Multiples : 1
1 : USD 2.5987
10 : USD 2.4255
25 : USD 2.2523
100 : USD 2.1714
250 : USD 2.1021
350 : USD 2.0097
1050 : USD 1.9289
2800 : USD 1.9289
5250 : USD 1.9058

805
Ship by Fri. 29 Nov to Thu. 05 Dec
MOQ : 20
Multiples : 10
20 : USD 4.3037
50 : USD 4.2395
100 : USD 4.1753
180 : USD 4.1111
350 : USD 3.0833

   
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the 667-20ABPPE from our Heat Sinks category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the 667-20ABPPE and other electronic components in the Heat Sinks category and beyond.

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WTS001 p1-25 6/14/07 10:54 AM Page 22 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 2 Surface Mount Heat Sinks D PAK, TO-220, SOT-223, SOL-20 217 SERIES Compatible with surface mount technology (SMT) automated production techniques for ease of assembly and a vari- ety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increas- ing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers component thermal specifications. FEATURES AND BENEFITS: No interface material is needed Copper with matte tin plating for improved solderability and assembly Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for Tape & Reel and Tube formats EIA standards and ESD protection are specified Can be used with water soluble or no clean SMT solder creams or other pastes Height Above Footprint Thermal Performance at Typical Load Standard PC Board Dimensions Package Package Natural Forced P/N in. (mm) in. (mm) Format Quantity Convection Convection) 217-36CTE6 .360 (9.1) .600 (15.2) x .740 (18.8) Bulk 1 55C 1W 16.0C/W 200 LFM 217-36CTTE6 .360 (9.1) .600 (15.2) x .740 (18.8) Tube 20 55C 1W 16.0C/W 200 LFM 217-36CTRE6 .360 (9.1) .600 (15.2) x .740 (18.8) Tape & Reel 250 55C 1W 16.0C/W 200 LFM Material: Copper, Matte Tin Plated MECHANICAL DIMENSIONS 217 HEAT SINK WITH THERMAL PERFORMANCE DDPAK DEVICE 6 LAYER BOARD, D PAK 125C LEAD, 40C AMBIENT 217-36CT6 Device Power Dissipation. W KEY: Device only, NC Device + HS, NC Device + HS, 100 lfm Device + HS, 200 lfm Device + HS, 300 lfm SECTION A-A NOTES TAPE DETAILS 1. Material to be ESD 2. Approximately 6 Meters per Reel 3. 250 Pieces per Reel. 217-36CTR6 REEL DETAILS Dimensions: in. 22 Device Tab dT, CWTS001 p1-25 6/14/07 10:54 AM Page 23 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 2 Surface Mount Heat Sinks 217 SERIES D PAK, TO-220, SOL-20 MECHANICAL DIMENSIONS BOARD LAYOUT RECOMMENDATIONS 217 SERIES TUBE DETAILS TUBE: 16.25 Inches Long, Min. ESD Material with Nail Stops 20 Pieces per Tube 217-36CTT6 SOL 20 REF: JEDEC TO-263 (DD PAK) 217-36CT6 REF: JEDEC MO-169 (DD PAK) Dimensions: in. Surface Mount Heat Sink 218 SERIES SMT Devices Height Above Maximum Standard PC Board Footprint Thermal Performance at Typical Load P/N in. (mm) in. (mm) Natural Convection Forced Convection 218-40CTE3 .40 (10.2) .90 (22.9) x .315 (8.0) 62C rise 2W 21C/W 200LFM 218-40CTE5 .40 (10.2) 1.03 (26.2) x .50 (12.7) 62C rise 2W 21C/W 200LFM Material: Copper, Matte Tin Plated MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS AIR VELOCITY (LFM) 0 200 400 600 800 1000 100 25 80 20 60 15 40 10 20 5 0 0 0 200 400 600 800 1000 0.5 1.0 1.5 2.0 2.5 HEAT DISSIPATED (WATTS) Solid line = 218-40CT5 Dashed Line = 218-40CT3 218-40CT3 218-40CT5 23 HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) THERMAL RESISTANCE SINK TO AMBIENT (C)

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:
Wakefield Engineering
WAKEFIELD SOLUTIONS
WAKEFIELD THERMAL
Wakefield Thermal Solutions
Wakefield Thermal Solutions, Inc.
Wakefield-Vette
Wakefield-Vette, Inc
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